Device for welding wire to substrate
By designing automated wire welding devices, and using automated solder supply and melting of suppliers and heaters, the problems of inconsistent welding quality and low production efficiency in traditional manual welding processes are solved, and high-precision, high-speed and low-cost welding production is achieved.
Patent Information
- Application Number
- CN202421809034.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-29
- Publication Date
- 2025-02-28
- Estimated Expiration
- 2034-07-29
AI Technical Summary
Traditional manual wire welding processes are difficult to achieve strict consistency and efficient production of welding quality, and there are problems such as poor accuracy, low efficiency, unstable quality, environmental pollution and health risks.
An automation device is designed, including a supplier and a heater, to achieve automated solder supply and melting through a first vertical rail, reduce dependence on operators, and simplify production processes through a rail system.
It achieves improvements in welding accuracy and consistency, improves production efficiency, reduces costs, reduces dependence on operators, and improves the working environment.
Smart Images
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Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of automated production, and in particular to a device for welding a wire to a substrate. Background Art
[0002] Wire welding to substrate is a key technology in the field of microelectronic packaging, and is widely used in the manufacturing process of substrate products such as integrated circuits, sensors, and micro-electromechanical systems. The process involves precisely welding tiny wires to substrate chips or ceramic substrates to achieve electrical connections. This process is critical to ensuring the performance and reliability of substrate devices, and also places extremely high demands on welding accuracy and consistency.
[0003] The traditional wire welding process mainly relies on manual operation. The operator uses solder wire and soldering iron to weld, and manually controls parameters such as welding position, solder joint size, and welding temperature. Although this manual welding method has certain flexibility, it is limited by the operator's technical level and stability, and it is difficult to achieve the strict requirements for welding quality in large-scale production.
[0004] Specifically: manual operation is difficult to ensure the consistency and accuracy of solder joints, and the position and size of solder joints are easily affected by human factors, resulting in reduced product yield; manual welding is slow and not suitable for mass production needs, and operators are prone to fatigue after working for a long time, further affecting welding quality and efficiency; since welding quality is highly dependent on the operator's experience and skills, there may be significant differences in welding quality between different operators and between the same operator at different time points; during manual welding, the smoke from the solder wire may affect the health of the operator and also pollute the working environment; due to insufficient welding precision, excessive use of solder is often used, increasing material costs. Utility Model Content
[0005] To solve the above technical problems, the embodiments of the present disclosure are intended to provide a device for welding a wire to a substrate, so as to achieve automated and high-precision welding, thereby improving production efficiency, reducing costs, ensuring product quality, and reducing dependence on operators.
[0006] The technical solution of the present disclosure is achieved as follows:
[0007] An embodiment of the present disclosure provides a device for welding a wire to a substrate, the device comprising:
[0008] a supplier for supplying solder to the substrate in a processing position;
[0009] a heater for melting the solder supplied to the substrate to solder the wire to the substrate, the heater being fixedly disposed relative to the supplier;
[0010] A first vertical guide rail is used to guide the supply device and the heater to move between an operating position and an idle position, wherein the supply device is adjacent to the processing position for supplying the solder and the heater is adjacent to the processing position for melting the solder, and wherein the supply device and the heater are away from the processing position for the substrate to reach and leave the processing position in a horizontal direction.
[0011] The disclosed embodiment provides a device for welding a wire to a substrate. Through the automated solder supply of a supplier, the amount of solder paste used for each welding can be ensured to be accurate, avoiding the problem of inconsistent solder amount commonly seen in manual operation. This precise control not only improves the consistency of solder joints, but also significantly improves the welding accuracy, ensuring the performance and reliability of substrate devices. The automated solder supply and melting process reduces the dependence on operators, making the production process smoother and more efficient. Compared with traditional manual welding, faster welding speeds and higher outputs can be achieved to meet the needs of large-scale production. The supplier and the heater are able to move quickly between the operating position and the idle position through a first vertical guide rail, simplifying the production process and reducing waiting time in production. This design not only improves production efficiency, but also reduces production costs. Since the heater is fixedly arranged relative to the supplier and the two move synchronously, the device simplifies the complexity of controlling the moving parts. This fixed relationship reduces the coordination requirements for multiple independent moving parts, reduces the risk of mechanical failure, and improves the stability and reliability of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Figure 1 is a schematic diagram of an apparatus for welding a wire to a substrate according to an embodiment of the present disclosure;
[0013] Figure 2 for Figure 1 A partial enlarged view of the circled area in FIG.
[0014] Figure 3 is a schematic diagram of a component for feeding a device for welding a wire to a substrate according to an embodiment of the present disclosure;
[0015] Figure 4 is a schematic diagram of a component for blanking of an apparatus for welding a wire to a substrate according to an embodiment of the present disclosure;
[0016] Figure 5FIG. 4 is a schematic diagram of a component for conveying a wire of an apparatus for welding a wire to a substrate according to an embodiment of the present disclosure. DETAILED DESCRIPTION
[0017] In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present disclosure.
[0018] In the field of microelectronic packaging, the technology of welding wires to substrates is crucial. It is not only related to the electrical connection and performance of substrate products such as integrated circuits, sensors, and micro-electromechanical systems, but also has extremely high requirements for welding accuracy and consistency. However, the manual welding method of the existing technology has many shortcomings, such as poor accuracy, low efficiency, unstable quality, environmental pollution and health risks, and material waste. These problems seriously restrict the improvement of production efficiency and product quality.
[0019] In the face of these challenges, the present disclosure proposes an innovative technical solution that aims to overcome the limitations of existing technologies through automation and precise control. The technical solution of the present disclosure can not only improve the accuracy and consistency of welding, but also significantly improve production efficiency, reduce dependence on operators, reduce material costs, and improve the working environment.
[0020] Specifically, see Figure 1 and Figure 2 The embodiment of the present disclosure provides a device 1 for welding a wire L to a substrate S, where the substrate S may be a semiconductor chip, specifically, for example, an alumina ceramic sheet used as a substrate material in a semiconductor packaging process, and the device 1 may include:
[0021] A supply device 10 is used to supply solder 11 to a substrate S in a processing position, such as in Figure 2 As more clearly shown in FIG. 1 , in addition, the solder 11 here may be, for example, solder paste, and the supplier 10 here may be, for example, a syringe, so that the amount of solder paste supplied is controlled by the amount of movement of the piston of the syringe in the cylinder, thereby achieving precise control of the amount of solder paste;
[0022] A heater 20, the heater 20 is used to melt the solder 11 supplied to the substrate S to solder the wire L to the substrate S, the heater 20 is fixedly arranged relative to the supplier 10, and the heater 20 here can be, for example, a soldering iron;
[0023] A first vertical guide rail 30 is used to guide the supplier 10 and the heater 20 to move between a working position and an idle position. In the working position, the supplier 10 is adjacent to the processing position to facilitate supplying the solder 11 and the heater 20 is adjacent to the processing position to facilitate melting the solder 11. In the idle position, the supplier 10 and the heater 20 are away from the processing position to facilitate the substrate S to reach and leave the processing position in a horizontal direction.
[0024] Through the automated solder supply of the supplier 10, it is possible to ensure that the amount of solder paste used for each welding is accurate, such as solder paste, and avoid the problem of inconsistent solder amount common in manual operation. This precise control not only improves the consistency of solder joints, but also significantly improves the welding accuracy, ensuring the performance and reliability of the substrate device. The automated solder supply and melting process reduces the dependence on operators, making the production process smoother and more efficient. Compared with traditional manual welding, it can achieve faster welding speed and higher output to meet the needs of large-scale production. The supplier 10 and the heater 20 can move quickly between the operating position and the idle position through the first vertical guide rail 30, which simplifies the production process and reduces the waiting time in production. This design not only improves production efficiency, but also reduces production costs. Since the heater 20 is fixed relative to the supplier 10 and the two move synchronously, the device 1 simplifies the complexity of controlling the moving parts. This fixed relationship reduces the coordination requirements for multiple independent moving parts, reduces the risk of mechanical failure, and improves the stability and reliability of the equipment.
[0025] For the device 1 according to the present disclosure, in a possible embodiment, see Figure 1 The device 1 may also include a first horizontal guide rail 40, which is used to guide the first vertical guide rail 30 to move between a first horizontal position and a second horizontal position. In the first horizontal position, the supplier 10 is vertically aligned with the processing position to facilitate the supply of solder 11. In the second horizontal position, the heater 20 is vertically aligned with the processing position to facilitate the melting of the solder 11.
[0026] By introducing the first horizontal guide rail 40, the welding process can be further optimized. Specifically, the use of the first horizontal guide rail 40 enables the supplier 10 and the heater 20 to be precisely aligned with the processing position in the vertical direction. Guided by the first horizontal guide rail 40, the supplier 10 and the heater 20 can move smoothly between different horizontal positions, which increases the flexibility of operation and enables the equipment to adapt to the welding requirements of substrates S of different sizes and shapes. The coordinated movement of the supplier 10 and the heater 20 allows the solder supply and melting process to be seamlessly connected, optimizes the production process, reduces the non-production time in production, and improves the overall production efficiency.
[0027] For the device 1 according to the present disclosure, in a possible embodiment, see Figure 1 The device 1 may further include a second horizontal guide rail 50, which is used to guide the substrate S to move from the non-processing position to the processing position.
[0028] The introduction of the second horizontal guide rail 50 enables the substrate S to be automatically moved from the non-processing position to the processing position. This automated movement process reduces the need for manual handling and significantly improves production efficiency. The automated guide rail system avoids damage or placement errors that may occur during manual handling, thereby reducing product quality problems caused by improper human operation. The second horizontal guide rail 50 ensures the stability and accuracy of the substrate S during movement, so that each substrate S can accurately reach the predetermined processing position, providing an accurate positioning basis for subsequent welding work.
[0029] For the device 1 according to the present disclosure, in a possible embodiment, see Figure 3 , the device 1 may further include:
[0030] A vertical material pipe 60;
[0031] A carrier 61 below the material tube 60, the carrier 61 being arranged relative to the material tube 60 such that when a plurality of substrates S stacked in a single row are carried by the carrier 61, a single substrate S is not accommodated in the material tube 60;
[0032] The pushing member 70 is configured to move between an extended position and a retracted position. In the process of moving from the retracted position to the extended position, the pushing member 70 pushes the single substrate S to the above-mentioned non-processing position. In the retracted position, the pushing member 70 does not hinder the substrate S contained in the material tube 60 from falling.
[0033] Through the reciprocating movement of the pusher 70, the substrates S in the material tube 60 can be continuously pushed to the non-processing position one by one, ensuring the continuous supply of the substrates S during the production process and avoiding production stagnation caused by interruption of material supply. The substrates S naturally fall to the support member 61 in the material tube 60 due to gravity. This process does not require an additional power source, simplifies the equipment structure, and reduces energy consumption. The rapid reciprocating movement of the pusher 70, combined with the natural fall of the substrates S, realizes the rapid supply of the substrates S and significantly improves production efficiency. The automated pushing and falling process reduces the dependence on operators, reduces the possibility of human operating errors, and also improves the working environment.
[0034] In addition, as in Figure 3As shown in the figure, the number of the material tubes 60 may be two or more. After all the substrates S in one material tube 60 are pushed to the non-processing position, two or more material tubes 60 may be rotated so that another material tube 60 containing the substrate S is above the carrier 61.
[0035] In addition, as in Figure 3 As shown in FIG. 1 , the device 1 may further include a placement slot 71, and the pusher 70 pushes the substrate S into the placement slot 71 to place the substrate S in a non-processing position. In this case, the second horizontal guide rail 50 may guide the placement slot 71 to move the substrate S placed in the placement slot 71 from the non-processing position to the processing position, so that the substrate S is placed in the placement slot 71 and is in the processing position. In addition, the second horizontal guide rail 50 may also guide the placement slot 71 without the substrate S placed therein to return after the processing is completed to receive the substrate S pushed by the pusher 70.
[0036] For the device 1 according to the present disclosure, in a possible embodiment, see Figure 4 , the device 1 may further include:
[0037] A conveyor belt 80, which is used to transport the substrate S placed on the conveyor belt 80 away from the device 1;
[0038] A suction cup 90, which is used to absorb the substrate S in the processing position and to place the absorbed substrate S on the conveyor belt 80;
[0039] A second vertical guide rail 100, the second vertical guide rail 100 is used to guide the suction cup 90 to move between a first height position and a second height position, wherein the suction cup 90 is adjacent to the processing position for absorbing the substrate S, and the suction cup 90 is adjacent to the conveyor belt 80 for placing the substrate S at the second height position;
[0040] The third horizontal guide rail 110 is used to guide the second vertical guide rail 100 to move between a first alignment position and a second alignment position. In the first alignment position, the suction cup 90 is vertically aligned with the processing position to facilitate the adsorption of the substrate S. In the second alignment position, the suction cup 90 is vertically aligned with the conveyor belt 80 to facilitate the placement of the substrate S.
[0041] The conveyor belt 80 enables the substrate S that has been welded to automatically leave the device 1, realizing automated transportation, reducing the need for manual handling, and improving production efficiency. After the welding process is completed, the substrate S can quickly leave the device 1 to make room for the processing of the next substrate S, ensuring the continuity of the production process and reducing the risk of production interruption. The suction cup 90 can accurately adsorb the substrate S in the processing position and accurately place the adsorbed substrate S on the conveyor belt 80, ensuring the stability and safety of the substrate S during the transportation process. The use of the second vertical guide rail 100 enables the suction cup 90 to flexibly move between the first height position and the second height position, adapting to processing positions and conveyor belt positions at different heights, and improving the adaptability of the equipment. The guiding effect of the third horizontal guide rail 110 enables the suction cup 90 to accurately move between the first alignment position and the second alignment position, optimizing the spatial layout of the equipment and improving space utilization. The automated suction cup 90 operation reduces the need for manual handling and placement, and reduces the possibility of human operating errors.
[0042] For the device 1 according to the present disclosure, in a possible embodiment, see Figure 5 , the device 1 may further include:
[0043] A wire wheel 120, the wire wheel 120 is used for winding the wire L;
[0044] The roller pair 130 is fixedly arranged relative to the wire wheel 120 and is used to clamp the wire L so that when the roller pair 130 rotates, the wire L is unwound from the wire wheel 120 by rotating the wire wheel 120 and is transported to the substrate S in the processing position.
[0045] The wire wheel 120 is used to wind the wire L, providing a compact and efficient way to store and manage the wires in the system, reducing the possibility of the wires being disorganized and entangled with each other. The roller pair 130 clamps the wire L and rotates, allowing the wire L to be unwound by the rotation of the wire wheel 120, ensuring that the wire L can be delivered to the processing position in a controlled manner, improving the accuracy of wire positioning. The roller pair 130, which is fixed relative to the wire wheel 120, simplifies the wire delivery mechanism, reduces the need for complex transmission systems, and reduces the risk of mechanical failure. Automated wire unwinding and delivery reduces manual intervention and speeds up the supply of wire L to the substrate S, thereby improving overall production efficiency.
[0046] For the device 1 according to the present disclosure, in a possible embodiment, see Figure 5 The device 1 may further include a tensioning wheel 140 , which is used to tension the wire L between the wire wheel 120 and the roller pair 130 .
[0047] The tensioning wheel 140 ensures that the wire L maintains appropriate tension during the transportation process, and avoids the wire L from being loose or swinging during the transportation process, thereby improving the positioning accuracy of the wire L at the processing position. The tensioning wheel 140 applies appropriate tension to the wire L to ensure that the wire L can be continuously unwound from the wire wheel 120 and transported to the processing position through the roller pair 130, avoiding the risk of wire transportation interruption. Appropriate tension can reduce the damage to the wire L caused by excessive bending or stretching during transportation, and extend the service life of the wire. The use of the tensioning wheel 140 improves the transportation performance of the wire L, making the wire L more stable during transportation, and reducing the impact of wire jitter or vibration on welding quality.
[0048] For the device 1 according to the present disclosure, in a possible embodiment, see Figure 5 The device 1 may further include a longitudinal cable management wheel set 150 and a transverse cable management wheel set 160, wherein the longitudinal cable management wheel set 150 is used to eliminate the bending of the wire L in a first plane, and the transverse cable management wheel set 160 is used to eliminate the bending of the wire L in a second plane perpendicular to the first plane.
[0049] The longitudinal wire-straightening wheel set 150 and the transverse wire-straightening wheel set 160 act on different planes of the wire L respectively, ensuring that the wire L is straightened in two vertical directions, eliminating the bending and twisting of the wire L, and improving the straightness of the wire L. The straightened wire L has a higher positioning accuracy when it is transported to the processing position, which is crucial for precision welding operations and ensures the consistency and quality of the welding points. The straightness of the wire L directly affects the shape and quality of the welded joint. By eliminating the bending of the wire L, it helps to form a more uniform and firm welding point. The straightening effect of the wire-straightening wheel set can reduce the damage to the wire L caused by bending or folding during transportation, extend the service life of the wire and reduce material waste. The automated straightening process reduces the need for manual straightening, speeds up the preparation of the wire L, and thus improves production efficiency. The design of the longitudinal wire-straightening wheel set 150 and the transverse wire-straightening wheel set 160 can adapt to wires L of different specifications and materials, providing good adaptability and flexibility.
[0050] For the device 1 according to the present disclosure, in a possible embodiment, see Figure 5 The device 1 may further include a guide member 170 disposed between the roller pair 130 and the substrate S in the processing position, the guide member having a hole 170H, the wire L being conveyed through the hole 170H, and the guide member 170 moves synchronously with the wire L during the conveyance of the wire L, so that the length of the segment of the wire L hanging outside the guide member 170 does not change.
[0051] In this way, ensuring that the wire L remains straight in the suspended state helps to improve the accuracy of the wire L being transported to the processing position, which is crucial for precision welding operations and directly affects the quality and consistency of the welding points. The precise transportation of the wire L makes the welding process more stable and controllable, reduces welding defects caused by wire bending or position deviation, and improves the welding success rate. Since the wire L remains straight in the suspended state, damage and material waste caused by wire bending or folding are reduced, reducing production costs. Automated wire straightening and transportation reduces manual intervention, speeds up the preparation and transportation of the wire L, and improves production efficiency.
[0052] For the device 1 according to the present disclosure, in a possible embodiment, see Figure 5 The device 1 also includes a spring sheet 180, which is used to press the wire L onto the substrate S.
[0053] The spring sheet 180 firmly presses the wire L onto the substrate S, ensuring that the position of the wire L relative to the substrate S is fixed during the welding process, thereby improving the accuracy and consistency of welding.
[0054] The spring 180 may be configured to move synchronously with the supplier 10 and the heater 20 , thereby automatically pressing the wire L onto the substrate S.
[0055] During the welding process, the wire L may be affected by heat or other external forces and move slightly. The use of the spring 180 effectively prevents such movement and ensures the positioning stability of the wire L. The stable positioning of the wire L helps to form a uniform and firm welding joint, avoiding welding defects caused by wire movement, such as cold welding, cold welding or uneven welding. By ensuring the stability of the wire L during the welding process, the welding defect rate caused by inaccurate wire positioning or movement is reduced, and the reliability and market competitiveness of the product are improved. The use of the spring 180 simplifies the wire positioning process before welding, reduces the need for manual adjustment of the wire position, speeds up the welding speed, and improves production efficiency.
[0056] In the aforementioned embodiments of the present disclosure, a cylinder may be used for driving, thereby completing the guidance of the components by the guide rails.
[0057] In the aforementioned embodiments of the present disclosure, the movement guided by the guide rails may be a reciprocating movement, so that the wires L can be welded on the substrates S one after another.
[0058] The above are only specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.
Claims
1. A device for welding a wire to a substrate, characterized in that The device comprises: a supplier for supplying solder to the substrate in a processing position; a heater for melting the solder supplied to the substrate to solder the wire to the substrate, the heater being fixedly disposed relative to the supplier; A first vertical guide rail is used to guide the supply device and the heater to move between an operating position and an idle position, wherein the supply device is adjacent to the processing position for supplying the solder and the heater is adjacent to the processing position for melting the solder, and wherein the supply device and the heater are away from the processing position for the substrate to reach and leave the processing position in a horizontal direction.
2. The device for welding a wire to a substrate according to claim 1, characterized in that The device also includes a first horizontal guide rail, which is used to guide the first vertical guide rail to move between a first horizontal position and a second horizontal position. In the first horizontal position, the supplier is vertically aligned with the processing position to facilitate supplying the solder. In the second horizontal position, the heater is vertically aligned with the processing position to facilitate melting the solder.
3. The device for welding a wire to a substrate according to claim 1 or 2, characterized in that The apparatus further comprises a second horizontal guide rail for guiding the substrate to move from the non-processing position to the processing position.
4. The device for welding a wire to a substrate according to claim 3, characterized in that The device also includes: Vertical tube base; a carrier below the material tube, the carrier being arranged relative to the material tube such that when a plurality of substrates stacked in a single row are carried by the carrier, a single substrate is not accommodated in the material tube; A pushing member is configured to move between an extended position and a retracted position. During the movement from the retracted position to the extended position, the pushing member pushes the single substrate to the non-processing position. In the retracted position, the pushing member does not hinder the substrate contained in the material tube from falling.
5. The device for welding a wire to a substrate according to claim 1 or 2, characterized in that The device also includes: a conveyor belt for conveying the substrate placed on the conveyor belt away from the device; A suction cup, the suction cup is used to absorb the substrate at the processing position and to place the absorbed substrate on the conveyor belt; a second vertical guide rail, the second vertical guide rail being used to guide the suction cup to move between a first height position and a second height position, wherein at the first height position, the suction cup is adjacent to the processing position for absorbing the substrate, and at the second height position, the suction cup is adjacent to the conveyor belt for placing the substrate; A third horizontal guide rail is used to guide the second vertical guide rail to move between a first alignment position and a second alignment position. In the first alignment position, the suction cup is vertically aligned with the processing position to facilitate adsorption of the substrate. In the second alignment position, the suction cup is vertically aligned with the conveyor belt to facilitate placement of the substrate.
6. The device for welding a wire to a substrate according to claim 1 or 2, characterized in that The device also includes: A wire wheel, the wire wheel is used to wind the wire; A pair of rollers is fixedly arranged relative to the wire wheel, and is used to clamp the wire so that when the pair of rollers rotates, the wire is unwound from the wire wheel by rotating the wire wheel and is delivered to the substrate in the processing position.
7. The device for welding a wire to a substrate according to claim 6, characterized in that The device further comprises a tensioning wheel, which is used for tensioning the wire between the wire wheel and the pair of rollers.
8. The device for welding a wire to a substrate according to claim 6, characterized in that The device also includes a longitudinal wire-management wheel set and a transverse wire-management wheel set. The longitudinal wire-management wheel set is used to eliminate the bending of the wire in a first plane, and the transverse wire-management wheel set is used to eliminate the bending of the wire in a second plane perpendicular to the first plane.
9. The device for welding a wire to a substrate according to claim 6, characterized in that The device also includes a guide member arranged between the roller pair and the substrate in the processing position, the guide member having a hole, the wire being conveyed through the hole, and the guide member moving synchronously with the wire during the wire being conveyed, so that the length of the segment of the wire hanging outside the guide member does not change.
10. The device for welding a wire to a substrate according to claim 6, characterized in that The device further comprises an elastic sheet, which is used to press the wire tightly onto the substrate.