High-density machine room heat dissipation system

Abstract

The utility model relates to a high-density machine room heat dissipation system which comprises an outdoor water cooling system, an indoor circulation system and a machine cabinet unit, and the outdoor water cooling system mainly comprises a cooling tower unit, a condenser heat exchange unit and a first driving element and is used for providing cooling capacity for a fluid working medium in the indoor circulation system; the indoor circulation system is mainly composed of a liquid storage device, a working medium flowing pipeline, a second driving element, a microstructure cold head and a flow control element. The cabinet unit mainly comprises a cabinet shell, a mainboard and a heating element, the micro-structure cold head is attached to the heating element, and the heating element is cooled through the micro-structure cold head. Compared with the prior art, heat generated by the heating element is led to the outdoor water cooling system through the indoor circulating system, so that energy consumption can be effectively saved, meanwhile, good heat dissipation performance is guaranteed, uniform distribution of heat dissipation is achieved, and the heat island effect caused by local overheating is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation in a computer room, in particular to a high-density heat dissipation system for a computer room. Background Art

[0002] With the development of technologies such as cloud computing and big data, modern data centers tend to have higher equipment density, that is, deploying more servers in a limited space to improve computing power. High-density deployment significantly increases the heat load per unit area, and puts forward more stringent requirements for heat dissipation. A good heat dissipation solution can support the stable operation of high-density server clusters, make full use of space resources, and reduce the physical space cost of data centers.

[0003] Traditional data centers use air cooling, which has a low initial construction cost, but has low energy utilization and a large noise impact. When large data centers with high power density gradually become mainstream, conventional air cooling has been difficult to meet the ultra-high heat dissipation requirements of data centers due to its low heat dissipation limit. At the same time, due to the differences in heat dissipation requirements between different locations and servers in the computer room, local hot spots may occur. If these hot spots are not properly handled, they may cause individual servers to overheat and affect the stability and reliability of the entire system. It can be said that achieving uniform heat distribution and avoiding the heat island effect is a major difficulty in the current computer room heat dissipation design. How to design a computer room heat dissipation system that saves energy, has stable performance and good compatibility is a common concern of technicians in this field. Summary of the invention

[0004] The purpose of the utility model is to overcome the defects of the above-mentioned prior art and provide a high-density computer room heat dissipation system, which can effectively save energy consumption while ensuring good heat dissipation performance and achieving uniform heat dissipation distribution.

[0005] The purpose of the utility model can be achieved through the following technical solutions: a high-density computer room heat dissipation system, including an outdoor water cooling system, an indoor circulation system and a cabinet unit, the outdoor water cooling system includes a cooling tower unit, a first cooling water inlet pipeline, a first cooling water return pipeline, a condenser heat exchange unit, a second cooling water inlet pipeline, a second cooling water return pipeline and a first driving element, the first cooling water inlet pipeline and the second cooling water inlet pipeline are connected in parallel with the first heat exchange outlet pipeline, the first cooling water return pipeline and the second cooling water return pipeline are connected in parallel with the first heat exchange water inlet pipeline; the cooling tower unit and the condenser heat exchange unit provide cooling water, and the first driving element is used to drive the cooling water inlet pipeline. The indoor circulation system comprises: a liquid reservoir, a first working fluid output pipeline, a first working fluid return pipeline, a second working fluid output pipeline, a second working fluid return pipeline, a second driving element, a microstructure cold head and a flow control element. One side of the liquid reservoir is connected to the heat exchange pipeline, and the other side of the liquid reservoir is connected to the first working fluid pipeline. The second working fluid output pipeline and the second working fluid return pipeline are connected in parallel to the first working fluid output pipeline and the first working fluid return pipeline respectively. The other side of the second working fluid output pipeline and the second working fluid return pipeline is connected to the microstructure cold head. The second driving element is used to drive the working fluid to circulate. The flow control element is used to adaptively adjust the working fluid flow according to the power consumption.

[0006] The cabinet unit comprises a cabinet shell, a cabinet tray, a mainboard, and a heating element. The cabinet tray is placed in parallel and connected to the cabinet shell, the mainboard is placed on the plane of the cabinet tray, and the heating element is fixedly connected to the mainboard.

[0007] Optionally, the motherboard and the heating elements are placed in a server chassis, and the chassis model is selected from 1U, 2U or multi-U in combination with the size of the motherboard and the number of heating elements.

[0008] The microstructure cold head is fitted on the heating element, and a heat-conducting medium is filled between the fitting interface between the microstructure cold head and the heating element. A heat exchange cavity filled with indoor circulating working fluid is provided in the microstructure cold head. The microstructure cold head is also provided with a working fluid inlet and a working fluid outlet of the heat exchange cavity, and the working fluid inlet and the working fluid outlet are respectively connected to the second working fluid output pipeline and the second working fluid return pipeline.

[0009] It can be understood that the working fluid enters the first working fluid output pipeline from the liquid storage tank through the action of the second driving element and is further distributed to the second working fluid output pipeline. It flows into the heat exchange cavity of the microstructure cold head through the second working fluid output pipeline, takes away the heat of the heating element that is in contact with the microstructure cold head, and finally returns to the liquid storage tank through the second working fluid return pipeline and the first working fluid return pipeline, and is cooled under the action of the outdoor water cooling system to complete the heat dissipation cycle.

[0010] Furthermore, the cooling tower unit is specifically one of a wet cooling tower, a dry cooling tower, and a dry-wet cooling tower;

[0011] When the cooling tower is a dry cooling tower or a dry-wet cooling tower, a first heat exchange pipeline is provided, and the first heat exchange pipeline, the first cooling water inlet pipeline and the first cooling water return pipeline form a continuous pipeline;

[0012] The condenser heat exchange unit is connected to a cooling fan to enhance the heat dissipation effect of the condenser unit.

[0013] Furthermore, a first stop valve is provided on the first cooling water inlet pipeline and the first cooling water return pipeline, and a second stop valve is provided on the second cooling water inlet pipeline and the second cooling water return pipeline. The first stop valve and the second stop valve are respectively used to control the on-off of the cooling tower unit and the condenser heat exchange unit pipelines to achieve selective opening of the cooling tower unit and the condenser heat exchange unit.

[0014] Furthermore, the first cooling water inlet pipeline and the second cooling water inlet pipeline are provided with a first driving element, and the first driving element is specifically a volumetric flow pump or a centrifugal flow pump.

[0015] Furthermore, the other ends of the first heat exchange water inlet pipeline and the first heat exchange water outlet pipeline are connected to one side of the heat exchanger, and the other side of the heat exchanger is directly connected to the liquid reservoir through the second heat exchange water inlet pipeline and the second heat exchange water outlet pipeline, and the second heat exchange water inlet pipeline is provided with a third stop valve and a first driving element.

[0016] It can be understood that in one case, the cooling water provided by the cooling tower unit and the condenser heat exchange unit is transported to the isolated heat exchanger through the first driving element, and then exchanges heat with the working fluid in the liquid reservoir through the isolated heat exchanger to achieve cooling of the indoor circulating working fluid.

[0017] Furthermore, a second heat exchange pipeline is provided in the liquid reservoir, and the other ends of the first heat exchange water inlet pipeline and the first heat exchange water outlet pipeline are directly connected to the second heat exchange pipeline to introduce the cold energy provided by the outdoor cooling system into the liquid reservoir.

[0018] It is understandable that, in another case, the cooling water provided by the cooling tower unit and the condenser heat exchange unit is directly input into the second heat exchange pipeline provided in the liquid reservoir, and the outdoor cooling water and the indoor circulating working medium are heat-conducted through the tube wall of the second heat exchange pipeline to reduce the working medium temperature in the liquid reservoir. Furthermore, the liquid reservoir is provided with a temperature detection sensor and a liquid level detection sensor for detecting the working medium temperature and working medium liquid level in the liquid reservoir; when the temperature in the liquid reservoir is higher than the preset value of the liquid storage temperature, or the liquid level is lower than the preset value of the liquid storage level, an alarm is issued.

[0019] Optionally, the liquid reservoir is also provided with a gas pressure relief valve, which plays a role of pressure relief protection when the pressure in the liquid reservoir is too high.

[0020] Furthermore, a temperature monitoring device is connected and installed on the cabinet shell, which is used to monitor and display the real-time temperature of each layer of heating elements in the cabinet shell and is electrically connected to the flow control element.

[0021] Furthermore, when the temperature monitoring device detects that the temperature of the heating element is less than a first preset value, the flow control element is controlled to be in a semi-open state;

[0022] When the temperature monitoring device detects that the temperature of the heating element is greater than or equal to the first preset value and less than or equal to the second preset value, the flow control element is controlled to be in a three-quarter open state;

[0023] When the temperature monitoring device detects that the temperature of the heating element is greater than a second preset value, the flow control element is controlled to be in a fully open state.

[0024] Furthermore, the flow control element is specifically an electronic throttle valve, an electric flow pump or a variable frequency flow pump, and the second driving element is specifically an electric flow pump or a variable frequency flow pump.

[0025] Furthermore, the working fluid is specifically selected from one of ultrapure water, fluorine-containing compounds, and nanofluids.

[0026] Compared with the prior art, the utility model has the following advantages:

[0027] The utility model designs an outdoor water cooling system, an indoor circulation system and a cabinet unit, wherein the outdoor water cooling system mainly includes a cooling tower unit, a condenser heat exchange unit and a first driving element, and provides cooling for the fluid working medium in the indoor circulation system through cooling water circulation; the indoor circulation system mainly includes a liquid reservoir, a working medium flow pipeline, a second driving element, a microstructure cold head and a flow control element; the cabinet unit mainly includes a temperature monitoring device and a heating element, and the microstructure cold head is fittedly installed on each heating element for heat dissipation, thereby leading the heat generated by the heating element to the outdoors through the indoor circulation system, solving the problem of high energy consumption of traditional computer rooms using air conditioners for heat dissipation, and can achieve uniform heat distribution and avoid local overheating causing heat island effect, which is suitable for the heat dissipation needs of high-density computer rooms.

[0028] The utility model designs a cooling tower unit and a condenser heat exchange unit to provide circulating cooling water for an outdoor water cooling system, wherein the cooling tower unit is selected from one of a wet cooling tower, a dry cooling tower, and a dry-wet cooling tower. In a wet cooling tower, hot water is in direct contact with the air; in a dry cooling tower, hot water is not in direct contact with the air, but is heat exchanged with the air through a heat exchanger; a dry-wet cooling tower combines the advantages of wet and dry types and can be used in situations where water quality requirements are high or water conservation is required. Therefore, different types of cooling tower units can be adaptively selected according to different site environments and usage requirements. The condenser heat exchange unit is used as a parallel option because of its low energy consumption and simple structure. The heat dissipation of cooling water can be achieved through water pump circulation and cooling fans. When the working medium temperature inside the reservoir is not high, only turning on the condenser heat exchange unit can supply sufficient cooling capacity, effectively saving energy consumption.

[0029] The utility model adopts insulating fluid as the working fluid, avoiding the risk of leakage of general water cooling systems. At the same time, the heat transfer coefficient of the working fluid is enhanced through the heat dissipation method of the microstructure cold head, which significantly improves the heat removal efficiency of the heating element and solves the heat dissipation problem of high-density cabinets. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 A schematic diagram of the structure of a high-density computer room heat dissipation system provided in Example 1;

[0031] Figure 2 A schematic diagram of the heat exchanger piping structure provided in Example 1;

[0032] Figure 3 A schematic diagram of the structure of an outdoor water cooling system provided in Example 1;

[0033] Figure 4 A schematic diagram of the piping structure of the indoor circulation system provided in Example 2;

[0034] Figure 5 A schematic diagram of the cabinet unit structure provided in Example 3;

[0035] Figure 6 A schematic diagram of the piping structure of the indoor circulation system provided in Example 3;

[0036] Figure 7 A schematic diagram of the piping structure of the indoor circulation system provided in Example 4;

[0037] Figure 8 A schematic diagram of the structure of a high-density computer room heat dissipation system provided in Example 5;

[0038] Fig. 9 This is a schematic diagram of the computer room layout structure provided for Example 6.

[0039] Description of the markings in the figure:

[0040] 100, outdoor water cooling system; 101, cooling tower unit; 102, first heat exchange pipeline; 103, first stop valve; 104, first driving element; 105, first cooling water inlet pipeline; 106, first cooling water return pipeline;

[0041] 111. condenser heat exchange unit; 112. cooling fan; 113. second stop valve; 114. second cooling water inlet pipeline; 115. second cooling water return pipeline;

[0042] 121, first heat exchange water inlet pipeline; 122, first heat exchange water outlet pipeline; 123, heat exchanger; 124, third stop valve; 125, second heat exchange water inlet pipeline; 126, second heat exchange water outlet pipeline;

[0043] 200, indoor circulation system; 201, liquid storage device; 202, second heat exchange pipeline; 203, first working fluid output pipeline; 204, fourth stop valve; 205, second driving element; 206, second working fluid output pipeline; 207, electronic throttle valve; 208, second working fluid return pipeline; 209, first working fluid return pipeline; 210, microstructure cold head;

[0044] 300, cabinet unit; 301, cabinet shell; 302, temperature monitoring device; 303, cabinet tray; 304, mainboard; 305, heating element. DETAILED DESCRIPTION

[0045] The utility model is described in detail below with reference to the accompanying drawings and specific embodiments.

[0046] Embodiment 1

[0047] like Figure 1 to Figure 3 As shown, a high-density computer room heat dissipation system includes:

[0048] The outdoor water cooling system 100 includes: a cooling tower unit 101, a first cooling water inlet pipeline 106, a first cooling water return pipeline 105, a condenser heat exchange unit 111, a second cooling water inlet pipeline 115, a second cooling water return pipeline 145 and a first driving element 104, wherein the first cooling water inlet pipeline 106 and the second cooling water inlet pipeline 115 are connected in parallel to the first heat exchange water outlet pipeline 122, and the first cooling water return pipeline 105 and the second cooling water return pipeline 114 are connected in parallel to the first heat exchange water inlet pipeline 121; the cooling tower unit 101 and the condenser heat exchange unit 111 provide cooling water; the first driving element 104 is used to drive the cooling water to circulate;

[0049] The indoor circulation system 200 includes: a liquid reservoir 201, a first working fluid output pipeline 203, a first working fluid return pipeline 209, a second working fluid output pipeline 206, a second working fluid return pipeline 208, a second driving element 205, a microstructure cold head 210 and a flow control element; one side of the liquid reservoir 201 is connected to the second heat exchange water inlet pipeline 125 and the second heat exchange water outlet pipeline 126, and the other side of the liquid reservoir 201 is connected to the first working fluid output pipeline 206 and the first working fluid return pipeline 208. The second working fluid output pipeline 206 and the second working fluid return pipeline 208 are connected in parallel and are respectively connected to the first working fluid output pipeline 203 and the first working fluid return pipeline 209; the other sides of the second working fluid output pipeline 206 and the second working fluid return pipeline 208 are connected to the microstructure cold head 210; a stop valve can also be provided on the second working fluid return pipeline 208 to further realize the flow on and off of a single cabinet.

[0050] The cabinet unit 300 includes: a cabinet housing 301, a cabinet tray 303, a mainboard 304, and a heating element 305; the cabinet tray 303 is placed in parallel in the cabinet housing 301, and is connected by one or more of a guide rail and a threaded connection; the mainboard 304 is placed on the plane of the cabinet tray 303; the heating element 305 is fixed on the mainboard 304, and the connection method is selected from one or more of a snap connection, a threaded connection, and a slot connection, and the microstructure cold head 210 is fitted on the heating element On 305, a heat-conducting medium is filled between the fitting interface between the microstructure cold head 210 and the heating element 305, a heat exchange cavity filled with indoor circulating working fluid is provided in the microstructure cold head 210, and a working fluid inlet and a working fluid outlet of the heat exchange cavity are also provided, and the working fluid inlet and the working fluid outlet are respectively connected to the second working fluid output pipeline 206 and the second working fluid return pipeline 208; during operation, the heat of the heating element 305 is transferred to the microstructure cold head 210, and then the heat dissipation effect is achieved through the phase change and flow of the working fluid.

[0051] In actual applications, multiple server chassis can be placed in the cabinet unit 300 and have a corresponding number of multiple motherboards and multiple heating elements. Each heating element is attached with a microstructure cold head. The heating element can be a high-power consumption device such as CPU, GPU, chip, etc.

[0052] Optionally, the motherboard and the heating elements are placed in a server chassis, and the chassis model is selected from 1U, 2U or multi-U in combination with the size of the motherboard and the number of heating elements.

[0053] The cooling tower unit 101 can be selected from one of a wet cooling tower, a dry cooling tower, and a dry-wet cooling tower; when the cooling tower is a dry cooling tower or a dry-wet cooling tower, a first heat exchange pipeline 102 is provided, and the first heat exchange pipeline 102, the first cooling water inlet pipeline 106, and the first cooling water inlet pipeline 105 form a continuous pipeline; a cooling fan 112 is installed on the condenser heat exchange unit 111 through a threaded connection; the condenser heat exchange unit 111 can use a finned condenser. The cooling tower unit 101 and the condenser heat exchange unit 111 provide circulating cooling water for the outdoor water cooling system 100. The hot water in the wet cooling tower is in direct contact with the air; the hot water in the dry cooling tower is not in direct contact with the air, but is heat exchanged with the air through a heat exchanger; the dry-wet cooling tower combines the advantages of wet and dry types, and can be used in places with high water quality requirements or water-saving requirements. Therefore, different types of cooling tower units 101 can be adaptively selected according to different site environments and usage requirements. The condenser heat exchange unit 111 is selected as a parallel option because of its low energy consumption and simple structure. The heat dissipation of cooling water can be achieved through water pump circulation and cooling fan. When the working medium temperature inside the liquid reservoir 201 is not high, only turning on the condenser heat exchange unit 111 can supply sufficient cooling capacity and save energy consumption. The number of cooling tower units 101 and condenser heat exchange units 111 can be one or more; when the number of cooling tower units 101 and condenser heat exchange units 111 is more than one, they can be connected in parallel or in series.

[0054] The first stop valve 103 is provided on the first cooling water return pipeline 106 and the first cooling water inlet pipeline 105; the second stop valve 113 is provided on the second cooling water inlet pipeline 114 and the second cooling water return pipeline 115. The first stop valve 103 and the second stop valve 113 are used to control the on-off of the pipelines of the cooling tower unit 101 and the condenser heat exchange unit 111, respectively, to realize the selective opening of the cooling tower unit 101 and the condenser heat exchange unit 111.

[0055] The first cooling water inlet pipeline 105 and the second cooling water inlet pipeline 114 are provided with a first driving element 104 ; the first driving element 104 is specifically a flow pump, which can be selected from a volumetric flow pump and a centrifugal flow pump.

[0056] The other ends of the first heat exchange water inlet pipeline 121 and the first heat exchange water outlet pipeline 122 are connected to one side of the heat exchanger 123; the other side of the heat exchanger 123 is directly connected to the liquid reservoir 201 through the second heat exchange water inlet pipeline 125 and the second heat exchange water inlet pipeline 126, so that the heat exchange in the system is more sufficient through the heat exchanger 123, which is beneficial to the cooling of the working medium in the liquid reservoir 201; the second heat exchange water inlet pipeline 125 is provided with a third stop valve 124 and a first driving element 104. The heat exchanger 123 can be a shell and tube heat exchanger, a plate heat exchanger, a fin-tube heat exchanger, a spiral plate heat exchanger, a plate-fin heat exchanger, etc.

[0057] The liquid reservoir 201 is provided with a temperature detection sensor and a liquid level detection sensor for detecting the working medium temperature and the working medium liquid level in the liquid reservoir 201; when the temperature in the liquid reservoir 201 is higher than a predetermined value, or the liquid level is lower than a predetermined value, an alarm will be issued.

[0058] The microstructure cold head 210 is fitted with the heating element 305; the connection method between the microstructure cold head 210 and the second working fluid output pipeline 206 and the second working fluid return pipeline 208 is selected from one of a threaded interface, a quick interface and a straight pipe interface; the quick interface has an automatic shut-off function after the pipeline is pulled out.

[0059] The first working fluid output pipeline 203 is provided with a fourth stop valve 204 and a second driving element 205. For the mainboard 304 and the heating element 305 which do not require high heat dissipation capacity, the second driving element 205 can drive the working fluid delivery of two cabinets at the same time. The second driving element 205 is an electric flow pump or a variable frequency flow pump which can change the rotation speed according to the voltage signal. The electric flow or variable frequency flow pump can be driven by an electric motor or a variable frequency electrode. The flow rate can be changed by adjusting the rotation speed of the flow pump by voltage.

[0060] Embodiment 2

[0061] like Figure 4 As shown, this embodiment makes design improvements for the indoor circulation system 200, and the difference from the first embodiment is that the second working fluid output pipeline 206 enters the cabinet shell 301 through the side of the cabinet, and the pipelines inside the cabinet shell 301 can be uniformly led out from the rear, which is convenient for installation and maintenance.

[0062] Embodiment 3

[0063] like Figure 5-6 As shown, in this embodiment, a temperature monitoring device 302 is further installed on the cabinet shell 301 through a threaded connection to read and display the real-time temperature of each layer of the heating element 305 in the cabinet shell 301, and is electrically connected to the flow control element, and is configured as follows:

[0064] When the temperature monitoring device 302 obtains that the temperature of the heating element 305 is less than the first preset value, the flow control element is controlled to be in a semi-open state. It can be understood that within this temperature range, the total power of the heating element in the cabinet is relatively low, and only a certain stable flow rate is required to complete the heat dissipation of the heating element;

[0065] When the temperature monitoring device 302 obtains that the temperature of the heating element 305 is greater than or equal to the first preset value and less than or equal to the second preset value, the flow control element is controlled to be in a three-quarter open state. It can be understood that within this temperature range, the heating element in the cabinet is at a higher power consumption, and it is necessary to further increase the flow or reduce the restriction of the throttle valve to improve the system's heat removal efficiency for the heating element;

[0066] When the temperature monitoring device 302 obtains that the temperature of the heating element 305 is greater than the second preset value, it controls the flow control element to be fully open. It can be understood that within this temperature range, the pump power is at the rated maximum value, the throttle valve's restriction on the flow is at the minimum, and the system's heat dissipation capacity can cope with the maximum rated power corresponding to the heating element in the cabinet.

[0067] In this embodiment, the flow control element is an electronic throttle valve 207, and an electronic throttle valve 207 is set on the second working fluid output pipeline 206 of a single cabinet unit to finely control each cabinet unit, that is, the heat dissipation power of the system can be changed by limiting the flow rate.

[0068] Embodiment 4

[0069] like Figure 7 As shown, the difference between this embodiment and the third embodiment is that the flow control element is selected as the second driving element 205, so that the flow rate can be adaptively changed through the rotation speed of the flow pump itself, thereby better saving energy.

[0070] Embodiment 5

[0071] like Figure 8 As shown, the difference between this embodiment and the first embodiment is that a second heat exchange pipeline 202 is provided in the liquid reservoir 201, and the other ends of the first heat exchange water inlet pipeline 121 and the first heat exchange water outlet pipeline 122 are directly connected to the second heat exchange pipeline 202, so that the cold energy provided by the outdoor water cooling system 100 is introduced into the liquid reservoir 201 for heat exchange. The first drive element 104 or the second drive element 205 is connected in parallel and exists in the system loop, thereby avoiding the risk of the system not being able to operate normally due to failure of the first drive element 104 and the second drive element 205, thereby improving the reliability and safety of the equipment operation.

[0072] Embodiment 6

[0073] like Fig. 9 As shown, this embodiment takes into account the situation where there are more cabinet units 300 in the computer room, and the second working fluid output pipeline 206 and the second working fluid return pipeline 208 of the cabinet unit 300 are still connected in parallel to the first working fluid output pipeline 203 and the first working fluid return pipeline 209 respectively.

[0074] In summary, the high-density computer room cooling system proposed in this scheme solves the high energy consumption problem of using air conditioning for cooling in traditional computer rooms by directing the heat generated by the heating elements to the outdoor water cooling system through the indoor circulation system, and better meets the cooling needs of the server cabinet units through flow feedback control. By using insulating fluid as the working fluid, the leakage risk of the general water cooling system is avoided. At the same time, the heat transfer coefficient of the working fluid is enhanced through the heat dissipation method of the micro-structure cold head, which significantly improves the heat removal efficiency of the heating elements and solves the heat dissipation problem of the high-density cabinet; the design of the outdoor water cooling system and the indoor circulation system reduces the energy consumption of the cooling system while ensuring the heat dissipation effect, reduces the operating cost, and realizes the optimization of PUE (Power Usage Effectiveness); in addition, it has good adaptability and can automatically adjust according to the real-time environmental conditions and load conditions to ensure that a suitable server working environment can be maintained under various working conditions.

Claims

1. A high-density computer room cooling system, characterized in that: The invention comprises an outdoor water cooling system (100), an indoor circulation system (200) and a cabinet unit (300); the outdoor water cooling system (100) comprises a cooling tower unit (101), a first cooling water inlet pipeline (105), a first cooling water return pipeline (106), a condenser heat exchange unit (111), a second cooling water inlet pipeline (114), a second cooling water return pipeline (115) and a first driving element (104); the first cooling water inlet pipeline (105) and the second cooling water inlet pipeline (114) are connected in parallel to a first heat exchange water outlet pipeline (122); the first cooling water return pipeline (106) and the second cooling water return pipeline (115) are connected in parallel to the first heat exchange water inlet pipeline (121); the cooling tower unit (101) and the condenser heat exchange unit (111) provide cooling water; the first driving element (104) is used to drive the cooling water to circulate; The indoor circulation system (200) comprises: a liquid reservoir (201), a first working fluid output pipeline (203), a first working fluid return pipeline (209), a second working fluid output pipeline (206), a second working fluid return pipeline (208), a second driving element (205), a microstructure cold head (210) and a flow control element; one side of the liquid reservoir (201) is connected to the heat exchange pipeline, the other side of the liquid reservoir (201) is connected to the first working fluid pipeline; the second working fluid output pipeline (206) and the second working fluid return pipeline (208) are connected in parallel and are respectively connected to the first working fluid output pipeline (203) and the first working fluid return pipeline (209); the other side of the second working fluid output pipeline (206) and the second working fluid return pipeline (208) are connected to the microstructure cold head (210); and the second driving element (205) is used to drive the working fluid to circulate; The cabinet unit (300) comprises a cabinet housing (301), a cabinet tray (303), a mainboard (304), and a heating element (305); the cabinet tray (303) is placed in parallel and connected to the cabinet housing (301); the mainboard (304) is placed on a plane of the cabinet tray (303); and the heating element (305) is fixedly connected to the mainboard (304); The microstructure cold head (210) is mounted on the heating element (305), a heat-conducting medium is filled between the bonding interface between the microstructure cold head (210) and the heating element (305), a heat exchange cavity filled with indoor circulating working fluid is provided in the microstructure cold head (210), and the microstructure cold head (210) is also provided with a working fluid inlet and a working fluid outlet of the heat exchange cavity, and the working fluid inlet and the working fluid outlet are respectively connected to the second working fluid output pipeline (206) and the second working fluid return pipeline (208).

2. A high-density computer room heat dissipation system according to claim 1, characterized in that: The cooling tower unit (101) is specifically one of a wet cooling tower, a dry cooling tower, and a dry-wet cooling tower; When the cooling tower is a dry cooling tower or a dry-wet cooling tower, a first heat exchange pipeline (102) is provided, and the first heat exchange pipeline (102) forms a continuous pipeline with a first cooling water inlet pipeline (105) and a first cooling water return pipeline (106); The condenser heat exchange unit (111) is connected to a cooling fan (112).

3. A high-density computer room heat dissipation system according to claim 1, characterized in that: The first cooling water inlet pipeline (105) and the first cooling water return pipeline (106) are provided with a first stop valve (103), and the second cooling water inlet pipeline (114) and the second cooling water return pipeline (115) are provided with a second stop valve (113).

4. A high-density computer room heat dissipation system according to claim 1, characterized in that: The first cooling water inlet pipeline (105) and the second cooling water inlet pipeline (114) are provided with a first driving element (104), and the first driving element (104) is specifically a volumetric flow pump or a centrifugal flow pump.

5. A high-density computer room heat dissipation system according to claim 1, characterized in that: The other ends of the first heat exchange water inlet pipeline (121) and the first heat exchange water outlet pipeline (122) are connected to one side of the heat exchanger (123), and the other side of the heat exchanger (123) is directly connected to the liquid storage tank (201) through the second heat exchange water inlet pipeline (125) and the second heat exchange water outlet pipeline (126), and the second heat exchange water inlet pipeline (125) is provided with a third stop valve (124) and a first drive element (104).

6. A high-density computer room heat dissipation system according to claim 1, characterized in that: A second heat exchange pipeline (202) is provided in the liquid reservoir (201), and the other ends of the first heat exchange water inlet pipeline (121) and the first heat exchange water outlet pipeline (122) are directly connected to the second heat exchange pipeline (202) to guide the cold energy provided by the outdoor cooling system into the liquid reservoir (201).

7. A high-density computer room heat dissipation system according to claim 1, characterized in that: The liquid reservoir (201) is provided with a temperature detection sensor and a liquid level detection sensor for detecting the working fluid temperature and the working fluid liquid level in the liquid reservoir (201).

8. A high-density computer room heat dissipation system according to claim 1, characterized in that: The cabinet housing (301) is connected to a temperature monitoring device (302) for monitoring and displaying the real-time temperature of each layer of heating elements (305) in the cabinet housing (301), and is electrically connected to the flow control element.

9. A high-density computer room heat dissipation system according to claim 1, characterized in that: The flow control element is specifically an electronic throttle valve (207), an electric flow pump or a variable frequency flow pump, and the second driving element (205) is specifically an electric flow pump or a variable frequency flow pump.

10. A high-density computer room heat dissipation system according to any one of claims 1 to 9, characterized in that: The working fluid is specifically selected from one of ultrapure water, fluorine-containing compounds, and nanofluids.

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