Water cooling plate assembly

Abstract

The utility model discloses a water cooling plate assembly which is used for being in thermal contact with a plurality of heat sources. The water cooling plate assembly comprises a first heat dissipation fin, a second heat dissipation fin and a separation sheet. The first heat dissipation fin comprises a first base part and a plurality of first fin parts. The first base part is provided with a first thermal contact surface and a first back surface; the first thermal contact surface is used for thermally contacting a heat source. The first back surface faces away from the first thermal contact surface. The plurality of first fin parts protrude out of the first back surface of the first base part. The second heat dissipation fin comprises a second base part and a plurality of second fin parts. The second base part is provided with a second thermal contact surface and a second back surface; the second thermal contact surface is used for thermally contacting another heat source. The second back face faces away from the second thermal contact face. The second back surface and the first back surface are disposed facing each other. The plurality of second fin parts protrude out of the second back surface of the second base part. The separator connects the sides of the plurality of first fin portions away from the first base portion and the sides of the plurality of second fin portions away from the second base portion.

Description

Technical Field

[0001] The utility model relates to a water cooling plate assembly, in particular to a water cooling plate assembly containing a separator. Background Art

[0002] With the rapid development of technology, computers have gradually become an indispensable necessity in people's lives. The processing speed and performance of electronic devices such as display adapters and processors in computers are gradually improving. When operating, a large amount of heat will be generated, which may cause the electronic devices to overheat and reduce performance, or even cause damage to the electronic devices due to the continuous increase in temperature.

[0003] In order to improve the heat dissipation effect of electronic devices, a water cooling system is usually used to dissipate heat from electronic components. The existing water cooling system is mainly composed of a water cooling head, a water cooling row and a pump. The water cooling row contains heat dissipation fins. Changing the shape of the heat dissipation fins or increasing the size of the heat dissipation fins can increase the reaction area of ​​heat exchange and improve the heat dissipation efficiency of the water cooling system. However, large-sized heat dissipation fins are prone to deformation during manufacturing, resulting in a weaker product structure or poor performance. Therefore, improving the manufacturing yield of heat dissipation fins while maintaining good heat dissipation efficiency has become a problem that researchers in this field are committed to solving. Utility Model Content

[0004] The utility model provides a water cooling plate assembly, so as to improve the manufacturing yield of heat dissipation fins and maintain good heat dissipation efficiency.

[0005] The water-cooled plate assembly disclosed in one embodiment of the utility model is used for thermal contact with multiple heat sources. The water-cooled plate assembly includes a first heat dissipation fin, a second heat dissipation fin and a separator. The first heat dissipation fin includes a first base and multiple first fin parts. The first base has a first thermal contact surface and a first back surface. The first thermal contact surface is used for thermal contact with one of the heat sources. The first back surface is opposite to the first thermal contact surface. Multiple first fin parts protrude from the first back surface of the first base. The second heat dissipation fin includes a second base and multiple second fin parts. The second base has a second thermal contact surface and a second back surface. The second thermal contact surface is used for thermal contact with another heat source. The second back surface is opposite to the second thermal contact surface. The second back surface and the first back surface are arranged facing each other. Multiple second fin parts protrude from the second back surface of the second base. The separator connects the side of the multiple first fin parts away from the first base and the side of the multiple second fin parts away from the second base.

[0006] The above-mentioned water-cooled plate assembly, wherein the first heat dissipation fin further includes two outer wall portions, the two outer wall portions are located on opposite sides of the first base portion, protrude from the first back side of the first base portion, and are connected to the second back side of the second base portion of the second heat dissipation fin.

[0007] The above-mentioned water-cooled plate assembly, wherein the first fin portions are arranged in parallel with the two outer wall portions and form a first cooling channel between any two first fin portions, the second fin portions are arranged in parallel with the two outer wall portions and form a second cooling channel between any two second fin portions, and the first cooling channel and the second cooling channel are not connected to each other through the separator.

[0008] In the above-mentioned water-cooling plate assembly, the first cooling channel and the second cooling channel are used for a cooling fluid to flow.

[0009] In the above-mentioned water-cooling plate assembly, the two opposite sides of the separation plate are respectively connected to the first fin parts and the second fin parts by welding.

[0010] In the above-mentioned water-cooling plate assembly, each first fin portion has a first bending portion, and each second fin portion has a second bending portion, and opposite sides of the separator are respectively connected to the first bending portions and the second bending portions by welding.

[0011] In the above-mentioned water-cooling plate assembly, the two outer wall portions of the first heat dissipation fins are joined to the second base portion of the second heat dissipation fins by welding.

[0012] In the above-mentioned water-cooling plate assembly, the first fin portions and the second fin portions are skived fins.

[0013] In the above-mentioned water-cooling plate assembly, the separator is made of copper.

[0014] In the above-mentioned water-cooling plate assembly, the first fin parts and the first base part are an integrally formed structure, and the second fin parts and the second base part are an integrally formed structure.

[0015] According to the water-cooled plate assembly of the above embodiment, the separator connects the first fin parts and the second fin parts of two relatively short sizes, which can avoid the problem that the fins are easily deformed during the manufacturing process due to their large size. In addition, the first thermal contact surface and the second thermal contact surface can contact the heat source respectively, and the heat can be released at different sides of the water-cooled plate assembly at the same time, thereby improving the heat dissipation capacity of the water cooling system.

[0016] The above description of the content of the utility model and the following description of the implementation mode are used to demonstrate and explain the principle of the utility model, and provide a further explanation of the scope of the patent application of the utility model. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a three-dimensional diagram of a water cooling plate assembly disclosed according to an embodiment of the present invention.

[0018] Figure 2 for Figure 1 Exploded diagram of .

[0019] Figure 3 for Figure 1 Floor plan.

[0020] Figure 4 for Figure 1 Cross-sectional view of .

[0021] Figure 5 It is a plan view of a water cooling plate assembly disclosed according to an embodiment of the present utility model.

[0022] Wherein, the reference numerals are:

[0023] 10: Water cooling plate assembly

[0024] 100: First heat sink fin

[0025] 110: First base

[0026] 111: first thermal contact surface

[0027] 112: First back

[0028] 120: first fin portion

[0029] 121: first bending portion

[0030] 130:Exterior wall

[0031] 200: Second heat sink fin

[0032] 210: Second base

[0033] 211: Second thermal contact surface

[0034] 212: Second back

[0035] 220: Second fin portion

[0036] 221: Second bending portion

[0037] 300:Separator

[0038] D1,D2: Direction

[0039] F: Cooling fluid

[0040] S1: First cooling channel

[0041] S2: Second cooling channel DETAILED DESCRIPTION

[0042] See also Figures 1 to 3 . Figure 1 FIG. 1 is a plan view of a water cooling plate assembly 10 according to an embodiment of the present invention. Figure 2 for Figure 1 Stereoscopic diagram. Figure 3 for Figure 1 In this embodiment, the water-cooling plate assembly 10 is used to thermally contact multiple heat sources (not shown). The water-cooling plate assembly 10 includes a first heat dissipation fin 100 , a second heat dissipation fin 200 and a separator 300 .

[0043] In this embodiment, the first heat sink 100 includes a first base 110 and a plurality of first fins 120. The first base 110 has a first thermal contact surface 111 and a first back surface 112. The first thermal contact surface 111 is used for thermal contact with a heat source (not shown). The first back surface 112 faces away from the first thermal contact surface 111. The plurality of first fins 120 protrude from the first back surface 112 of the first base 110. The second heat sink 200 includes a second base 210 and a plurality of second fins 220. The second base has a second thermal contact surface 211 and a second back surface 212. The second thermal contact surface 211 is used for thermal contact with a heat source (not shown). The second back surface 212 faces away from the second thermal contact surface 211. The second back surface 212 and the first back surface 112 are arranged facing each other. The plurality of second fins 220 protrude from the second back surface 212 of the second base 210.

[0044] In this embodiment, the plurality of first fin portions 120 and the plurality of second fin portions 220 may be, for example, skived fins, that is, the first fin portion 120 and the first base portion 110 are integrally formed structures, and the second fin portion 220 and the second base portion 210 are also integrally formed structures, but the present invention is not limited thereto. In other embodiments, the fin portion may also be a joint type fin or an aluminum extruded fin.

[0045] In this embodiment, one side of the separator 300 is connected to the side of the plurality of first fins 120 away from the first base 110 by welding, and the other side of the separator 300 is connected to the side of the plurality of second fins 220 away from the second base 210 by welding, so as to avoid the problem that the fins are easily deformed during the manufacturing process due to their oversized size. The separator 300 is made of metal such as copper, for example.

[0046] In this embodiment, the first heat dissipation fin 100 may also include two outer wall portions 130, which are located on opposite sides of the first base 110, protrude from the first back side 112 of the first base 110, and are joined to the second back side 212 of the second base 210, for example by welding.

[0047] In this embodiment, the first fins 120 are arranged in parallel with the two outer wall portions 130, and a first cooling channel S1 is formed between any two first fins 120. Similarly, the second fins 220 are arranged in parallel with the two outer wall portions 130, and a second cooling channel S2 is formed between any two second fins 220.

[0048] In this embodiment, the first cooling channel S1 and the second cooling channel S2 are used for a cooling fluid F to flow, and the first cooling channel S1 and the second cooling channel S2 are disconnected from each other by the separator 300, so that the two heat sources (not drawn) in thermal contact with the first thermal contact surface 111 and the second thermal contact surface 211 can be cooled at the same time, thereby improving the heat dissipation capacity of the water-cooled plate assembly 10.

[0049] See also Figure 4 . Figure 4 for Figure 1 The cooling fluid F can flow into the first cooling channel S1 and the second cooling channel S2 along directions D1 and D2 respectively, and dissipate heat from the heat source (not shown) in thermal contact with the first thermal contact surface 111 and the second thermal contact surface 211, thereby improving the heat dissipation capacity of the water-cooled plate assembly 10.

[0050] See also Figure 5 . Figure 5 It is a schematic diagram of a water-cooled plate assembly disclosed according to an embodiment of the utility model. In this embodiment, each first fin portion 120 has a first bending portion 121, and each second fin portion 220 has a second bending portion 221. The bending portion is located on the side of the fin portion away from the base. One side of the separator 300 is connected to multiple first bending portions 121, for example, by welding, and the other side of the separator 300 is connected to multiple second bending portions 221, for example, by welding. The contact area between the fin portion and the separator 300 is increased by the bending portion, and the welding strength between the fin and the separator 300 is improved, so as to avoid deformation or cold welding of the fin during the manufacturing process, which may lead to a weak structure or poor performance.

[0051] According to the water-cooled plate assembly of the above embodiment, the separator connects the first fin parts and the second fin parts of two relatively short sizes, which can avoid the problem that the fins are easily deformed during the manufacturing process due to the oversized size. In addition, the first thermal contact surface and the second thermal contact surface can contact the heat source respectively, and the heat can be released at the different sides of the water-cooled plate assembly at the same time, thereby improving the heat dissipation capacity of the water cooling system.

[0052] Although the present invention is disclosed as above with the aforementioned embodiments, it is not intended to limit the present invention. Any relevant technician familiar with the art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the patent protection scope of the present invention shall be determined by the protection scope of the claims attached to the present invention.

Claims

1. A water cooling plate assembly, characterized in that: For thermal contact with multiple heat sources, including: A first heat sink fin, comprising: a first base having a first thermal contact surface and a first back surface, wherein the first thermal contact surface is used for thermally contacting one of the heat sources, and the first back surface faces away from the first thermal contact surface; and A plurality of first fin portions, the first fin portions protruding from the first back surface of the first base; a second heat dissipation fin, comprising: a second base having a second thermal contact surface and a second back surface, wherein the second thermal contact surface is used for thermally contacting another heat source, the second back surface faces away from the second thermal contact surface, and the second back surface and the first back surface are disposed facing each other; and a plurality of second fin portions, the second fin portions protruding from the second back surface of the second base; and A separator connects a side of the first fin portions away from the first base portion and a side of the second fin portions away from the second base portion.

2. The water-cooling plate assembly according to claim 1, characterized in that: The first heat dissipation fin further includes two outer wall portions, which are located at opposite sides of the first base portion, protrude from the first back side of the first base portion, and are connected to the second back side of the second base portion of the second heat dissipation fin.

3. The water-cooling plate assembly according to claim 2, characterized in that: The first fin portions are arranged in parallel with the two outer wall portions and form a first cooling channel between any two first fin portions, the second fin portions are arranged in parallel with the two outer wall portions and form a second cooling channel between any two second fin portions, and the separator makes the first cooling channel and the second cooling channel disconnected from each other.

4. The water-cooling plate assembly according to claim 3, characterized in that: The first cooling channel and the second cooling channel are used for a cooling fluid to flow.

5. The water-cooling plate assembly according to claim 1, characterized in that: The opposite sides of the separator are respectively connected to the first fin parts and the second fin parts by welding.

6. The water cooling plate assembly according to claim 1, characterized in that: Each first fin portion has a first bending portion, and each second fin portion has a second bending portion. The opposite sides of the separator are respectively connected to the first bending portions and the second bending portions by welding.

7. The water cooling plate assembly according to claim 2, characterized in that: The two outer wall portions of the first heat dissipation fin are joined to the second base portion of the second heat dissipation fin by welding.

8. The water cooling plate assembly according to claim 1, characterized in that: The first fin portions and the second fin portions are skived fins.

9. The water cooling plate assembly according to claim 1, characterized in that: The separator is made of copper.

10. The water cooling plate assembly according to claim 1, characterized in that: The first fin portions and the first base portion are integrally formed structures, and the second fin portions and the second base portion are integrally formed structures.

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