Shielding cover, communication module and intelligent terminal

Abstract

The utility model relates to a shielding cover, a communication module and an intelligent terminal, the shielding cover is arranged on a printed circuit board, the printed circuit board is provided with a chip and a shielding frame, the shielding cover and the shielding frame are matched to form a shielding space, and the chip is located in the shielding space. A heat conduction piece protruding towards the direction of the chip is arranged on a cover body of the shielding cover, the heat conduction piece comprises a flat plate part, a supporting part and a connecting part which are sequentially connected, the flat plate part is attached to the chip, the connecting part is connected with the cover body, and the supporting part is a curved surface. According to the shielding cover provided by the invention, the supporting part is configured to be the curved surface and has a certain elastic deformation capability, so that interference fit can be realized during assembly to ensure that pressure is not increased to damage the chip while the flat plate part is completely attached to the chip, and thus the heat conduction efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of cover technology, and in particular to a shielding cover, a communication module and a smart terminal. Background Art

[0002] With the evolution of automobile intelligence and networking, the computing power and hardware of processors are developing rapidly, and more and more complex and diverse electronic systems are entering the car. The number of ECUs and the amount of data interaction in the car are increasing exponentially, which puts higher requirements on the bandwidth of the vehicle network. In-vehicle communication requires that control instructions can still reach the execution party in a timely and accurate manner under the condition of large amounts of data transmission while meeting the transmission of cameras, sensors, and audio and video. As a result, the vehicle telematic control unit module has developed into today's 5G application era, with richer functions, increasing power consumption of the module, and increasing heat generated during operation. How to effectively conduct the heat generated by the built-in integrated circuit chip to the surface of the module is a major challenge faced by the module heat dissipation design. The quality of the heat dissipation design has a significant impact on the service life and performance of the module. At present, some chips are cooled by setting a heat sink, which puts a lot of pressure on the chip. When there is an error in the size design, it is easy to damage the chip or fail to fit the chip completely, and the defect rate is high. Utility Model Content

[0003] The present application provides a shielding cover, a communication module and a smart terminal to solve the problem that the heat sink is easily damaged by the chip and cannot ensure complete adhesion with the chip.

[0004] In a first aspect, the present application provides a shielding cover, which is arranged on a printed circuit board. A chip and a shielding frame are provided on the printed circuit board. The shielding cover cooperates with the shielding frame to form a shielding space. The chip is located in the shielding space. A heat conductive part protruding toward the chip is provided on the cover body of the shielding cover. The heat conductive part includes a flat plate portion, a supporting portion and a connecting portion connected in sequence. The flat plate portion is attached to the chip, the connecting portion is connected to the cover body, and the supporting portion is a curved surface.

[0005] According to the shielding cover of the present application, it is characterized in that the heat conducting member comprises a plurality of the supporting portions, the plurality of the supporting portions are arranged at intervals along the circumference of the flat plate portion, and the plurality of the supporting portions protrude in directions away from each other.

[0006] Optionally, the flat plate portion, the supporting portion and the connecting portion are integrally formed.

[0007] Optionally, the flat plate portion, the supporting portion and the connecting portion are connected in sequence with a smooth transition.

[0008] According to the shielding cover of the present application, a plurality of positioning protrusions are provided on the cover body, and the plurality of positioning protrusions are arranged along the circumference of the heat conducting member.

[0009] According to the shielding cover of the present application, an assembly part is provided on the circumference of the cover body, at least one clamping portion is provided on the assembly part, and at least one clamping groove is provided on the cover body, and the clamping groove is clamped with the clamping portion.

[0010] The shielding cover according to the present application is characterized in that the material of the heat conducting member is one of an aluminum alloy and a copper alloy.

[0011] According to the shielding cover of the present application, the heat conducting member is connected to the cover body by welding or gluing.

[0012] In a second aspect, the present application provides a communication module, comprising the above-mentioned shielding cover.

[0013] In a third aspect, the present application provides a smart terminal, comprising the above-mentioned communication module.

[0014] The above technical solution provided by the embodiment of the present application has the following advantages compared with the prior art:

[0015] In the shielding cover provided in the embodiment of the present application, the flat plate portion of the heat conductive member fits with the chip, so that heat can be transferred between the flat plate portion and the chip. The flat plate portion can be fixed to the cover body through the support portion and the connecting portion and heat can be transferred to the cover body, so that the heat conductive member and the cover body are used to dissipate heat for the chip. The support portion is configured as a curved surface, which has a certain elastic deformation ability and can avoid stress concentration. It can be interference fit during assembly to ensure that the flat plate portion is fully fitted with the chip without increasing pressure to damage the chip, thereby improving the heat conduction efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings herein are incorporated in and constitute a part of the specification, illustrate embodiments consistent with the present utility model, and together with the description, are used to explain the principles of the present utility model.

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the utility model or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0018] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0019] Figure 1 A cross-sectional view of a shielding cover provided in an embodiment of the present application;

[0020] Figure 2 An exploded view of a cover body and a heat conducting member of a shielding cover provided in an embodiment of the present application;

[0021] Figure 3 An assembly diagram of a cover body and a heat conducting member of a shielding cover provided in an embodiment of the present application;

[0022] Figure 4 A three-dimensional diagram of a heat-conducting member of a shielding cover provided in an embodiment of the present application;

[0023] Figure 5 A partial structure of a shielding cover provided by one embodiment of the present application;

[0024] Figure 6 A partial structure of a shielding cover provided in another embodiment of the present application.

[0025] Description of reference numerals:

[0026] Printed circuit board 1 , chip 10 , shielding frame 20 , cover body 30 , assembly part 31 , clamping part 32 , heat conducting member 40 , flat plate part 41 , supporting part 42 , connecting part 43 . DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0028] The disclosure below provides many different embodiments or examples for realizing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present invention. In addition, the present invention may repeat reference numbers and / or letters in different examples. This repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed.

[0029] For ease of description, spatial relative terms may be used herein to describe the relative positional relationship or movement of one element or feature relative to another element or feature as shown in the figure, such as "inside", "outside", "inner side", "outer side", "below", "below", "above", "above", "front", "back", etc. Such spatial relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figure. For example, if the device in the figure undergoes a position flip or a posture change or a motion state change, then these directional indications also change accordingly, for example: an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented as "above other elements or features" or "above other elements or features". Therefore, the example term "below..." may include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions) and the spatial relative descriptors used herein are interpreted accordingly.

[0030] like Figure 1 , Figure 4-Figure 6 As shown, according to the shielding cover of the embodiment of the present application, the shielding cover is arranged on the printed circuit board 1, and the printed circuit board 1 is provided with a chip 10 and a shielding frame 20, the shielding cover cooperates with the shielding frame 20 to form a shielding space, the chip 10 is located in the shielding space, and a heat conducting member 40 protruding toward the chip 10 is provided on the cover body 30 of the shielding cover, and the heat conducting member 40 includes a flat plate portion 41, a supporting portion 42 and a connecting portion 43 connected in sequence, the flat plate portion 41 is attached to the chip 10, the connecting portion 43 is connected to the cover body 30, and the supporting portion 42 is a curved surface.

[0031] In detail, the flat plate portion 41 of the heat conducting member 40 fits with the chip 10, allowing heat transfer between the flat plate portion 41 and the chip 10, and the flat plate portion 41 can be fixed on the cover body 30 through the support portion 42 and the connection portion 43 and transfer heat with the cover body 30. The flat plate portion 41 increases the heat conduction area between the chip 10 and the cover body 30, and the heat conducting member 40 and the cover body 30 are used to dissipate heat for the chip 10, thereby improving the heat dissipation efficiency. The support portion 42 is configured as a curved surface and has a certain elastic deformation ability, and can adjust the contact height with the chip 10, so as to ensure that the flat plate portion 41 is completely fitted with the chip 10 through an interference fit during assembly without increasing pressure to damage the chip 10, thereby ensuring the heat conduction efficiency.

[0032] It should be noted that the shape and size of the flat plate portion 41 are usually adapted to the chip 10, that is, when the shape of the chip 10 is circular, the shape of the flat plate portion 41 is circular or square, when the shape of the flat plate portion 41 is circular, the diameter of the flat plate portion 41 is greater than or equal to the diameter of the chip 10, when the shape of the flat plate portion 41 is square, the width and length of the flat plate portion 41 are greater than or equal to the diameter of the chip 10, to ensure that the flat plate can cover the chip 10, wherein the square can be a square or a rectangle. When the shape of the chip 10 is square, when the shape of the flat plate portion 41 is circular, the diameter of the flat plate portion 41 is greater than the width and length of the chip 10, when the shape of the flat plate portion 41 is square, the width of the flat plate portion 41 is greater than the width of the chip 10, and the length of the flat plate portion 41 is greater than the length of the chip 10. Of course, the present application is not limited, and the shape of the flat plate portion 41 can also be a polygon, etc.

[0033] It can be understood that in order to improve the stability of the flat plate portion 41 on the cover body 30, the support portion 42 can be one, and the support portion 42 extends along the circumference of the flat plate portion 41, thereby increasing the connection range between the support portion 42 and the flat plate portion 41, or there can be multiple support portions 42, and multiple support portions 42 are arranged along the circumference of the flat plate portion 41.

[0034] In addition, the shielding cover of the present application can be applied to a module, and the module can specifically be a wireless communication module, such as any one of a 2G communication module, a 3G communication module, a 4G communication module, a 5G communication module, a NB-IOT communication module, etc.

[0035] In addition, the support portion 42 may be a single curved surface, a double curved surface or other curved surface structures. In a specific embodiment, the support portion 42 is formed as a single curved surface, so that the processing and forming of the heat conducting member 40 can be simplified while meeting the structural requirements of the support portion 42 .

[0036] According to the shielding cover of the embodiment of the present application, the elastic deformation ability of the support portion 42 can be utilized to ensure that the flat plate portion 41 of the heat conductive member 40 and the cover body 30 can be completely in contact with the chip 10 when assembled with the chip 10 without increasing the pressure on the chip 10, thereby ensuring the heat conduction efficiency and avoiding damage to the chip 10.

[0037] like Figure 5 As shown, in some embodiments, the heat conductor 40 includes a plurality of support portions 42, which are arranged at intervals along the circumference of the flat plate portion 41, and the plurality of support portions 42 protrude in a direction approaching each other, and can be arranged as needed without limitation in this application.

[0038] In detail, the support portion 42 includes a plurality of support portions 42, which are arranged at intervals along the circumference of the flat plate portion 41. In this way, each support portion 42 can be more easily deformed, and the plurality of support portions 42 protrude in directions away from each other. The plurality of support portions 42 protrude in directions away from each other, which can make the support portions 42 squeezed toward the outside under pressure, and the deformation range is larger, which makes it easier to offset the pressure of the interference fit and prevent damage to the chip 10.

[0039] In some embodiments, the heat conducting member 40 includes a plurality of connecting portions 43 , and the plurality of connecting portions 43 correspond to the plurality of supporting portions 42 one by one.

[0040] Specifically, the connecting part 43 includes a plurality of connecting parts 43, and the plurality of connecting parts 43 correspond one-to-one to the plurality of supporting parts 42. In this way, each connecting part 43 is set to correspond one-to-one to the supporting part 42, and a separate connecting part 43 can be connected and fixed to a separate supporting part 42, and there must be gaps between the plurality of connecting parts 43, which can further facilitate the deformation of the supporting part 42.

[0041] like Figure 4 As shown, in some embodiments, the flat plate portion 41, the supporting portion 42 and the connecting portion 43 are integrally formed.

[0042] In detail, since the support portion 42 will be elastically deformed under pressure during the assembly and use of the interference fit, the flat plate portion 41, the support portion 42 and the connecting portion 43 are integrally formed, which can enhance the connection strength between the flat plate portion 41 and the support portion 42, and between the support portion 42 and the connecting portion 43, thereby enhancing the overall structural strength of the heat conductor 40. In addition, the processing technology of the heat conductor 40 can be simplified, and the heat conductor 40 can be formed by using a simple bending process using a sheet metal part, which can reduce the processing cost.

[0043] like Figure 4 As shown, in some embodiments, the flat plate portion 41, the supporting portion 42 and the connecting portion 43 are connected in sequence with smooth transition.

[0044] It can be understood that based on the integral molding of the flat plate portion 41, the supporting portion 42 and the connecting portion 43, the flat plate portion 41, the supporting portion 42 and the connecting portion 43 are connected in sequence with smooth transitions, which can avoid stress concentration at the connection between the flat plate portion 41 and the supporting portion 42, avoid stress concentration at the connection between the supporting portion 42 and the connecting portion 43, and can improve the overall structural strength of the heat conductor 40.

[0045] like Figure 5 and Figure 6As shown, according to the shielding cover of the embodiment of the present application, an assembly part 31 is provided on the circumference of the cover body 30, the assembly part 31 is snap-connected with the cover body 30, at least one snap-connecting portion 32 is provided on the assembly part 31, and at least one snap-connecting groove is provided on the cover body 30, which is snap-connected with the snap-connecting portion 32.

[0046] In detail, the circumference of the cover body 30 is provided with an assembly part 31, and the assembly part 31 and the cover body 30 are engaged by engaging with the engaging groove and the engaging portion 32, thereby simplifying the assembly and making the structure of the cover body 30 more stable and reliable.

[0047] The assembly part 31 may have one clamping part 32 or multiple clamping parts 32. When multiple clamping parts 32 are provided on the assembly part 31, the structures of the multiple clamping parts 32 may be configured in one form or in multiple different forms. For example, the clamping part 32 may be configured as a convex bulge (such as Figure 6 as shown) or bent out into a hook shape (as shown Figure 5 shown).

[0048] According to the shielding cover of the embodiment of the present application, the material of the heat conducting member 40 is one of an aluminum alloy and a copper alloy.

[0049] It is understandable that metal parts have high thermal conductivity, especially aluminum alloy and copper alloy. At the same time, aluminum alloy and copper alloy also have good deformation ability. Therefore, the thermal conductor 40 is configured as one of aluminum alloy and copper alloy, which can improve the thermal conductivity while taking into account the deformation ability of the thermal conductor 40.

[0050] like Figure 2 and Figure 3 As shown, according to the shielding cover of the embodiment of the present application, the heat conductive member 40 is connected to the cover body 30 by welding or gluing. In this way, while increasing the reliability of the connection between the heat conductive member 40 and the cover body 30, the connection and fixing assembly process between the heat conductive member 40 and the cover body 30 can be simplified.

[0051] In some embodiments, a plurality of positioning protrusions are provided on the cover body 30, and the plurality of positioning protrusions are arranged along the circumference of the heat conductive member 40. Thus, when the heat conductive member 40 is assembled onto the cover body 30, the positioning protrusions can be used to pre-position the cover body 30 to avoid misalignment with the chip 10 caused by misalignment of the heat conductive member 40 during installation.

[0052] The communication module according to the embodiment of the present application includes the above-mentioned shielding cover.

[0053] According to the communication module of the embodiment of the present application, the shielding cover can utilize the elastic deformation ability of the supporting portion 42 to ensure that the flat plate portion 41 of the heat conducting member 40 and the cover body 30 can be completely in contact with the chip 10 when assembled with the chip 10 without increasing the pressure on the chip 10. While ensuring the heat conduction efficiency, it avoids damage to the chip 10, thereby extending the service life of the communication module.

[0054] It should be noted that the communication module provided in the embodiment of the present application may be a module capable of realizing a communication function or a terminal device including the module, etc. The terminal device may be a mobile terminal or a smart terminal. The mobile terminal may be at least one of a mobile phone, a tablet computer, a laptop computer, etc.

[0055] According to an embodiment of the present application, the intelligent terminal includes the above-mentioned communication module.

[0056] According to the intelligent terminal of the embodiment of the present application, the communication module can utilize the elastic deformation ability of the support portion 42 to ensure that the flat plate portion 41 of the heat conductor 40 and the cover body 30 can be completely in contact with the chip 10 when assembled with the chip 10 without increasing the pressure on the chip 10. While ensuring the heat conduction efficiency, the chip 10 is prevented from being damaged. The communication module can improve the performance of the intelligent terminal while extending its life and improving its performance.

[0057] In the shielding cover provided in the embodiment of the present application, the flat plate portion 41 of the heat conducting member 40 is in contact with the chip 10, so that heat transfer can occur between the flat plate portion 41 and the chip 10. The flat plate portion 41 can be fixed to the cover body 30 through the support portion 42 and the connecting portion 43, and heat transfer can occur with the cover body 30, so that the heat conducting member 40 and the cover body 30 are used to dissipate heat for the chip 10. The support portion 42 is configured as a curved surface with a certain elastic deformation ability, and can be interference fit during assembly to ensure that the flat plate portion 41 is fully in contact with the chip 10 without increasing pressure to damage the chip 10, thereby improving the heat conduction efficiency.

[0058] It should be noted that the smart terminal provided in the embodiment of the present application can specifically be a terminal containing a wireless communication module, such as a smart car, a smart watch, a shared bicycle, and a smart cabinet.

[0059] It should be understood that the terms used herein are only for the purpose of describing specific example embodiments and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "one", "an" and "" as used herein may also be meant to include plural forms. The terms "include", "comprise", "contain", and "have" are inclusive and therefore specify the presence of stated features, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, steps, operations, elements, parts, and / or combinations thereof. The method steps, processes, and operations described herein are not interpreted as necessarily requiring them to be performed in the specific order described or illustrated, unless the execution order is clearly indicated. It should also be understood that additional or alternative steps may be used.

[0060] Although the terms first, second, third, etc. can be used in the text to describe multiple elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer or section from another region, layer or section. Unless the context clearly indicates, terms such as "first", "second" and other numerical terms do not imply order or sequence when used in the text. Therefore, the first element, component, region, layer or section discussed below can be referred to as the second element, component, region, layer or section without departing from the teaching of the example embodiments.

[0061] The above are only specific embodiments of the present invention, so that those skilled in the art can understand or implement the present invention. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features applied herein.

Claims

1. A shielding cover, the shielding cover is arranged on a printed circuit board, the printed circuit board is provided with a chip and a shielding frame, the shielding cover cooperates with the shielding frame to form a shielding space, the chip is located in the shielding space, characterized in that: The shielding cover has a heat conducting member protruding toward the chip on the cover body. The heat conducting member includes a flat plate portion, a supporting portion and a connecting portion connected in sequence. The flat plate portion is attached to the chip, the connecting portion is connected to the cover body, and the supporting portion is a curved surface.

2. The shielding cover according to claim 1, characterized in that: The heat conducting member includes a plurality of the supporting portions, the plurality of the supporting portions are arranged at intervals along the circumferential direction of the flat plate portion, and the plurality of the supporting portions protrude in directions away from each other.

3. The shielding cover according to claim 2, characterized in that: The flat plate portion, the supporting portion and the connecting portion are integrally formed.

4. The shielding cover according to claim 3, characterized in that: The flat plate portion, the supporting portion and the connecting portion are connected in a smooth transition sequence.

5. The shielding cover according to claim 1, characterized in that: The cover body is provided with a plurality of positioning protrusions, and the plurality of positioning protrusions are arranged along the circumference of the heat conducting member.

6. The shielding cover according to claim 1, characterized in that: An assembly part is arranged on the circumference of the cover body, at least one clamping part is arranged on the assembly part, at least one clamping groove is arranged on the cover body, and the clamping groove is clamped with the clamping part.

7. The shielding cover according to any one of claims 1 to 6, characterized in that: The material of the heat conducting member is one of aluminum alloy and copper alloy.

8. The shielding cover according to any one of claims 1 to 6, characterized in that: The heat conducting member is connected to the cover body by welding or gluing.

9. A communication module, characterized in that: Comprising the shielding cover as described in any one of claims 1-8.

10. An intelligent terminal, characterized in that: Comprising the communication module as claimed in claim 9.

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