Computer case heat dissipation device with water cooling function

Abstract

The utility model relates to the technical field of computers, in particular to a computer case heat dissipation device with a water cooling function, and solves the problems that in the prior art, when facing a large amount of heat generated by a high-performance computer, the air cooling technology is often out of effort, and the heat dissipation effect is limited. Especially in a closed or high-temperature environment, the heat dissipation effect of an air cooling technology is greatly reduced, and the heat dissipation requirement of a modern high-performance computer is difficult to meet. A computer case heat dissipation device with a water cooling function comprises a case and a mounting plate. An opening is formed in one side of the case, the mounting plate is arranged at the position of the opening, and one side of the mounting plate is detachably connected with the side wall of the case; a plurality of mounting grooves are formed in one side of the mounting plate, and semiconductor refrigeration plates are connected into the mounting grooves. The computer case is reasonable in structure, the interior of the computer case can be conveniently and rapidly cooled through cold air, the defect of air cooling is overcome, and cooling quality and efficiency are improved by combining refrigeration.

Description

Technical Field

[0001] The utility model relates to the technical field of computers, in particular to a computer case heat dissipation device with a water cooling function. Background Art

[0002] With the rapid development of computer technology, computer performance has been continuously improved, but it is also accompanied by the problem of heat generation. Especially when running at high load, the internal components of the computer, such as the central processing unit (CPU) and graphics processing unit (GPU), will generate a lot of heat. If this heat cannot be dissipated in time and effectively, it will cause the computer performance to decline, and even cause hardware damage, seriously affecting the stability and service life of the computer.

[0003] Traditional computer cases usually rely on air cooling technology to dissipate heat, that is, using fans to dissipate heat inside the case. However, air cooling technology often seems to be powerless when faced with the large amount of heat generated by high-performance computers, and the heat dissipation effect is limited. Especially in a closed or high-temperature environment, the heat dissipation effect of air cooling technology is greatly reduced, and it is difficult to meet the heat dissipation needs of modern high-performance computers. Utility Model Content

[0004] The purpose of the utility model is to provide a computer case heat dissipation device with water cooling function, which solves the problem that the air cooling technology in the prior art is often unable to cope with the large amount of heat generated by high-performance computers, and the heat dissipation effect is limited. Especially in a closed or high-temperature environment, the heat dissipation effect of the air cooling technology is greatly reduced, and it is difficult to meet the heat dissipation requirements of modern high-performance computers.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A computer case heat dissipation device with water cooling function, comprising a case and a mounting plate;

[0007] An opening is provided on one side of the chassis, a mounting plate is arranged at the opening, and one side of the mounting plate is detachably connected to a side wall of the chassis;

[0008] A plurality of mounting grooves are provided on one side of the mounting plate, and semiconductor refrigeration plates are connected inside the mounting grooves. An internal frame is connected to one side of the mounting plate close to the chassis, and an external frame is connected to the other side of the mounting plate.

[0009] A plurality of supply fans are installed on one side of the inner frame, a plurality of heat dissipation fans are installed on one side of the outer frame, and a plurality of air inlet slots are provided on the top and bottom of one side of the mounting plate.

[0010] Preferably, the size of the outer frame is smaller than the size of the inner frame.

[0011] Preferably, the length of the outer frame is smaller than the distance between the two air inlet slots, and the length of the inner frame is larger than the distance between the two air inlet slots.

[0012] Preferably, positioning plates are fixedly connected to both sides of the internal frame, and a plurality of positioning holes are formed on one side of the positioning plates.

[0013] Preferably, a magnet plate is connected to the top and bottom of one side of the mounting plate, a dustproof plate is provided on one side of the air inlet slot, a magnet block is connected to one side of the dustproof plate, and the dustproof plate is magnetically connected to the magnet plate through the magnet block.

[0014] Preferably, round rods are provided at the four corners of one side of the mounting plate, one end of the round rod passes through the mounting plate through a sleeve and is connected to a positioning screw, and the other end is connected to a handle, and one end of the positioning screw is fixedly connected to the side wall bolt of the chassis.

[0015] The utility model has at least the following beneficial effects:

[0016] The arrangement of the mounting groove facilitates the installation of the semiconductor refrigeration plate. The refrigeration end of the semiconductor refrigeration plate performs refrigeration. The cold air is sent into the interior of the chassis by the supply fan. The interior of the chassis is cooled by the cold wind. The heat dissipation fan can dissipate the heat at the heating end of the semiconductor refrigeration plate to prevent heat from entering the interior of the chassis. The reasonable structure facilitates rapid cooling of the interior of the chassis by the cold wind, solves the drawbacks of air cooling, and improves the heat dissipation and cooling quality and efficiency by combining refrigeration.

[0017] The utility model also has the following beneficial effects:

[0018] The setting of the external frame and the internal frame facilitates the connection and installation of the supply fan and the cooling fan. The setting of the length of the external frame being less than the distance between the two air inlet slots prevents the heat from the heating end of the semiconductor refrigeration plate from entering the interior of the chassis through the air inlet slot. The setting of the positioning plate and the positioning hole facilitates the connection between the internal frame and the mounting plate. The setting of the dustproof plate and the magnet plate allows the dustproof plate to be quickly set to prevent dust from entering the interior of the chassis. The setting of the round rod and the handle allows the round rod and the positioning screw to be rotated by turning the handle. The positioning screw is connected to the chassis to quickly connect the mounting plate to one side of the chassis. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 It is a schematic diagram of the structure of the utility model;

[0021] Figure 2 This is a schematic diagram of the internal frame structure of the utility model;

[0022] Figure 3 This is a schematic diagram of the structure of the positioning plate of the utility model;

[0023] Figure 4 This is a schematic diagram of the positioning screw structure of the utility model;

[0024] Figure 5 This is a schematic diagram of the structure of the mounting plate of the utility model.

[0025] In the figure: 1. Chassis; 2. Mounting plate; 3. Cooling fan; 4. External frame; 5. Internal frame; 6. Supply fan; 7. Air inlet slot; 8. Positioning screw; 9. Semiconductor refrigeration plate; 10. Positioning hole; 11. Positioning plate; 12. Round rod; 13. Handle; 14. Mounting slot; 15. Magnet plate; 16. Dustproof plate. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0027] Reference Figure 1-5 , a computer case heat dissipation device with water cooling function, comprising a case 1 and a mounting plate 2;

[0028] An opening is provided on one side of the chassis 1, and a mounting plate 2 is arranged at the opening position, and one side of the mounting plate 2 is detachably connected to a side wall of the chassis 1;

[0029] A plurality of mounting grooves 14 are provided on one side of the mounting plate 2, and a semiconductor refrigeration plate 9 is connected inside the mounting groove 14. The side of the mounting plate 2 close to the chassis 1 is connected to the internal frame 5, and the other side is connected to the external frame 4.

[0030] A plurality of supply fans 6 are installed on one side of the internal frame 5, a plurality of cooling fans 3 are installed on one side of the external frame 4, and a plurality of air inlet slots 7 are provided on the top and bottom of one side of the mounting plate 2. Specifically, through the setting of the mounting slot 14, it is convenient to install the semiconductor refrigeration plate 9, and the cooling end of the semiconductor refrigeration plate 9 is cooled. The cold air is sent into the interior of the chassis 1 through the supply fan 6, and the interior of the chassis 1 is cooled by the cold wind. The heating end of the semiconductor refrigeration plate 9 can be dissipated by the cooling fan 3 to prevent heat from entering the interior of the chassis 1. The structure is reasonable, which is convenient for realizing rapid cooling of the interior of the chassis 1 by cold wind, thereby solving the disadvantages of air cooling and improving the heat dissipation and cooling quality and efficiency in combination with refrigeration.

[0031] Furthermore, the size of the outer frame 4 is smaller than the size of the inner frame 5 .

[0032] Furthermore, the length of the outer frame 4 is smaller than the distance between the two air inlet slots 7 , and the length of the inner frame 5 is larger than the distance between the two air inlet slots 7 .

[0033] Furthermore, positioning plates 11 are fixedly connected to both sides of the internal frame 5 , and a plurality of positioning holes 10 are formed on one side of the positioning plate 11 .

[0034] Furthermore, a magnet plate 15 is connected to the top and bottom of one side of the mounting plate 2, a dustproof plate 16 is provided on one side of the air inlet slot 7, and a magnet block is connected to one side of the dustproof plate 16. The dustproof plate 16 is magnetically connected to the magnet plate 15 via the magnet block.

[0035] Furthermore, round rods 12 are provided at the four corners of one side of the mounting plate 2. One end of the round rod 12 passes through the mounting plate 2 through a sleeve and is connected to a positioning screw 8, and the other end is connected to a handle 13. One end of the positioning screw 8 is fixedly connected to the side wall bolt of the chassis 1.

[0036] To sum up: the setting of the external frame 4 and the internal frame 5 facilitates the connection and installation of the supply fan 6 and the cooling fan 3. The setting of the length of the external frame 4 being less than the distance between the two air inlet slots 7 prevents the heat from the heating end of the semiconductor refrigeration plate 9 from entering the interior of the chassis 1 through the air inlet slots 7. The setting of the positioning plate 11 and the positioning hole 10 facilitates the connection between the internal frame 5 and the mounting plate 2. The setting of the dustproof plate 16 and the magnet plate 15 allows the dustproof plate 16 to be quickly set to prevent dust from entering the interior of the chassis 1. The setting of the round rod 12 and the handle 13 allows the handle 13 to be turned to drive the round rod 12 and the positioning screw 8 to rotate. The positioning screw 8 is connected to the chassis 1 to achieve the quick connection of the mounting plate 2 to one side of the chassis 1.

[0037] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and the specification only describe the principles of the utility model. The utility model may be subject to various changes and improvements without departing from the spirit and scope of the utility model. These changes and improvements fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A computer case heat dissipation device with water cooling function, characterized in that: include: A chassis (1) and a mounting plate (2); One side of the chassis (1) is provided with an opening, the mounting plate (2) is arranged at the opening, and one side of the mounting plate (2) is detachably connected to the side wall of the chassis (1); A plurality of mounting grooves (14) are provided on one side of the mounting plate (2), and a semiconductor refrigeration plate (9) is connected inside the mounting groove (14); one side of the mounting plate (2) close to the chassis (1) is connected to an internal frame (5), and the other side is connected to an external frame (4); A plurality of supply fans (6) are installed on one side of the internal frame (5), a plurality of cooling fans (3) are installed on one side of the external frame (4), and a plurality of air inlet slots (7) are provided on the top and bottom of one side of the mounting plate (2).

2. A computer case heat dissipation device with water cooling function according to claim 1, characterized in that: The size of the outer frame (4) is smaller than the size of the inner frame (5).

3. A computer case heat dissipation device with water cooling function according to claim 2, characterized in that: The length of the external frame (4) is smaller than the distance between the two air inlet slots (7), and the length of the internal frame (5) is larger than the distance between the two air inlet slots (7).

4. The computer case heat dissipation device with water cooling function according to claim 1, characterized in that: Positioning plates (11) are fixedly connected to both sides of the internal frame (5), and a plurality of positioning holes (10) are provided on one side of the positioning plate (11).

5. A computer case heat dissipation device with water cooling function according to claim 4, characterized in that: A magnet plate (15) is connected to the top and bottom of one side of the mounting plate (2), a dustproof plate (16) is provided on one side of the air inlet slot (7), a magnet block is connected to one side of the dustproof plate (16), and the dustproof plate (16) is magnetically connected to the magnet plate (15) via the magnet block.

6. The computer case heat dissipation device with water cooling function according to claim 1, characterized in that: Round rods (12) are provided at the four corners of one side of the mounting plate (2); one end of the round rod (12) passes through the mounting plate (2) via a shaft sleeve and is connected to a positioning screw (8); the other end is connected to a handle (13); one end of the positioning screw (8) is fixedly connected to a side wall bolt of the chassis (1).

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