Connector structure of through hole backflow process
By designing the connector structure of the through-hole reflow process, using the negative pressure suction nozzle to adsorb and move the base, the high production cost problems caused by manual insertion and cover removal in the prior art are solved, and the effect of reducing costs and improving efficiency is achieved.
Patent Information
- Application Number
- CN202421318146.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-11
- Publication Date
- 2025-02-28
- Estimated Expiration
- 2034-06-11
AI Technical Summary
When welding terminals of existing connectors, manual insertion and cover removal are required, resulting in high labor costs for production.
A connector structure for the through-hole reflow process is designed. The base is a hollow structure, with a socket on the top and a welding terminal on the bottom. The side is equipped with an opening to form an adsorption area. The base is absorbed and moved by a negative pressure suction nozzle, and the manual cover insertion and cover removal process is cancelled.
The suction nozzle adsorbs and moves the base, which reduces production costs, improves production efficiency, and avoids errors and waste of manual operation.
Smart Images
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Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of through-hole reflow technology for plug-in connectors, in particular to a plug-in connector structure for through-hole reflow technology. Background Art
[0002] A connector is also called a connector, which is a device that connects two active devices to transmit current or signals.
[0003] When the existing connectors are soldered to the terminals, a cover needs to be inserted on the base to facilitate the movement and grabbing of the connectors. After SMT mounting and reflow soldering, a manual process of removing the cover needs to be added. As a result, the process of inserting and removing the cover leads to high production labor costs. Therefore, a connector structure for through-hole reflow process is proposed to solve the above problems. Utility Model Content
[0004] The utility model provides a connector structure of a through-hole reflow process, which can solve the problems raised in the background technology.
[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a connector structure for a through-hole reflow process, comprising a base and a terminal, wherein the base is a hollow structure and a socket is provided on the top, the terminal is welded to the bottom of the base, an opening is provided on one side of the base, and an adsorption area is formed together with the opening and the bottom of the inner side of the base, and the adsorption area is used for a negative pressure suction nozzle to adsorb the base.
[0006] Preferably, the length of the opening is 2.0-3.0 cm.
[0007] Preferably, the base is made of high temperature resistant material.
[0008] Preferably, a heat dissipation hole is provided on a side of the base opposite to the opening.
[0009] Preferably, the heat dissipation hole is located at one end of the outer side of the base and is inclined downward.
[0010] Compared with the prior art, the beneficial effects of the utility model are as follows:
[0011] The utility model provides an adsorption area on the base, the base is adsorbed to the suction nozzle under the action of air pressure, and the base is moved to a desired position through the suction nozzle, eliminating the manual process of inserting and removing the cover on the base, and reducing production costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Figure 1 It is a schematic diagram of the overall structure of the utility model;
[0013] Figure 2 This is a schematic diagram of the heat dissipation hole structure of the utility model.
[0014] In the figure: 1. base; 2. terminal; 3. socket; 4. opening; 5. adsorption area; 6. heat dissipation hole. DETAILED DESCRIPTION
[0015] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0016] Embodiment 1
[0017] like Figure 1 As shown, this embodiment provides a connector structure for a through-hole reflow process, including a base 1 and a terminal 2, wherein the base 1 is a hollow structure and a socket 3 is provided on the top, and the terminal 2 is welded to the bottom of the base 1, and is characterized in that an opening 4 is provided on one side of the base 1, and an adsorption area 5 is formed together at the opening 4 and the bottom of the inner side of the base 1, and the adsorption area 5 is used for adsorbing the base 1 with a negative pressure suction nozzle.
[0018] Before SMT mounting and reflow soldering, the base 1 is adsorbed and grasped by a suction nozzle. During the operation of the suction nozzle, first, the suction nozzle is moved to a position above the adsorption area 5 of the base 1, and then the air pressure at the nozzle mouth is controlled at a relatively low level. Under the action of the air pressure, the base 1 is adsorbed to the nozzle mouth, and then the base 1 is moved to the desired position by the suction nozzle.
[0019] As a preferred embodiment, the length of the opening 4 is 2.0-3.0 cm, which makes it convenient for the suction nozzle to adsorb the base 1 in the adsorption area 5 while making the hardness of the base 1 reach a higher level. The size of the opening is set according to the length of the base. When the length of the base is greater than 5 cm, the opening can be set to 3 cm, reserving a wider position to facilitate the insertion of different types of suction nozzles into the opening.
[0020] As a preferred embodiment, the base 1 is made of high temperature resistant material, and UL94V-0 grade LCP material is selected, which can withstand a reflow soldering temperature of 255 degrees, so that the base 1 will not melt during reflow soldering.
[0021] Embodiment 2
[0022] See also Figure 2 The difference between this embodiment and the first embodiment is that a heat dissipation hole 6 is provided on the side of the base 1 opposite to the opening 4. Since the excessive current of the terminal 2 will cause the terminal 2 to heat up, the heat dissipation hole 6 is provided here to cool the terminal 2.
[0023] As a preferred embodiment, one end of the heat dissipation hole 6 located on the outer side of the base 1 is inclined downward to reduce the entry of external dust into the base 1.
[0024] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.
[0025] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A connector structure for through-hole reflow process, comprising a base (1) and a terminal (2), wherein the base (1) is a hollow structure and a socket (3) is provided on the top, and the terminal (2) is welded to the bottom of the base (1), characterized in that: An opening (4) is provided on one side of the base (1), and the opening (4) and the bottom of the inner side of the base (1) together form a suction area (5), and the suction area (5) is used for the negative pressure suction nozzle to suck the base (1).
2. A connector structure for through-hole reflow process according to claim 1, characterized in that: The length of the opening (4) is 2.0-3.0 cm.
3. A connector structure for through-hole reflow process according to claim 1, characterized in that: The base (1) is made of high temperature resistant material.
4. A connector structure for through-hole reflow process according to claim 1, characterized in that: A heat dissipation hole (6) is provided on a side of the base (1) opposite to the opening (4).
5. A connector structure for through-hole reflow process according to claim 4, characterized in that: The heat dissipation hole (6) is located at one end of the outer side of the base (1) and is inclined downward.