LED packaging shell with high temperature resistance

Abstract

The utility model discloses an LED packaging shell with high temperature resistance, relates to the technical field of LED packaging, and comprises a packaging shell, a lamp groove arranged in the packaging shell and used for accommodating an LED wafer, and an electrode layer arranged at the bottom of the lamp groove, the packaging shell comprises a first packaging shell and a second packaging shell which are connected with each other, the first packaging shell is close to the LED wafer, and the second packaging shell is close to the LED wafer. The second packaging shell is far away from the LED wafer, and the heat resistance coefficient of the first packaging shell is higher than that of the second packaging shell. According to the utility model, the packaging shell is split and designed into the first packaging shell and the second packaging shell with different heat resistance coefficients by adopting a combined design thought, and the heat resistance of the first packaging shell and the second packaging shell is matched with the heat distribution trend of the LED wafer, so that the whole packaging shell has stronger high-temperature resistance and higher reliability. And meanwhile, the materials of the first packaging shell and the second packaging shell are flexibly selected, so that the heat-resistant effect is ensured, and the production cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of LED packaging, in particular to an LED packaging shell with high temperature resistance. Background Art

[0002] LED mainly includes key components such as LED chip, package shell and electrode layer. The LED chip is packaged inside the LED package shell, and the packaging glue is used to seal it to ensure that it can work stably and reliably inside the shell. Existing LED chips will generate a certain amount of heat during continuous operation. If the high temperature resistance of the LED package shell is insufficient, the package shell may deform or even break in a high temperature environment, which will undoubtedly affect the overall reliability of the LED package and the performance of the LED chip. Summary of the invention

[0003] The utility model provides an LED packaging shell with high temperature resistance, and its main purpose is to solve the problems existing in the prior art.

[0004] The utility model adopts the following technical solutions:

[0005] An LED package shell with high temperature resistance comprises a package shell, a lamp trough arranged in the package shell for accommodating an LED chip, and an electrode layer arranged at the bottom of the lamp trough, wherein the package shell comprises a first package shell and a second package shell connected to each other, wherein the first package shell is close to the LED chip, and the second package shell is far away from the LED chip, and the heat resistance coefficient of the first package shell is higher than the heat resistance coefficient of the second package shell.

[0006] Furthermore, the first packaging shell is disposed above the electrode layer, and the second packaging shell is disposed above the first packaging shell.

[0007] Furthermore, the first packaging shell is arranged above the electrode layer, and the second packaging shell is sleeved on the outside of the first packaging shell.

[0008] Furthermore, the first packaging shell is provided with a first annular boss extending toward the outside of the lamp slot, and the bottom of the second packaging shell is in contact with the first annular boss.

[0009] Furthermore, the second packaging shell is provided with a second annular boss extending toward the inner side of the lamp groove, and the top of the first packaging shell is in contact with the second annular boss.

[0010] Furthermore, the first packaging shell is provided with at least one recessed portion, and the second packaging shell is provided with a protruding point matched with the recessed portion.

[0011] Furthermore, a plurality of heat dissipation bumps are provided on the outer sides of the first packaging shell and / or the second packaging shell.

[0012] Furthermore, the side wall of the lamp trough is in a trumpet shape that gradually expands from bottom to top.

[0013] Furthermore, the first packaging shell and the second packaging shell are formed by injection molding using different materials.

[0014] Compared with the prior art, the beneficial effects of the present invention are:

[0015] 1. The utility model adopts a combined design concept to split the packaging shell into a first packaging shell and a second packaging shell with different heat resistance coefficients, and the heat resistance of the first packaging shell and the second packaging shell matches the heat distribution trend of the LED chip. Therefore, the packaging shell as a whole has stronger high temperature resistance and higher reliability.

[0016] 2. In the utility model, the first packaging shell and the second packaging shell are respectively provided with a first annular boss and a second annular boss. This design enhances the structural stability of the packaging shell. When subjected to external force impact or temperature changes, since the first packaging shell and the second packaging shell are tightly connected by the annular boss, the packaging shell can maintain a stable structural form and is not prone to deformation or cracking.

[0017] 3. In the present invention, a plurality of heat dissipation bumps are arranged on the outer side of the first packaging shell and / or the second packaging shell, which increases the heat dissipation area of ​​the packaging shell and helps to further improve the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the packaging shell structure of Example 1 of the utility model.

[0019] Figure 2 This is a schematic diagram of the packaging shell structure of Example 2 of the utility model.

[0020] Figure 3 This is a schematic diagram of the packaging shell structure of Example 3 of the present utility model.

[0021] In the figure: 1-first packaging shell; 11-recess; 12-first annular boss; 2-second packaging shell; 21-bump; 22-second annular boss; 3-LED chip; 4-lamp trough; 5-electrode layer; 6-heat dissipation bump. DETAILED DESCRIPTION

[0022] The specific implementation of the present invention is described below with reference to the accompanying drawings. In order to fully understand the present invention, many details are described below, but for those skilled in the art, the present invention can be implemented without these details.

[0023] Embodiment 1:

[0024] Reference Figure 1, an LED package shell with high temperature resistance, including a package shell, a lamp trough 4 arranged in the package shell for accommodating an LED chip 3, and an electrode layer 5 arranged at the bottom of the lamp trough 4, the package shell includes a first package shell 1 and a second package shell 2 connected to each other, the first package shell 1 is close to the LED chip 3, the second package shell 2 is far away from the LED chip 3, and the heat resistance coefficient of the first package shell 1 is higher than the heat resistance coefficient of the second package shell 2. Since the heat in the package shell is mainly concentrated at the bottom of the lamp trough 4, the first package shell 1 close to the LED chip 3 is set to have a higher heat resistance coefficient in this embodiment, so that it has a stronger high temperature resistance ability and reduces the risk of heat cracking. Since the second package shell 2 is far away from the LED chip 3, it is less affected by heat, so its heat resistance coefficient can be less than the heat resistance coefficient of the first package shell 1, thereby reducing the production cost. It can be seen that this embodiment adopts a combined design idea to split the package shell into a first package shell 1 and a second package shell 2 with different heat resistance coefficients, and the heat resistance performance of the first package shell 1 and the second package shell 2 matches the heat distribution trend of the LED chip 3, so the package shell as a whole has a stronger high temperature resistance ability and higher reliability.

[0025] Reference Figure 1 The first packaging shell 1 is arranged above the electrode layer 5, and the second packaging shell 2 is arranged above the first packaging shell 1. The first packaging shell 1 has a high heat resistance coefficient and can directly provide efficient heat protection when arranged above the electrode layer 5. At the same time, the second packaging shell 2 is arranged above the first packaging shell 1 to work together to further improve the heat resistance of the entire packaging shell.

[0026] Reference Figure 1 The first packaging shell 1 is provided with at least one recess 11, and the second packaging shell 2 is provided with a convex point 21 adapted to the recess 11. The cooperation between the recess 11 and the convex point 21 ensures the precise alignment between the first packaging shell 1 and the second packaging shell 2, and also improves the connection stability between the two packaging shells.

[0027] Reference Figure 1 A plurality of heat dissipation bumps 6 are disposed on the outer sides of the first packaging shell 1 and the second packaging shell 2, which increases the heat dissipation area of ​​the packaging shell and is beneficial to further improve the heat dissipation effect.

[0028] Reference Figure 1 The side wall of the lamp slot 4 is in a trumpet shape that gradually expands from bottom to top. This design can not only ensure that the encapsulation glue fully fills the entire lamp slot 4 to avoid bubbles or gaps, but also effectively guide the light emitted by the LED chip 3 to achieve uniform diffusion of the light.

[0029] Reference Figure 1The first packaging shell 1 and the second packaging shell 2 are made of different materials by injection molding. By injection molding different materials, they have different heat resistance properties, improve design flexibility, and meet diverse needs.

[0030] Reference Figure 1 Since the heat of the LED chip 3 in the lamp trough 4 is distributed in a gradually decreasing trend from the inside to the outside and from the bottom to the top, the volume of the first packaging shell 1 in this embodiment is significantly larger than the volume of the second packaging shell 2, thereby ensuring that the heat resistance of different parts of the packaging shell matches the heat distribution trend of the LED chip 3, thereby improving the design rationality and reliability of the packaging shell.

[0031] Embodiment 2:

[0032] Reference Figure 2 , which is different from the first embodiment, in this embodiment, the first package shell 1 is arranged above the electrode layer 5, and the second package shell 2 is sleeved on the outside of the first package shell 1. Since the LED chip 3 inside the lamp trough 4 accumulates more heat, arranging the first package shell 1 inside the lamp trough 4 can effectively improve the heat resistance and reduce the risk of the package shell being broken by heat. The outside of the lamp trough 4 is far away from the LED chip 3 and is less affected by heat, so the material with a lower heat resistance coefficient can meet normal needs.

[0033] Reference Figure 2 The first encapsulation shell 1 is provided with a first annular boss 12 extending toward the outside of the lamp trough 4, and the bottom of the second encapsulation shell 2 abuts against the first annular boss 12. The design of the first annular boss 12 makes the connection between the second encapsulation shell 2 and the first encapsulation shell 1 tighter and more stable, thereby enhancing the connection stability between the two. In addition, since the heat in the encapsulation shell is mainly concentrated at the bottom of the lamp trough 4, the first annular boss 12 is provided on the first encapsulation shell 1, which can further improve the heat resistance of the bottom of the encapsulation shell, making the overall structure of the encapsulation shell more reasonable and reliable.

[0034] Reference Figure 2 Since the heat of the LED chip 3 in the lamp trough 4 is distributed in a trend of gradually decreasing from the inside to the outside and from the bottom to the top, the first packaging shell 1 in this embodiment is designed to have a trapezoidal structure with a cross-section that gradually decreases in volume from the bottom to the top, and the second packaging shell 2 is correspondingly designed to have a trapezoidal structure with a cross-section that gradually increases in volume from the bottom to the top, thereby matching the heat resistance of different parts of the packaging shell with the heat distribution trend of the LED chip 3, thereby further improving the design rationality and reliability of the packaging shell.

[0035] Embodiment three:

[0036] Reference Figure 3, which is different from the second embodiment, in this embodiment, the second encapsulation shell 2 is provided with a second annular boss 22 extending toward the inner side of the lamp groove 4, and the top of the first encapsulation shell 1 abuts against the second annular boss 22. By adding the design of the second annular boss 22, a stable interlocking structure is formed between the first encapsulation shell 1 and the second encapsulation shell 2, which effectively prevents the deformation or displacement of the encapsulation shell when subjected to external force, thereby enhancing the overall structural stability of the encapsulation shell.

[0037] The above is only a specific implementation method of the utility model, but the design concept of the utility model is not limited to this. Any non-substantial changes to the utility model using this concept shall be deemed as an infringement of the protection scope of the utility model.

Claims

1. An LED package with high temperature resistance, comprising a package, a lamp trough arranged in the package for accommodating an LED chip, and an electrode layer arranged at the bottom of the lamp trough, characterized in that: The package shell includes a first package shell and a second package shell connected to each other, the first package shell is close to the LED chip, the second package shell is far away from the LED chip, and the heat resistance coefficient of the first package shell is higher than the heat resistance coefficient of the second package shell.

2. The LED package with high temperature resistance according to claim 1, characterized in that: The first packaging shell is disposed above the electrode layer, and the second packaging shell is disposed above the first packaging shell.

3. The LED package with high temperature resistance according to claim 1, characterized in that: The first packaging shell is arranged above the electrode layer, and the second packaging shell is sleeved on the outside of the first packaging shell.

4. The LED package with high temperature resistance according to claim 2 or 3, characterized in that: The first packaging shell is provided with a first annular boss extending toward the outside of the lamp slot, and the bottom of the second packaging shell is in contact with the first annular boss.

5. The LED package with high temperature resistance as claimed in claim 2 or 3, characterized in that: The second packaging shell is provided with a second annular boss extending toward the inner side of the lamp groove, and the top of the first packaging shell is in contact with the second annular boss.

6. The LED package with high temperature resistance according to claim 1, characterized in that: The first packaging shell is provided with at least one concave portion, and the second packaging shell is provided with a convex point matched with the concave portion.

7. The LED package with high temperature resistance according to claim 1, characterized in that: A plurality of heat dissipation bumps are arranged on the outer sides of the first packaging shell and / or the second packaging shell.

8. The LED package with high temperature resistance according to claim 1, characterized in that: The side wall of the lamp trough is in a trumpet shape that gradually expands from bottom to top.

9. The LED package with high temperature resistance according to claim 1, characterized in that: The first packaging shell and the second packaging shell are formed by injection molding using different materials.

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