LED module with low-deformation heat dissipation structure

Abstract

The utility model discloses an LED module with a low-deformation heat dissipation structure, and relates to the technical field of heat dissipation of LED modules. The LED lamp comprises a fixing frame, an LED plate and a top cover, the bottom of the LED plate is fixedly connected with a heat dissipation frame through bolts, a plurality of heat dissipation fins are arranged at the bottom of the heat dissipation frame, a heat dissipation mechanism is arranged on the outer sides of the heat dissipation fins, the heat dissipation mechanism comprises a mounting plate, a plurality of clamping plates are arranged at the top of the mounting plate, and the clamping plates are arranged on the top of the mounting plate. According to the utility model, through the heat dissipation fins, the clamping plate and the mounting plate, the plurality of heat dissipation fins are placed in the placement groove, and the installation structure strength of the heat dissipation fins and the clamping plate is enhanced by utilizing the arrangement of the inclined surfaces on the two sides of the heat dissipation fins; by means of multiple heat dissipation combinations of the clamping plates and the heat dissipation fins, the original contact area between the heat dissipation fins and outside air is increased, the heat conduction efficiency of the heat dissipation fins is improved, the temperature of the surfaces of the led plates is reduced, the protection performance of the led plates is improved, and the led plates are prevented from being bent due to heating.

Description

Technical Field

[0001] The utility model relates to the technical field of LED module heat dissipation, in particular to an LED module with a low-deformation heat dissipation structure. Background Art

[0002] LED modules are widely used products among LED products. There are also great differences in structure and electronics. A simple LED module is composed of only a circuit board with LEDs and a shell. A complex structure only adds some control components, constant current sources and related heat dissipation treatments to make the LED life and luminous intensity better.

[0003] The existing LED will generate a lot of heat during the lighting process. The heat dissipation structure of the existing LED module only uses a plurality of thin heat dissipation fins for heat conduction and heat dissipation. The efficiency of heat conduction and heat dissipation is low. During long-term use, the LED module is easily deformed by heat, which leads to the operation failure of the LED module and reduces the practicality of the LED module. Utility Model Content

[0004] Based on this, the purpose of the utility model is to provide an LED module with a low deformation heat dissipation structure to solve the technical problem of low heat conduction efficiency of traditional heat dissipation fins of the LED module.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an LED module with a low-deformation heat dissipation structure, comprising a fixing frame, an LED board and a top cover, the bottom of the LED board is fixedly connected to the heat dissipation frame by bolts, a plurality of heat dissipation fins are arranged at the bottom of the heat dissipation frame, a heat dissipation mechanism is arranged on the outer side of the heat dissipation fins, the heat dissipation mechanism comprises a mounting plate, a plurality of groups of clamping plates are arranged on the top of the mounting plate, each group of the clamping plates is provided with two, a cavity is formed between two adjacent groups of the clamping plates, a placement groove is formed between two clamping plates in a group, and support plates are arranged on both sides of the mounting plate.

[0006] By adopting the above technical scheme, multiple heat sinks are placed inside the placement groove, and the inclined surfaces on both sides of the heat sink fins and the inclined surfaces of the inner walls of the placement groove are used to enhance the contact and installation structural strength between the heat sink fins and the clamping plate, which is beneficial to utilize the multiple heat dissipation combination of the clamping plate and the heat sink fins to increase the original contact area between the heat sink fins and the outside air, improve the heat conduction efficiency of the heat sink fins, and help reduce the temperature of the surface of the LED board and enhance the protection of the LED board.

[0007] Furthermore, mounting ears are provided on both sides of the heat dissipation frame, and the surfaces of the mounting ears, the support plate and the fixing frame are respectively provided with a first mounting groove, a second mounting groove and a third mounting groove.

[0008] By adopting the above technical solution, the first mounting groove, the second mounting groove and the third mounting groove are set as straight groove structures, which is beneficial to improving the installation convenience of the heat dissipation frame, the mounting plate and the fixing frame.

[0009] Furthermore, both sides of the first mounting slot and the second mounting slot are provided with limiting holes, and both sides of the third mounting slot are provided with positioning pins.

[0010] By adopting the above technical solution, the limiting holes on the surface of the mounting ears and the support plate are sleeved on the positioning pins, and the positions of the heat sink, the mounting plate and the fixing frame are preliminarily fixed, which is conducive to improving the convenience of installing the LED module.

[0011] Furthermore, the outer side of the positioning pin is arranged in an inclined surface, and the positioning pin is arranged in a rubber material.

[0012] By adopting the above technical solution and utilizing the deformability of the rubber material, it is beneficial to improve the fixing strength of the heat sink and the mounting plate to the fixing frame. At the same time, it can be used as a buffer component to prevent the LED module from being damaged by external collision during transportation and use.

[0013] Furthermore, both sides of the outer surface of the heat dissipation fin are arranged in the form of inclined surfaces, and the inner wall of the placement groove is arranged in the form of an inclined material.

[0014] By adopting the above technical solution, the installation structure strength of the heat dissipating fins and the clamping plate is enhanced by utilizing the inclined surfaces on both sides of the heat dissipating fins and the inclined surfaces of the inner walls of the placement grooves, thereby enhancing the installation friction between the structures.

[0015] Furthermore, a through groove is provided at the inner bottom of the cavity, and the bottom of the mounting plate is fixedly connected to a power source via bolts.

[0016] By adopting the above technical solution, utilizing the provision of the through grooves and coordinating with the flowability of the cavity, it is beneficial to improve the ventilation flow rate on the surfaces of the heat dissipating fins, the mounting plate and the clamping plate.

[0017] Furthermore, the heat dissipation fins, the mounting plate and the clamping plate are all made of aluminum alloy, and one side of the fixing frame is rotatably connected to an adjustment frame.

[0018] By adopting the above technical solution and using the aluminum alloy material setting, it is beneficial to improve the heat conduction efficiency of the heat dissipation fins, the mounting plate and the clamping plate, and accelerate the heat dissipation rate of the LED module.

[0019] In summary, the utility model mainly has the following beneficial effects:

[0020] 1. The utility model uses heat dissipation fins, a clamping plate and a mounting plate. First, the mounting plate and the clamping plate are installed, and the clamping plate is used to clamp and limit the heat dissipation fins, and multiple heat dissipation fins are placed inside the placement groove, and the inclined surfaces on both sides of the heat dissipation fins and the inclined surfaces of the inner wall of the placement groove are used to enhance the installation structure strength of the heat dissipation fins and the clamping plate, which is beneficial to increase the original contact area between the heat dissipation fins and the outside air by using the multiple heat dissipation combination of the clamping plate and the heat dissipation fins, improve the heat conduction efficiency of the heat dissipation fins, and help reduce the temperature of the LED board surface, improve the protection of the LED board, and prevent the LED board from bending due to heat;

[0021] 2. The utility model sets positioning pins and limiting holes. First, multiple heat dissipating fins are placed in sequence inside the placement grooves, and the limiting holes on the mounting ears and the surface of the support plate are sleeved on the positioning pins to preliminarily fix the positions of the heat dissipation frame, the mounting plate and the fixing frame. Then, bolts are used to penetrate the first mounting groove, the second mounting groove and the third mounting groove, and the heat dissipation frame, the mounting plate and the fixing frame are installed and fixed, which is conducive to improving the convenience of installing the LED module and improving the production efficiency of the LED module. Then, the LED board and the top cover are installed inside the heat dissipation frame with bolts to complete the installation of the LED module. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the split three-dimensional structure of the utility model;

[0023] Figure 2 It is a three-dimensional structural schematic diagram of the heat dissipation mechanism of the utility model;

[0024] Figure 3 This is a schematic diagram of the structure of the adjustment frame of the utility model;

[0025] Figure 4 For this utility model Figure 1 Schematic diagram of the structure enlarged at point A in the middle.

[0026] In the figure: 101, heat sink; 102, heat sink fin; 2, mounting ear; 3, heat dissipation mechanism; 301, mounting plate; 302, clamping plate; 303, placement slot; 304, cavity; 305, through slot; 306, support plate; 4, limiting hole; 501, first mounting slot; 502, second mounting slot; 503, third mounting slot; 6, fixing frame; 7, positioning pin; 8, adjustment frame; 9, LED board; 10, top cover. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. The embodiments described below with reference to the drawings are exemplary and are only used to explain the utility model, and cannot be understood as limiting the utility model.

[0028] The following describes an embodiment of the utility model based on its overall structure.

[0029] An LED module with a low deformation heat dissipation structure, such as Figure 1-Figure 4 As shown, it includes a fixing frame 6, an LED board 9 and a top cover 10. The bottom of the LED board 9 is fixedly connected with a heat sink 101 by bolts. The bottom of the heat sink 101 is provided with a plurality of heat dissipation fins 102. The outer side of the heat dissipation fins 102 is provided with a heat dissipation mechanism 3. The heat dissipation mechanism 3 includes a mounting plate 301. The top of the mounting plate 301 is provided with a plurality of groups of clamping plates 302. Each group of clamping plates 302 is provided with two. A cavity 304 is formed between two adjacent groups of clamping plates 302. A placement groove 303 is formed between two clamping plates 302 in a group. Both sides of the mounting plate 301 are provided with The support plate 306 places multiple heat sink fins 102 inside the placement groove 303, and uses the inclined surfaces on both sides of the heat sink fins 102 and the inclined surfaces of the inner wall of the placement groove 303 to enhance the contact and installation structural strength between the heat sink fins 102 and the clamping plate 302, which is beneficial to utilize the multiple heat dissipation combination of the clamping plate 302 and the heat sink fins 102 to increase the original contact area of ​​the heat sink fins 102 with the outside air, improve the heat conduction efficiency of the heat sink fins 102, and help reduce the temperature of the surface of the LED board 9, enhance the protection of the LED board 9, and prevent the LED board 9 from bending due to heat.

[0030] See also Figure 1 , Figure 2 , Figure 3 , mounting ears 2 are provided on both sides of the heat sink 101, and the surfaces of the mounting ears 2, the support plate 306 and the fixing frame 6 are respectively provided with a first mounting groove 501, a second mounting groove 502 and a third mounting groove 503. The first mounting groove 501, the second mounting groove 502 and the third mounting groove 503 are arranged as a straight groove structure, which is beneficial to improving the installation convenience of the heat sink 101, the mounting plate 301 and the fixing frame 6, and improving the feasibility of the installation environment of the heat sink 101, the mounting plate 301 and the fixing frame 6.

[0031] See also Figure 1 , Figure 2 , Figure 3 , both sides of the first mounting groove 501 and the second mounting groove 502 are provided with limiting holes 4, and both sides of the third mounting groove 503 are provided with positioning pins 7, and the limiting holes 4 on the surface of the mounting ears 2 and the support plate 306 are sleeved on the positioning pins 7, and the positions of the heat dissipation frame 101, the mounting plate 301 and the fixing frame 6 are preliminarily fixed, which is conducive to improving the convenience of installing the LED module and improving the production efficiency of the LED module.

[0032] See also Figure 1 , Figure 2 , Figure 3The outer side of the positioning pin 7 is set with an inclined surface, and the positioning pin 7 is set with a rubber material, which is beneficial to improve the fixing strength of the heat dissipation frame 101 and the mounting plate 301 to the fixing frame 6. At the same time, it can be used as a buffer component to prevent the LED module from being damaged by external collision during transportation and use, thereby improving the protection of the LED module.

[0033] See also Figure 1 , Figure 2 , Figure 4 The outer surfaces of the heat dissipating fins 102 are both inclined on both sides, and the inner wall of the placement groove 303 is inclined. The inclined surfaces on both sides of the heat dissipating fins 102 and the inclined surface of the inner wall of the placement groove 303 are used to enhance the installation structure strength of the heat dissipating fins 102 and the clamping plate 302, and enhance the installation friction between the structures, which is beneficial to further enhance the heat dissipation effect of the LED module.

[0034] See also Figure 1 , Figure 2 , Figure 4 A through groove 305 is provided at the inner bottom of the cavity 304, and the bottom of the mounting plate 301 is fixedly connected to a power source by bolts. The flowability of the cavity 304 is beneficial to improving the ventilation flow rate on the surfaces of the heat dissipation fins 102, the mounting plate 301 and the clamping plate 302, thereby enhancing the heat dissipation efficiency of the LED module.

[0035] See also Figure 1 , Figure 2 , Figure 3 , Figure 4 The heat dissipation fins 102, the mounting plate 301 and the clamping plate 302 are all made of aluminum alloy. One side of the fixing frame 6 is rotatably connected with the adjustment frame 8, which is beneficial to improve the heat conduction efficiency of the heat dissipation fins 102, the mounting plate 301 and the clamping plate 302, accelerate the heat dissipation rate of the LED module, and increase the service life of the LED module.

[0036] The implementation principle of this embodiment is as follows: first, multiple heat sinks 102 are placed in the placement grooves 303 in sequence, and the clamping plates 302 are used to clamp and limit the heat sinks 102. Multiple heat sinks 102 are placed in the placement grooves 303, and the inclined surfaces on both sides of the heat sink 102 and the inclined surfaces of the inner walls of the placement grooves 303 are used to enhance the installation structural strength of the heat sink 102 and the clamping plates 302. The limiting holes 4 on the surfaces of the mounting ears 2 and the support plates 306 are sleeved on the positioning pins 7 to preliminarily fix the positions of the heat sink 101, the mounting plate 301 and the fixing frame 6. Then, bolts are used to penetrate the first mounting groove 501, the second mounting groove 502 and the third mounting groove 503, and the heat sink 101, the mounting plate 301 and the fixing frame 6 are installed and fixed, which is conducive to improving the convenience of installing the LED module. Then, the LED board 9 and the top cover 10 are installed in the heat sink 101 by bolts to complete the installation of the LED module.

[0037] Parts not involved in the present invention are the same as the prior art or can be implemented by using the prior art, and will not be described in detail here.

[0038] Although an embodiment of the utility model has been shown and described, this specific embodiment is only an explanation of the utility model and is not a limitation of the utility model. The specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions and variations to the embodiments without creative contribution as needed without departing from the principles and purpose of the utility model. However, as long as they are within the scope of the claims of the utility model, they are protected by patent law.

Claims

1. An LED module with a low deformation heat dissipation structure, comprising a fixing frame (6), an LED board (9) and a top cover (10), characterized in that: The bottom of the LED board (9) is fixedly connected to a heat sink (101) by bolts, a plurality of heat sink fins (102) are arranged at the bottom of the heat sink (101), a heat sink mechanism (3) is arranged on the outside of the heat sink fins (102), the heat sink mechanism (3) comprises a mounting plate (301), a plurality of groups of clamping plates (302) are arranged on the top of the mounting plate (301), each group of the clamping plates (302) is provided with two, a cavity (304) is formed between two adjacent groups of the clamping plates (302), a placement groove (303) is formed between two of the clamping plates (302) in one group, and support plates (306) are arranged on both sides of the mounting plate (301).

2. The LED module with low deformation heat dissipation structure according to claim 1, characterized in that: Both sides of the heat dissipation frame (101) are provided with mounting ears (2), and the surfaces of the mounting ears (2), the support plate (306) and the fixing frame (6) are respectively provided with a first mounting groove (501), a second mounting groove (502) and a third mounting groove (503).

3. The LED module with low deformation heat dissipation structure according to claim 2, characterized in that: Limiting holes (4) are provided on both sides of the first installation groove (501) and the second installation groove (502), and positioning pins (7) are provided on both sides of the third installation groove (503).

4. The LED module with low deformation heat dissipation structure according to claim 3, characterized in that: The outer side of the positioning pin (7) is arranged in an inclined surface, and the positioning pin (7) is arranged in a rubber material.

5. The LED module with low deformation heat dissipation structure according to claim 1, characterized in that: Both sides of the outer surface of the heat dissipation fin (102) are arranged in the form of inclined surfaces, and the inner wall of the placement groove (303) is arranged in the form of an inclined surface material.

6. The LED module with low deformation heat dissipation structure according to claim 1, characterized in that: A through slot (305) is provided at the inner bottom of the cavity (304), and a power source is fixedly connected to the bottom of the mounting plate (301) via bolts.

7. The LED module with low deformation heat dissipation structure according to claim 1, characterized in that: The heat dissipation fins (102), the mounting plate (301) and the clamping plate (302) are all made of aluminum alloy, and one side of the fixing frame (6) is rotatably connected to an adjustment frame (8).

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