Display module and display device
By setting test traces flush with the first side in the binding area of the display panel, signal communication between multiple display panels is achieved, and the problem of low yield detection efficiency of display panels in the prior art is solved, and the detection efficiency is significantly improved.
Patent Information
- Application Number
- CN202420647570.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-29
- Publication Date
- 2025-03-04
- Estimated Expiration
- 2034-03-29
AI Technical Summary
The yield detection efficiency of existing LCD display panels is low, and multiple display panels need to be lit and detected separately, resulting in a significant decrease in detection efficiency during mass production.
A display module is designed, in which the binding area of the display panel is provided with a test trace, one end of the test trace is connected to the display area, the other end extends to the first side, and is approximately flush with the first side, thereby realizing signal communication between multiple display panels and realizing simultaneous lighting detection of multiple display panels.
Through this design, the yield detection efficiency of the display panel can be significantly improved, the detection time can be reduced, and the production efficiency can be improved.
Smart Images

Figure CN222561873U_ABST
Abstract
Description
Technical Field
[0001] The embodiments of the present application relate to the field of display technology, and in particular, to a display module and a display device. Background Art
[0002] At present, liquid crystal display devices, as display components of electronic devices, have been widely used in various electronic products due to their advantages of low power consumption, miniaturization, lightness, etc. Existing liquid crystal display devices include liquid crystal display panels (Liquid Crystal Display, LCD for short) and backlight modules that provide stable, high-brightness and uniformly distributed light for the display panel. With the development of display technology, consumers have higher and higher requirements for the picture quality of display devices.
[0003] After the display module is installed, the yield test of the display panel needs to be carried out to ensure the quality of the equipment before it leaves the factory. However, the yield test of existing display panels is usually carried out by lighting up different display panels separately, which greatly reduces the test efficiency of the yield test of multiple display panels produced in batches. Therefore, how to improve the yield test efficiency of display panels has become an urgent problem to be solved in this field. Utility Model Content
[0004] The embodiments of the present application provide a display module and a display device, aiming to solve the problem of how to improve the yield detection efficiency of the display panel.
[0005] A first aspect of an embodiment of the present application provides a display module, the display module comprising:
[0006] A display panel, the display panel comprising a display area, and a binding area arranged on one side of the display area, the binding area comprising a first binding surface and a first side surface adjacent to the first binding surface, the first binding surface being used for binding a driving chip, and the first side surface being connected to an edge of the first binding surface away from the display area;
[0007] The binding area includes a test line, one end of which is connected to the display area, and the other end of which extends to the first side surface, and an end surface of the test line away from the display area is substantially flush with the first side surface.
[0008] In an optional embodiment, at least one binding portion is provided on the first binding surface, the binding portion is used to be bound and connected to an external circuit board, and the end surface of the test trace away from the display area has a one-to-one correspondence with the position of the binding portion.
[0009] In an optional embodiment, the display panel includes a display surface, a second side surface and a third side surface, and the second side surface and the third side surface are arranged opposite to each other and are respectively in contact with the display surface;
[0010] The second side surface and the third side surface are located on both sides of the first side surface, and the test traces are respectively arranged close to the second side surface and the third side surface.
[0011] In an optional implementation, a width of an end surface of the test trace away from the display area along a first direction is equal to a width of the first side surface along the first direction, and the first direction is a direction perpendicular to the first binding surface.
[0012] In an optional embodiment, the display module further comprises a protective tape, and the protective tape is attached to at least a portion of the surface of the display module;
[0013] The protective tape includes a fourth tape adhered to the binding area, the fourth tape includes a first bonding area for adhering to the first side, the first bonding area includes a stacked substrate layer and an insulating material layer, wherein the insulating material layer in the first bonding area is arranged around the end surface of the test trace away from the display area.
[0014] In an optional embodiment, a plurality of connection portions are arranged at intervals along the length direction of the display module on the first binding surface;
[0015] The fourth adhesive tape also includes a second bonding area arranged on one side of the first bonding area, and the second bonding area is used to bond to the first binding surface, wherein the second bonding area includes a plurality of first bonding structures, and the first bonding structures correspond one-to-one to the end surfaces of the test traces away from the display area, and are insulated from each other.
[0016] In an optional embodiment, the binding area further includes a second binding surface arranged opposite to the first binding surface, the first side surface is connected to an edge of the second binding surface away from the display area, a circuit board is arranged on the second binding surface, and the circuit board is connected to the connecting portion through a connecting line;
[0017] The fourth adhesive tape also includes a third bonding area arranged on the side of the first bonding area away from the second bonding area, and the third bonding area is used to bond to the second binding surface, wherein the third bonding area has a first groove at a position corresponding to the circuit board, and the circuit board is arranged in the first groove.
[0018] In an optional embodiment, the third bonding area includes a substrate layer and an insulating material layer stacked in layers, and a size of the first groove in the insulating material layer in the third bonding area is smaller than a size of the first groove in the substrate layer in the third bonding area.
[0019] In an optional embodiment, the display module further includes a backlight module, and the backlight module is arranged on a side of the display panel away from the display surface;
[0020] The backlight module includes a plastic frame, a back plate, and a plurality of light bars located between the side of the back plate and the plastic frame. The display panel is mounted on the plastic frame. The plurality of light bars are connected to an external signal source through light bar connecting lines passing through the plastic frame.
[0021] In an optional embodiment, a second groove is formed on the edge of the side of the plastic frame away from the display panel, and the light bar connecting wire passes through the plastic frame through the second groove, and there is no overlap between the light bar connecting wire and the second groove.
[0022] In an optional embodiment, the display module further includes a light guide plate, and the light guide plate is arranged between the backlight module and the display panel;
[0023] The light bar includes a light bar circuit board fixed to the side of the back panel, and a plurality of light bar light sources arranged at intervals on the light bar circuit board, wherein a partition structure is arranged between adjacent light bar light sources on the light bar circuit board, and a surface of the partition structure facing away from the light bar circuit board is attached to the light guide plate, and a gap exists between the light bar light source and the light guide plate.
[0024] In an optional embodiment, the plastic frame includes a first plastic frame area, a second plastic frame area, a third plastic frame area and a fourth plastic frame area arranged around the display area, the first plastic frame area is arranged opposite to the second plastic frame area, and the third plastic frame area is arranged opposite to the fourth plastic frame area;
[0025] A first adhesive layer is respectively provided on the first adhesive frame area and the second adhesive frame area on a side away from the back plate, and a surface of the first adhesive layer close to the adhesive frame is bonded to the adhesive frame;
[0026] A second adhesive layer is respectively provided on the side of the third adhesive frame area and the fourth adhesive frame area away from the back plate, and the second adhesive layer is bonded to the adhesive frame on a side surface close to the adhesive frame, and is bonded to the display panel on a side surface close to the display panel.
[0027] In an optional embodiment, the display module further comprises an optical film material, the optical film material is arranged on a side of the light guide plate away from the back plate, and the optical film material is provided with a through hole;
[0028] A first boss corresponding to the position of the through hole is protruded on the edge of the light emitting surface of the light guide plate, and the first boss passes through the through hole.
[0029] In an optional embodiment, the optical film material includes a first diffusion sheet and a first prism sheet stacked in sequence, and the first diffusion sheet is arranged close to the light guide plate;
[0030] A second boss and a third boss are convexly provided on the edge of the light emitting surface of the light guide plate, and the heights of the first boss, the second boss and the third boss decrease in sequence along a first direction, and the first direction is a direction perpendicular to the first binding surface;
[0031] The first diffusion sheet is provided with a first through hole, the second boss passes through the first through hole, and the second boss is bonded to a surface of the first prism sheet close to the light guide plate, and the third boss is bonded to a surface of the first diffusion sheet close to the light guide plate.
[0032] A second aspect of an embodiment of the present application provides a display device, comprising a display module as described in any one of the first aspects.
[0033] Beneficial effects:
[0034] The present application provides a display module and a display device, the display module comprising: a display panel, the display panel comprising a display area, and a binding area arranged on one side of the display area, the binding area comprising a first binding surface and a first side surface adjacent to the first binding surface, the first binding surface being used to bind a driver chip, the first side surface connecting the edge of the first binding surface away from the display area; wherein the binding area comprises a test trace, one end of the test trace is connected to the display area, the other end extends to the first side surface, and the end surface of the test trace away from the display area is substantially flush with the first side surface. The present application arranges a test trace end surface substantially flush with the first side surface on the first side surface of the display panel, so that the signals of multiple display panels are connected together through the test trace end surface, thereby realizing simultaneous lighting of multiple display panels to detect yield, thereby improving the efficiency of yield detection. BRIEF DESCRIPTION OF THE DRAWINGS
[0035] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the description of the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.
[0036] Figure 1 is a schematic diagram of a top view structure of a display panel proposed in an embodiment of the present application;
[0037] Figure 2 is a structural schematic diagram of a first side surface of a display panel proposed in an embodiment of the present application;
[0038] Figure 3 is a schematic structural diagram of a first binding surface of a display panel proposed in an embodiment of the present application;
[0039] Figure 4 is a schematic diagram of a planar unfolded structure of a fourth adhesive tape proposed in an embodiment of the present application;
[0040] Figure 5 is a schematic diagram of a planar unfolded structure of a first adhesive tape proposed in an embodiment of the present application;
[0041] Figure 6 is a schematic diagram of a planar unfolded structure of a second adhesive tape proposed in an embodiment of the present application;
[0042] Figure 7 is a schematic diagram of a planar unfolded structure of a third adhesive tape proposed in an embodiment of the present application;
[0043] Figure 8 It is a schematic diagram of a top view structure of a plastic frame proposed in one embodiment of the present application;
[0044] Fig. 9 This is a schematic diagram of a second groove structure on the side of a rubber frame proposed in an embodiment of the present application;
[0045] Fig.10 is a schematic diagram of a cross-sectional structure of an edge of a display module proposed in an embodiment of the present application;
[0046] Fig.11 is an enlarged top view schematic diagram of an edge of a light guide plate proposed in an embodiment of the present application;
[0047] Fig.12 It is a schematic cross-sectional view of an edge of an optical film material proposed in one embodiment of the present application.
[0048] Explanation of reference numerals: 1. display module; 11. display panel; 111. display area; 112. binding area; 113. first binding surface; 1131. binding part; 1132. connecting part; 114. first side surface; 1141. test wiring end surface; 12. backlight module; 121. glue frame; 1211. first glue frame area; 1212. second glue frame area; 1213. third glue frame area; 1214. fourth glue frame area; 1215. second groove; 1216. first glue layer; 1217. second glue layer; 122. back plate; 123. light bar; 1231. light bar connecting line; 1232. light bar circuit board; 1233. light bar light source; 1234. partition structure; 13. First tape; 131, corner wrapping structure; 14, second tape; 15, third tape; 151, fool-proof hole; 16, fourth tape; 161, first bonding area; 162, second bonding area; 1621, first bonding structure; 1622, second bonding structure; 1623, third bonding structure; 1624, fourth bonding structure; 163, third bonding area; 1631, first groove; 17, light guide plate; 171, first boss; 172, second boss; 173, third boss; 18, optical film; 181, first diffuser; 182, first prism; 19, filter; 201, front bonding area; 202, side bonding area; 203, indentation line; 204, release film. DETAILED DESCRIPTION
[0049] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0050] In the drawings, the size of the constituent elements, the thickness of the layer or the area may be exaggerated for the sake of clarity. Therefore, any implementation of the present disclosure is not necessarily limited to the size shown in the drawings, and the shapes and sizes of the components in the drawings do not reflect the true proportions. In addition, the drawings schematically show ideal examples, and any implementation of the present disclosure is not limited to the shapes or values shown in the drawings.
[0051] At present, liquid crystal display devices, as display components of electronic devices, have been widely used in various electronic products due to their advantages of low power consumption, miniaturization, lightness, etc. Existing liquid crystal display devices include liquid crystal display panels (Liquid Crystal Display, LCD for short) and backlight modules that provide stable, high-brightness and uniformly distributed light for the display panel. With the development of display technology, consumers have higher and higher requirements for the picture quality of display devices.
[0052] After the display module is installed, the display panel needs to be tested for display yield to ensure that defective products will not flow into the subsequent production process and cause greater losses, thus ensuring the quality of the equipment shipped out of the factory. However, the existing display panel yield test is usually carried out by lighting up different display panels separately, which greatly reduces the inspection efficiency when performing yield inspection on multiple display panels produced in batches.
[0053] In view of this, an embodiment of the present application provides a display module 1, wherein the display module 1 includes a display panel 11, Figure 1 FIG. 1 shows a schematic diagram of a top view structure of a display panel proposed in an embodiment of the present application. Figure 1 As shown, the display panel 11 includes: a display area 111, wherein the display area 111 is used to display a screen image; a binding area 112, wherein the binding area 112 is arranged on one side of the display area 111, and the binding area 112 includes a first binding surface 113 and a first side surface 114 adjacent to the first binding surface 113, wherein the first binding surface 113 is used to bind a driving chip (IC), and the first side surface 114 connects the edge of the first binding surface 113 away from the display area 111.
[0054] In the embodiment of the present application, the binding area 112 of the display panel 11 is provided with a test line, one end of which is connected to the display area 111 for transmitting the signal of the display area 111. When the display panel 11 is lit to perform a display yield test on the display panel 11, signal conduction needs to be achieved through the test line, so by connecting the signals of multiple different display panels that need to perform a yield test, multiple display panels 11 can be lit together, effectively improving the efficiency of the yield test. Figure 2 FIG. 1 shows a schematic diagram of a structure of a first side of a display panel proposed in an embodiment of the present application. Figure 2 As shown, in order to allow the signal in the display area 111 on the display panel 11 to be connected to the signal of other display panels 11, the other end of the test trace extends to the first side 114, and an end face of the test trace away from the display area is formed on the first side 114 of the display panel 11 (hereinafter referred to as the test trace end face 1141), and each of the display panels 11 can be connected to the signal between other display panels 11 through the test trace end face 1141 formed on the first side 114, so as to realize lighting up multiple display panels at the same time. In addition, the test trace end face 1141 with conductive ability is provided on the first side 114, which also helps to enhance the electrostatic discharge of the display module.
[0055] In the embodiment of the present application, in order to improve the product utilization rate of the display module, the test trace end face 1141 is substantially flush with the first side face 114. Optionally, the test trace end face can be processed by the display panel 11 using a zero-cut process, so that the test trace in the binding area 112 close to the first side face 114 is cut off from the front, forming the test trace end face 1141 substantially flush with the first side face 114.
[0056] In some optional embodiments, such as Figure 2 As shown, the display module 1 further includes a filter 19, and the filter 19 is arranged on a side of the display panel 11 close to the first binding surface 113. The width of the test trace end surface 1141 along the first direction is equal to the width of the first side surface 114 along the first direction, so that the test trace end surface 1141 covers the display panel 11 along the first direction, and the transmission effect of the test trace end surface 1141 is guaranteed to the maximum extent. The first direction is a direction perpendicular to the first binding surface 113.
[0057] In some optional embodiments, the display panel 11 includes a display surface, a second side surface and a third side surface, the display surface is a plane corresponding to the display area 111, the display surface is the plane where the first binding surface 113 is located, the second side surface is arranged opposite to the third side surface and are respectively connected to the display surface, wherein the second side surface and the third side surface are respectively located on both sides of the first side surface 113. Figure 3 FIG. 1 shows a schematic diagram of a structure of a first binding surface of a display panel proposed in an embodiment of the present application. Figure 3As shown, at least one binding portion 1131 is provided on the first binding surface 113, and the binding portion 1131 is used to bind and connect with an external circuit board, so as to perform electrical testing on the display module 1 through the binding portion 1131, so as to avoid defective products flowing into subsequent processes and causing greater losses. Exemplarily, the binding portion can be an electrical test pad. In the embodiment of the present application, since the binding portion 1131 and the test trace end surface 1141 are both areas for defective detection, the positions of the test trace end surface 1141 and the binding portion 1131 correspond one to one. Specifically, on the first side surface 114, the test trace is arranged close to the second side surface and the third side surface, respectively, so that the test trace end surface 1141 is symmetrically arranged on the two side edges of the first side surface 114 on the first side surface 114; on the first binding surface 113, the binding portion 1131 is arranged close to the second side surface and the third side surface, respectively, so that the binding portion 1131 is symmetrically arranged on the two side edges of the first binding surface 113 on the first binding surface 113, and on the edge of the first binding surface 113 away from the display area 111, the binding portion 1131 and the test trace end surface 1141 correspond to the same area.
[0058] In some optional embodiments, the binding area 112 further includes a second binding surface arranged opposite to the first binding surface 113, and a circuit board is arranged on the second binding surface. Figure 3 As shown, the first binding surface 113 is also provided with a plurality of connecting portions 1132 arranged at intervals along the length direction of the display module 1, and the connecting portion 1132 is used to bind to the driver chip and is connected to the circuit board (PCB) located on the second binding surface through a connecting line. Exemplarily, the connecting portion and the connecting line can be reused as a flexible printed circuit (Flexible Printed Circuit, FPC for short), one end of the flexible circuit board is bound to the first binding surface 113 as the connecting portion for connecting the driver chip, and the other end of the flexible circuit board is bent to the second binding surface and connected to the circuit board.
[0059] In some optional embodiments, the display module 1 includes a first frame area arranged opposite to the binding area, and a second frame area and a third frame area arranged opposite to each other, wherein the second frame area and the third frame area are two edge areas of the display module 1 other than the first frame area and the binding area. The display module 1 also includes a protective tape, which adheres to at least a portion of the surface of the display module 1. Specifically, the protective tape includes at least a first tape 13, a second tape 14, a third tape 15, and a fourth tape 16, and the first tape 13, the second tape 14, the third tape 15, and the fourth tape 16 correspond to the first frame area, the second frame area, the third frame area, and the binding area 112 of the display module 1, respectively.
[0060] Figure 4 is a schematic diagram of a planar unfolded structure of a fourth adhesive tape proposed in an embodiment of the present application, such as Figure 4 As shown, the fourth adhesive tape 16 includes a first bonding area 161, a second bonding area 162 and a third bonding area 163, wherein the second bonding area 162 is arranged on one side of the first bonding area 161, and the third bonding area 163 is arranged on the side of the first bonding area 162 away from the second bonding area 161, wherein the first bonding area 161 is used to bond to the first side surface 114 of the binding area 112, the second bonding area 162 is used to bond to the first binding surface 113 of the binding area 112, and the third bonding area 163 is used to bond to the second binding surface of the binding area 112. It is easy to understand that in the binding area 112, the first binding surface 113, the first side surface 114 and the second binding surface are connected in sequence, and therefore, the second bonding area 162, the first bonding area 161 and the third bonding area 163 on the fourth adhesive tape 16 are connected in sequence.
[0061] In the embodiment of the present application, the fourth adhesive tape 16 includes a substrate layer, an insulating material layer and a double-sided adhesive layer which are stacked, the substrate layer is arranged close to the surface of the display module 1, and the insulating material layer is arranged between the substrate layer and the double-sided adhesive layer. It should be noted that the substrate layer is a conductive material, and the insulating material layer is an insulating material. In the first bonding area 161, the fourth adhesive tape 16 includes the substrate layer and the insulating material layer, wherein the substrate layer covers the first side surface 114 in its entirety, and the insulating material layer is arranged around the end surface 1141 of the test trace away from the display area. Optionally, in the first bonding area 161, a plurality of third grooves corresponding to the positions of the gaps between adjacent connecting portions 1132 are arranged on the insulating material layer, and the third grooves extend into the second bonding area 162 to prevent the insulating material layer from covering the gaps of the connecting portions 1132.
[0062] In the second bonding area 162, the fourth adhesive tape 16 includes the base material layer, the insulating material layer and the double-sided adhesive layer. Specifically, the second bonding area 162 includes a plurality of first bonding structures 1621, the first bonding structures 1621 correspond one-to-one to the end face 1141 of the test line away from the display area, and are arranged close to the edge of the first binding surface away from the display area. In other words, the first bonding structure 1621 is arranged between the binding portion 1131 and the end face 1141 of the test line, wherein the first bonding structure 1621 includes the base material layer, the insulating material layer and the double-sided adhesive layer arranged in a stacked manner. The embodiment of the present application prevents the abnormal display failure caused by the conduction between the end face 1141 of the test line through the fourth adhesive tape 16 and other materials by arranging the first bonding structure 1621 in the fourth adhesive tape 16.
[0063] The second bonding area 162 also includes a plurality of second bonding structures 1622, which correspond to the connection portion 1132 one by one and are used to bond to the side of the connection portion 1132, wherein the second bonding structure 1622 includes the substrate layer and the insulating material layer stacked, and the embodiment of the present application avoids stress pulling the connection portion 1132 by setting the second bonding structure 1622, thereby preventing the risk of L0 light leakage from the display panel 11. It is easy to understand that the first bonding structure 1621 includes three layers of material, and the second bonding structure includes two layers of material, so the first bonding structure 1621 is thicker than the second bonding structure 1622, and the second bonding structure has a certain thickness corresponding to the connection portion 1132 itself, so the thickness difference between the first bonding structure 1161 and the second bonding structure 1162 can ensure the flatness of the fourth tape 16 on the first binding surface 113, thereby preventing the driver chip connected to the connection portion 1132 from being damaged during the subsequent vibration test.
[0064] In some optional embodiments, the second bonding area 162 also includes a plurality of third bonding structures 1163, wherein the third bonding structures 1163 are arranged in the gaps of the second bonding structures 1162, and the third bonding structures 1163 include a first area and a second area, wherein the first area is an extension area of the third groove on the first binding surface 113, and only includes a single-layer substrate layer; the second area is arranged close to the display area 111, and includes the substrate layer, the insulating material layer and the double-sided adhesive layer.
[0065] Optionally, the second fitting area 162 is further provided with a fourth fitting structure 1624 between the first fitting structure 1621 and the test line end surface 1141 , and the fourth fitting structure 1624 includes the substrate layer and the insulating material layer.
[0066] In the embodiment of the present application, the third bonding area 163 is bonded to the second binding surface, including the substrate layer and the insulating material layer. Since the circuit board is arranged on the backplane position corresponding to the second binding surface, a first groove 1631 is opened on the substrate layer and the insulating material layer of the third bonding area 163 at a position corresponding to the circuit board, and the circuit board is arranged in the first groove 1631. Specifically, in order to avoid a short circuit between the circuit board and the material of the third bonding area 163, the size of the first groove 1631 in the insulating material layer is smaller than the size of the first groove in the substrate layer, so that when the circuit board contacts the tape material of the third bonding area 163, it preferentially contacts the insulating material layer to prevent the device from short circuiting.
[0067] Optionally, in order to improve the fixation of the fourth adhesive tape 16 on the display module 1, on the third bonding area 163, the substrate layer continues to extend a distance away from the side edge of the first bonding area 161, so that in the third bonding area 163, the extended substrate layer is fixed to the back panel of the display module 1. Exemplarily, the extension length of the substrate layer away from the side edge of the first bonding area 161 is 7 mm.
[0068] In some optional embodiments, the protective tape further includes a release film 204 disposed on the bonding surface of the protective tape, and a cutting line is disposed on the release film 204, and the cutting line divides the release film into a first part and a second part. During the assembly process, the release films of the first part and the second part are torn off in sequence to partially bond the protective tape. An indentation line 203 corresponding to the cutting line is disposed on the protective tape, and on the fourth tape 16, the indentation line 203 is the boundary line between the first bonding area 161 and the second bonding area 162.
[0069] In some optional embodiments, the first adhesive tape 13, the second adhesive tape 14, and the third adhesive tape 15 all include a front bonding area 201 and a side bonding area 202. Figure 5 FIG. 4 shows a schematic diagram of a planar unfolded structure of a first adhesive tape proposed in an embodiment of the present application. Figure 5As shown, an indentation line 203 corresponding to the cutting line of the release film 204 is provided on the first adhesive tape 13, above the indentation line 203 is the front bonding area, and below the indentation line 203 is the side bonding area, wherein two corner structures 131 are relatively arranged in the side bonding area, and the corner structures 131 are used to bend to the sides of the second frame area and the third frame area when actually bonding the first frame area, so as to prevent poor light leakage in the corners.
[0070] In some optional embodiments, Figure 6 FIG. 4 shows a schematic diagram of a planar unfolded structure of a second adhesive tape proposed in an embodiment of the present application. Figure 6 As shown, the second adhesive tape 14 is provided with an indentation line 203 corresponding to the cutting line of the release film 204 , the front bonding area is located above the indentation line 203 , and the side bonding area is located below the indentation line 203 .
[0071] In some optional embodiments, Figure 7 FIG. 4 shows a schematic diagram of a planar unfolded structure of a third adhesive tape proposed in an embodiment of the present application. Figure 7 As shown, the third adhesive tape 15 is provided with an indentation line 203 corresponding to the cutting line of the release film 204, the front bonding area is above the indentation line 203, and the side bonding area is below the indentation line 203. Optionally, since the second frame area and the third frame area have the same structure and size, the second adhesive tape 14 and the third adhesive tape 15 have substantially the same structure and size. In order to prevent the second adhesive tape 14 from mixing with the third adhesive tape 15, a foolproof hole 151 is provided on the edge of the third adhesive tape. Exemplarily, the foolproof hole 151 is provided on the edge of the side bonding area away from the front bonding area. In addition, the foolproof hole can release a portion of the stress during bonding to ensure smooth bonding.
[0072] In the embodiment of the present application, the display module 1 further includes a backlight module 12 , which is disposed on a side of the display panel 11 away from the display surface. The backlight module 12 includes a plastic frame 121 and a back plate 122 , and the display panel 11 is mounted on the plastic frame 121 . Figure 8 FIG. 1 shows a schematic diagram of a top view of a plastic frame proposed in an embodiment of the present application. Figure 8As shown, the plastic frame 121 includes a first plastic frame area 1211, a second plastic frame area 1212, a third plastic frame area 1213 and a fourth plastic frame area 1214 arranged around the display area 111, the first plastic frame area 1211 is arranged opposite to the second plastic frame area 1212, and the third plastic frame area 1213 is arranged opposite to the fourth plastic frame area 1214. A first adhesive layer 1216 is respectively arranged on the side of the first plastic frame area 1211 and the second plastic frame area 1212 away from the back plate 122. The first adhesive layer 1216 is a single-sided adhesive layer, and the surface of the first adhesive layer 1216 close to the plastic frame 121 is bonded to the plastic frame 121; the side away from the plastic frame 121 faces the display panel 11 and is not bonded to the display panel 11.
[0073] A second adhesive layer 1217 is respectively provided on the side of the third adhesive frame area 1213 and the fourth adhesive frame area 1214 away from the back plate 122. The second adhesive layer 1217 is a double-sided adhesive layer. The surface of the second adhesive layer 1217 close to the adhesive frame 121 is bonded to the adhesive frame 121, and the surface of the second adhesive layer 1217 close to the display panel 11 is bonded to the display panel 11. In the embodiment of the present application, the display panel 11 is fixed by the second adhesive layer 1217 to prevent the display panel 11 from being separated from the display module 1, and to prevent the L0 light leakage of the display panel 11.
[0074] Exemplarily, the first rubber frame area 1211 and the second rubber frame area 1212 are the upper rubber frame area and the lower rubber frame area of the rubber frame 121, and a first rubber layer 1216 with a length of 50 mm is respectively arranged in the first rubber frame area 1211 and the second rubber frame area 1212; the third rubber frame area 1213 and the fourth rubber frame area 1214 are the left rubber frame area and the right rubber frame area of the rubber frame 121, and a second rubber layer 1217 with a length of 50 mm is respectively arranged in the third rubber frame area 1213 and the fourth rubber frame area 1214.
[0075] In some optional embodiments, the display module 1 further includes a plurality of light bars 123 , which are disposed between the side of the back panel 122 and the plastic frame 121 , and the plurality of light bars 123 are connected to an external signal source via light bar connecting lines 1231 passing through the plastic frame 121 . Fig. 9 FIG. 1 shows a schematic diagram of a second groove structure on the side of a plastic frame proposed in an embodiment of the present application, such as Fig. 9As shown, a second groove 1215 is provided on the edge of the side of the plastic frame 121 away from the display panel 11, and the light bar connecting wire 1231 passes through the plastic frame 121 through the second groove 1215, and there is no overlap between the light bar connecting wire 1231 and the second groove 1215. Optionally, in order to prevent the light bar connecting wire 1231 from shaking randomly and causing the solder joint to break due to the excessive bending space between the light bar connecting wire 1231 and the second groove 1215, a first gap is provided between the light bar connecting wire 1231 and the second groove 1215, and the gap width of the first gap is greater than or equal to 0.1 mm and less than or equal to 0.3 mm. Preferably, the width of the first gap is equal to 0.2 mm.
[0076] In some optional embodiments, Fig.10 FIG. 4 shows a schematic diagram of a cross-sectional structure of an edge of a display module proposed in an embodiment of the present application. Fig.10 As shown, the display module 1 also includes a light guide plate 17, and the light guide plate 17 is arranged between the backlight module 12 and the display panel 11; the light bar 123 includes a light bar circuit board 1232 fixed to the side of the back plate 122, and a plurality of light bar light sources 1233 arranged at intervals on the light bar circuit board 1232, and the light bar circuit board 1232 is used to supply power to the light bar light source 1233 so that the light bar light source 1233 emits light; the light bar light source 1233 is arranged toward the light emitting surface of the light guide plate 17, and the light bar light source 1233 can be incident from the light incident surface of the light guide plate 17 to the inside of the light guide plate 17 through a side-entry method, and emitted from the light emitting surface of the light guide plate 17.
[0077] In the embodiment of the present application, there is a gap between the light bar light source 1233 and the light guide plate 17 so that the light guide plate 17 will not directly contact the light bar light source 1233. However, since the light guide plate 17 will fill the gap and contact the light bar light source 1233 during the process of thermal expansion and contraction, the light guide plate 17 will smash the light bar light source 1233. Therefore, in the embodiment of the present application, a partition structure 1234 is provided between adjacent light bar light sources 1233 on the light bar circuit board 1232, and the surface of the partition structure 1234 facing away from the light bar circuit board 1232 is provided in contact with the light guide plate 17. Based on the support formed by the partition structure 1234 between the light bar circuit board 1232 and the light guide plate 17, it is ensured that when the light guide plate 17 expands toward the gap between the light bar light source 1233 and the light guide plate 17, it is blocked by the partition structure 1234 and cannot directly contact the light bar light source 1233, thereby avoiding damage to the light bar light source 1233 by the light guide plate 17. Optionally, the width of the gap between the light bar light source and the light guide plate 17 is 0.2 mm.
[0078] In some optional embodiments, the display module 1 further includes an optical film 18, which is disposed on a side of the light guide plate 17 away from the back plate 122. The optical film 18 includes a first diffuser 181 and a first prism sheet 182 which are stacked in sequence, and the first diffuser 181 is disposed close to the light guide plate 17. Fig.11 FIG. 4 shows an enlarged top view of an edge of a light guide plate proposed in an embodiment of the present application. Fig.11 As shown, a first boss 171 is convexly provided on the edge of the light-emitting surface of the light guide plate 17, and a through hole is provided on the optical film material 18 (including a first diffuser 181 and a first prism sheet 182), and the first boss 171 corresponds to the position of the through hole, and the optical film material 18 is sleeved on the first boss 171 through the through hole. Optionally, the height of the first boss 171 along the first direction is greater than the thickness of the optical film material 18 along the first direction; there is a second gap between the light-emitting surface of the light guide plate 17 and the optical film material 18, and the second gap is used to provide a margin for thermal expansion and contraction of the optical film material 18; there is a third gap between the first boss and the inner wall of the through hole. Exemplarily, the height of the first boss 171 beyond the side of the optical film material 18 away from the back plate 122 is 0.15 mm, the width of the second gap is 0.6 mm, and the width of the third gap is 0.1 mm.
[0079] In some optional embodiments, the edge of the light emitting surface of the light guide plate 17 is further provided with a second boss 172 and a third boss 173, wherein the second boss 172 is used to fix the first diffuser 181, and the third boss 173 is used to fix the first prism sheet 182. Specifically, a first through hole is provided on the first diffuser 181, and the second boss 172 corresponds to the position of the first through hole. The first diffuser 181 is sleeved on the second boss 172 through the first through hole, so that the second boss 172 fixes the first diffuser 181. Meanwhile, the second boss 172 is bonded to the surface of the first prism sheet 182 close to the light guide plate 17, so as to fix the first prism sheet 182 through the second boss 172; the third boss 173 is bonded to the surface of the first diffuser 181 close to the light guide plate 17, so as to fix the first diffuser 181 through the third boss 173.
[0080] Fig.12 FIG. 4 shows a schematic cross-sectional view of an edge of an optical film material proposed in an embodiment of the present application. Fig.12As shown, the heights of the first boss 171, the second boss 172 and the third boss 173 along the first direction decrease in sequence. Specifically, the height of the first boss 171 along the first direction is greater than the sum of the thicknesses of the first diffuser 181 and the first prism sheet 182; the height of the second boss 172 along the first direction is equal to the distance from the first prism sheet to the light-emitting surface of the light guide plate 17; the height of the third boss 173 along the first direction is equal to the distance from the first diffuser to the light-emitting surface of the light guide plate 17.
[0081] The present application provides a display module, the display module comprising: a display panel, the display panel comprising a display area, and a binding area arranged on one side of the display area, the binding area comprising a first binding surface and a first side surface adjacent to the first binding surface, the first binding surface being used to bind a driver chip, the first side surface connecting the edge of the first binding surface away from the display area; wherein the binding area comprises a test trace, one end of the test trace is connected to the display area, the other end extends to the first side surface, and the end surface of the test trace away from the display area is substantially flush with the first side surface. The present application arranges a test trace end surface substantially flush with the first side surface on the first side surface of the display panel, so that the signals of multiple display panels are connected together through the test trace end surface, thereby realizing simultaneous lighting of multiple display panels to detect yield, thereby improving the efficiency of yield detection.
[0082] Based on the same concept, the embodiment of the present application discloses a display device, and the display device includes the display module described in the embodiment of the present application. It is easy to understand that the display device also includes other structures, such as a front frame, a housing, etc., which are not described in detail here. Since the display device has the back panel assembly in the above embodiment, it has all the beneficial effects of the above back panel assembly, which are not described in detail here.
[0083] In some optional implementations, the display device provided in the embodiments of the present application may be any product or component with a display function. For example, the display device may be a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, and the like.
[0084] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.
[0085] In the description of this specification, it should be understood that the terms "center", "thickness", "up", "down", "front", "back", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.
[0086] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0087] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.
[0088] The above application provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the present application, the parts and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.
[0089] The term "one embodiment", "embodiment" or "one or more embodiments" herein means that a particular feature, structure or characteristic described in conjunction with the embodiment is included in at least one embodiment of the present application. In addition, please note that the examples of the term "in one embodiment" here do not necessarily all refer to the same embodiment.
[0090] In the description provided herein, a large number of specific details are described. However, it is understood that the embodiments of the present application can be practiced without these specific details. In some instances, well-known methods, structures and techniques are not shown in detail so as not to obscure the understanding of this description.
[0091] Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or terminal device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or terminal device. In the absence of further restrictions, the elements defined by the sentence "including one..." do not exclude the existence of other identical elements in the process, method, article or terminal device including the elements.
[0092] The display module and display device provided by the present application are introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for those skilled in the art, according to the idea of the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.
Claims
1. A display module, characterized in that: The display module comprises: A display panel, the display panel comprising a display area, and a binding area arranged on one side of the display area, the binding area comprising a first binding surface and a first side surface adjacent to the first binding surface, the first binding surface being used for binding a driving chip, and the first side surface being connected to an edge of the first binding surface away from the display area; The binding area includes a test line, one end of which is connected to the display area, and the other end of which extends to the first side surface, and an end surface of the test line away from the display area is substantially flush with the first side surface.
2. The display module according to claim 1, characterized in that: At least one binding portion is disposed on the first binding surface, and the binding portion is used for binding and connecting with an external circuit board, and the end surface of the test trace away from the display area has a one-to-one correspondence with the position of the binding portion.
3. The display module according to claim 1, characterized in that: The display panel comprises a display surface, a second side surface and a third side surface, wherein the second side surface and the third side surface are arranged opposite to each other and are respectively in contact with the display surface; The second side surface and the third side surface are located on both sides of the first side surface, and the test traces are respectively arranged close to the second side surface and the third side surface.
4. The display module according to claim 1, characterized in that: The width of the end surface of the test trace away from the display area along the first direction is equal to the width of the first side surface along the first direction, and the first direction is a direction perpendicular to the first binding surface.
5. The display module according to claim 1, characterized in that: The display module further includes a protective tape, wherein the protective tape is attached to at least a portion of the surface of the display module; The protective tape includes a fourth tape adhered to the binding area, the fourth tape includes a first bonding area for adhering to the first side, the first bonding area includes a stacked substrate layer and an insulating material layer, wherein the insulating material layer in the first bonding area is arranged around the end surface of the test trace away from the display area.
6. The display module according to claim 5, characterized in that: A plurality of connection parts are arranged at intervals along the length direction of the display module on the first binding surface; The fourth adhesive tape also includes a second bonding area arranged on one side of the first bonding area, and the second bonding area is used to bond to the first binding surface, wherein the second bonding area includes a plurality of first bonding structures, and the first bonding structures correspond one-to-one to the end surfaces of the test traces away from the display area, and are insulated from each other.
7. The display module according to claim 6, characterized in that: The binding area further includes a second binding surface arranged opposite to the first binding surface, the first side surface is connected to an edge of the second binding surface away from the display area, a circuit board is arranged on the second binding surface, and the circuit board is connected to the connecting portion through a connecting wire; The fourth adhesive tape also includes a third bonding area arranged on the side of the first bonding area away from the second bonding area, and the third bonding area is used to bond to the second binding surface, wherein the third bonding area has a first groove at a position corresponding to the circuit board, and the circuit board is arranged in the first groove.
8. The display module according to claim 7, characterized in that: The third bonding area includes a substrate layer and an insulating material layer which are stacked, and a size of the first groove in the insulating material layer in the third bonding area is smaller than a size of the first groove in the substrate layer in the third bonding area.
9. The display module according to claim 1, characterized in that: The display module further comprises a backlight module, and the backlight module is arranged on a side of the display panel away from the display surface; The backlight module includes a plastic frame, a back plate, and a plurality of light bars located between the side of the back plate and the plastic frame. The display panel is mounted on the plastic frame. The plurality of light bars are connected to an external signal source through light bar connecting lines passing through the plastic frame.
10. The display module according to claim 9, characterized in that: A second groove is formed on the edge of the side of the plastic frame away from the display panel, and the light bar connecting line passes through the plastic frame through the second groove; There is a first gap between the light bar connecting line and the second groove, and a width of the first gap is greater than or equal to 0.1 mm and less than or equal to 0.3 mm.
11. The display module according to claim 10, characterized in that: The display module further comprises a light guide plate, which is arranged between the backlight module and the display panel; The light bar includes a light bar circuit board fixed to the side of the back panel, and a plurality of light bar light sources arranged at intervals on the light bar circuit board, wherein a partition structure is arranged between adjacent light bar light sources on the light bar circuit board, and a surface of the partition structure facing away from the light bar circuit board is attached to the light guide plate, and a gap exists between the light bar light source and the light guide plate.
12. The display module according to claim 9, characterized in that: The plastic frame includes a first plastic frame area, a second plastic frame area, a third plastic frame area and a fourth plastic frame area arranged around the display area, the first plastic frame area is arranged opposite to the second plastic frame area, and the third plastic frame area is arranged opposite to the fourth plastic frame area; A first adhesive layer is respectively provided on the first adhesive frame area and the second adhesive frame area on a side away from the back plate, and a surface of the first adhesive layer close to the adhesive frame is bonded to the adhesive frame; A second adhesive layer is respectively provided on the side of the third adhesive frame area and the fourth adhesive frame area away from the back plate, and the second adhesive layer is bonded to the adhesive frame on a side surface close to the adhesive frame, and is bonded to the display panel on a side surface close to the display panel.
13. The display module according to claim 11, characterized in that: The display module further comprises an optical film material, the optical film material is arranged on a side of the light guide plate away from the back plate, and the optical film material is provided with a through hole; A first boss corresponding to the position of the through hole is protruded on the edge of the light emitting surface of the light guide plate, and the first boss passes through the through hole.
14. The display module according to claim 13, characterized in that: The optical film material comprises a first diffusion sheet and a first prism sheet which are stacked in sequence, and the first diffusion sheet is arranged close to the light guide plate; A second boss and a third boss are convexly provided on the edge of the light emitting surface of the light guide plate, and the heights of the first boss, the second boss and the third boss decrease in sequence along a first direction, and the first direction is a direction perpendicular to the first binding surface; The first diffusion sheet is provided with a first through hole, the second boss passes through the first through hole, and the second boss is bonded to a surface of the first prism sheet close to the light guide plate, and the third boss is bonded to a surface of the first diffusion sheet close to the light guide plate.
15. A display device, characterized in that: The display device comprises the display module according to any one of claims 1 to 14.