Epoxy encapsulating machine for piezoresistor production

Abstract

The utility model discloses an epoxy encapsulating machine for piezoresistor production, which comprises an epoxy resin loading tank and a pressure-sensitive chip conveying mechanism, the pressure-sensitive chip conveying mechanism comprises two oppositely arranged mounting plates, a screw rod is rotatably connected between the two mounting plates, one of the mounting plates is fixedly provided with a control motor for controlling the screw rod to rotate, and the other mounting plate is fixedly provided with a motor for controlling the screw rod to rotate. A screw rod is arranged on the two mounting plates, the screw rod is in threaded connection with a mounting seat, the mounting seat is provided with an air cylinder, the output end of the air cylinder faces downwards and is in transmission connection with a clamping mechanism, a liquid level sensor is fixedly arranged on the clamping mechanism, two sliding rods in sliding connection with the clamping mechanism are fixedly connected between the two mounting plates, and the liquid level sensor is electrically connected with the air cylinder. The liquid level sensor is fixedly arranged on the clamping mechanism, the distance between the liquid level sensor and the epoxy resin liquid level can be monitored in real time, and signals are transmitted to the air cylinder, so that the air cylinder can control the clamping mechanism to reach the position with the fixed distance from the liquid level every time, and the uniformity of encapsulated products is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of varistor production equipment production, in particular to an epoxy encapsulation machine for varistor production. Background Art

[0002] In a certain step of varistor production, the components need to be encapsulated with epoxy resin. During the epoxy resin maintenance process, each round of products will consume part of the epoxy resin in the epoxy resin loading pool, and the liquid level will decrease. The different immersion depths will cause different pressures of the epoxy resin liquid during the encapsulation process, which can easily cause differences between different batches of products.

[0003] For example, a Chinese patent with patent number CN 111584256 A discloses an epoxy encapsulating machine, which includes a main body, an epoxy resin box is arranged inside the main body, a hanger is arranged on the top of the epoxy resin box, and sliders are connected to the two sides of the hanger, wherein a slide groove is provided on the side of the main body close to the slider, a screw rod groove is provided on the side of the main body close to the slide groove, a screw rod is arranged inside the screw rod groove, a driven gear is connected to the bottom of the screw rod, a groove is provided on the side of the main body close to the driven gear, and a driving gear is arranged on the left part of the driven gear. Although the epoxy encapsulating machine can control the immersion of the load into the epoxy resin pool and the descending distance thereof, it cannot intelligently monitor and control the depth of the load immersed in the epoxy resin liquid, and is prone to the problem of different immersion depths. Utility Model Content

[0004] Purpose of the utility model:

[0005] In order to overcome the problems existing in the prior art, the utility model provides an epoxy encapsulation machine for varistor production, which solves the problem that the epoxy encapsulation machine in the prior art cannot intelligently monitor and control the depth of the immersed load in the epoxy resin liquid, and is prone to different immersion depths.

[0006] In order to solve the above problems, the utility model adopts the following technical solutions:

[0007] An epoxy encapsulation machine for varistor production includes an epoxy resin loading tank and a varistor chip conveying mechanism. The varistor chip conveying mechanism includes two mounting plates arranged opposite to each other, a screw rod rotatably connected between the two mounting plates, a control motor for controlling the rotation of the screw rod is fixedly arranged on one of the mounting plates, the screw rod is threadedly connected to a mounting seat, a cylinder is arranged on the mounting seat, the output end of the cylinder is downwardly connected to a clamping mechanism in a transmission manner, a liquid level sensor is fixedly arranged on the clamping mechanism, two sliding rods slidably connected to the clamping mechanism are also fixedly connected between the two mounting plates, and the liquid level sensor is electrically connected to the cylinder.

[0008] Preferably, the clamping mechanism includes a first sliding component and a second sliding component slidably connected to the first sliding component, the first sliding component includes a plurality of first clamping plates equidistantly arranged along its length direction and a sliding groove arranged along its length direction, the second sliding component includes a plurality of second clamping plates arranged corresponding to the first clamping plates, and a slider slidably connected in the sliding groove, and the clamping mechanism also includes a control motor that controls the second sliding component to slide along the sliding groove to adjust the corresponding distance between the first clamping plate and the second clamping plate.

[0009] Preferably, rubber pads are provided on the inner sides of the first clamping plate and the second clamping plate.

[0010] Preferably, the number of the first clamping plates and the second clamping plates is greater than or equal to five.

[0011] Preferably, the height of the bottom of the liquid level sensor is higher than the height of the top of the pressure sensitive chip after being clamped by the clamping mechanism.

[0012] Beneficial effects: Compared with the prior art, the utility model has the following advantages:

[0013] By fixing a liquid level sensor on the clamping mechanism, the liquid level sensor can monitor the distance between the clamping mechanism and the epoxy resin liquid surface in real time as the clamping mechanism rises and falls, and transmit the signal to the cylinder, so that the cylinder can control the clamping mechanism to reach a fixed distance from the epoxy resin liquid surface each time, thereby improving the uniformity of the product after encapsulation. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a three-dimensional diagram of the utility model;

[0015] Figure 2 It is an enlarged stereoscopic view of the clamping mechanism of the utility model;

[0016] Figure 3 It is a cutaway three-dimensional view of the clamping mechanism of the utility model. Figure 1 ;

[0017] Figure 4 It is a cutaway three-dimensional view of the clamping mechanism of the utility model. Figure 2 ;

[0018] Description of figure markings:

[0019] 1. Epoxy resin loading tank; 2. Pressure-sensitive chip conveying mechanism; 22. Screw; 24. Mounting seat; 25. Cylinder; 26. Liquid level sensor; 27. Clamping mechanism; 271. First sliding assembly; 2711. First clamping plate; 2712. Slide groove; 2713. Control motor; 272. Second sliding assembly; 2721. Second clamping plate; 2722. Sliding block; 28. Sliding rod. DETAILED DESCRIPTION

[0020] All features disclosed in this specification, or steps in all methods or processes disclosed, except mutually exclusive features and / or steps, can be combined in any manner.

[0021] Any feature disclosed in this specification (including any additional claims, abstracts and drawings), unless otherwise stated, may be replaced by other equivalent or alternative features with similar purposes. That is, unless otherwise stated, each feature is only an example of a series of equivalent or similar features.

[0022] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below with reference to the accompanying drawings.

[0023] like Figure 1-4 As shown, an epoxy encapsulation machine for varistor production includes an epoxy resin loading tank 1 and a varistor chip conveying mechanism 2. The varistor chip conveying mechanism 2 includes two mounting plates arranged opposite to each other, a screw 22 is rotatably connected between the two mounting plates, a control motor for controlling the rotation of the screw 22 is fixedly arranged on one of the mounting plates, the screw 22 is threadedly connected to a mounting seat 24, a cylinder 25 is arranged on the mounting seat, the output end of the cylinder 25 is downwardly connected to a clamping mechanism 27, a liquid level sensor 26 is fixedly arranged on the clamping mechanism, two sliding rods 28 slidably connected to the clamping mechanism 27 are also fixedly connected between the two mounting plates, and the liquid level sensor 26 is electrically connected to the cylinder 25. By fixing the liquid level sensor on the clamping mechanism, the liquid level sensor can monitor the distance between the clamping mechanism and the epoxy resin liquid surface in real time as the clamping mechanism rises and falls, and transmit the signal to the cylinder, so that the cylinder can control the clamping mechanism to reach a fixed distance from the page every time, thereby improving the uniformity of the encapsulated product.

[0024] In this embodiment, the clamping mechanism includes a first sliding component 271 and a second sliding component 272 slidably connected to the first sliding component 271. The first sliding component 271 includes a plurality of first clamping plates 2711 equidistantly arranged along its length direction and a sliding groove 2712 arranged along its length direction. The second sliding component 272 includes a plurality of second clamping plates 2721 arranged corresponding to the first clamping plates 2711 and a slider 2722 slidably connected in the sliding groove. The clamping mechanism also includes a control motor 2713 that controls the second sliding component 272 to slide along the sliding groove to adjust the distance between the corresponding first clamping plates 2711 and the second clamping plates 2721.

[0025] The control motor 2713 controls the second clamping plate 2721 to move relative to the first clamping plate 2711 to adjust the distance between the first clamping plate 2711 and the second clamping plate 2721. When the slider 2722 moves to one end of the slide slot 2712, the first clamping plate 2711 and the second clamping plate 2721 just fix the pressure sensitive chip.

[0026] In this embodiment, rubber pads are disposed on the inner side of the first clamping plate 2711 and the inner side of the second clamping plate 2721 to prevent the pressure-sensitive chip from being damaged due to rigid clamping.

[0027] In this embodiment, the number of the first clamping plates 2711 and the second clamping plates 2721 is greater than or equal to five.

[0028] In this embodiment, the height of the bottom of the liquid level sensor 26 is higher than the height of the top of the pressure sensitive chip after being clamped by the clamping mechanism 27, so that when the pressure sensitive chip is immersed in the epoxy resin liquid, the liquid level sensor 26 contacts the epoxy resin liquid and is damaged.

[0029] The purpose of the above embodiments is to exemplarily reproduce and deduce the technical solution of the utility model, and to fully describe the technical solution, purpose and effect of the utility model. Its purpose is to make the public understand the disclosed content of the utility model more thoroughly and comprehensively, and it does not limit the protection scope of the utility model.

[0030] The above embodiments are not exhaustive enumerations based on the present invention, and there may be multiple other implementations not listed. Any replacement and improvement made without violating the concept of the present invention shall fall within the protection scope of the present invention.

Claims

1. An epoxy encapsulation machine for varistor production, characterized in that: The invention comprises an epoxy resin loading tank (1) and a pressure-sensitive chip conveying mechanism (2). The pressure-sensitive chip conveying mechanism (2) comprises two mounting plates arranged opposite to each other, a screw rod (22) being rotatably connected between the two mounting plates, a control motor for controlling the rotation of the screw rod (22) being fixedly arranged on one of the mounting plates, the screw rod (22) being threadedly connected to a mounting seat (24), a cylinder (25) being arranged on the mounting seat, the output end of the cylinder (25) being downwardly directed and transmission-connected to a clamping mechanism (27), a liquid level sensor (26) being fixedly arranged on the clamping mechanism, two sliding rods (28) being slidably connected to the clamping mechanism (27) being fixedly connected between the two mounting plates, and the liquid level sensor (26) being electrically connected to the cylinder (25).

2. The epoxy encapsulation machine for varistor production according to claim 1, characterized in that: The clamping mechanism includes (27) a first sliding component (271) and a second sliding component (272) slidably connected to the first sliding component (271), the first sliding component (271) including a plurality of first clamping plates (2711) equidistantly arranged along its length direction, and a sliding groove (2712) arranged along its length direction, the second sliding component (272) including a plurality of second clamping plates (2721) arranged corresponding to the first clamping plates (2711), and a slider (2722) slidably connected in the sliding groove, and the clamping mechanism also includes a control motor (2713) for controlling the second sliding component (272) to slide along the sliding groove to adjust the distance between the corresponding first clamping plates (2711) and the second clamping plates (2721).

3. The epoxy encapsulation machine for varistor production according to claim 2, characterized in that: Rubber pads are provided on the inner side of the first clamping plate (2711) and the inner side of the second clamping plate (2721).

4. The epoxy encapsulation machine for varistor production according to claim 2, characterized in that: The number of the first clamping plates (2711) and the second clamping plates (2721) is greater than or equal to five.

5. An epoxy encapsulation machine for varistor production according to claim 1 or 2, characterized in that: The height of the bottom of the liquid level sensor (26) is higher than the height of the top of the pressure sensitive chip after it is clamped by the clamping mechanism (27).

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