Display device

Abstract

The utility model relates to a display device, and relates to the field of display technology, the display device comprises a substrate, a packaging cover, a chip, an FPC wiring board and a conductive circuit layer arranged between the substrate and the packaging cover, the substrate comprises a display area and a binding area, the display area and the binding area are jointly used for arranging the conductive circuit layer, and the packaging cover is arranged on the packaging cover. The packaging cover is arranged in the display area, and the chip and the FPC wiring board are arranged in the binding area and are electrically connected with the conductive circuit layer; the packaging structure further comprises a protective cover arranged in the binding area, and the protective cover is connected with the conductive circuit layer so as to package the chip in the protective cover. According to the display device, the chip is packaged in the protective cover additionally arranged to achieve the effect of protecting the chip, the binding area can be changed into a double-layer glass structure from an original single-layer glass structure by additionally arranging the protective cover, and therefore the effect of improving the strength of the binding area of the display device is achieved; the problem that a screen is broken and fails due to the fact that a binding area is prone to stress in operation or assembly of the display device is solved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display device. Background Art

[0002] OLED is a current-type organic conductive circuit layer. Its basic structure is composed of a glass substrate, an organic conductive circuit layer, a packaging cover, an IC, and an FPC. The current structure of the OLED display module is to encapsulate the organic conductive circuit layer between two layers of glass through a glass substrate and a glass packaging cover. Since the display module needs to bind the IC and the FPC, the size of the glass packaging cover is generally 2.5 to 5 mm smaller than the size of the glass substrate to bond the IC and the FPC. This area is usually called the step surface. Since the step surface of the glass substrate is a single layer of glass with wiring on it, the thickness of the glass substrate is generally between 0.5 mm and 1 mm, which is relatively thin. Therefore, there is a problem that the step surface glass is easily broken by certain stresses during production line operation or customer assembly, thereby causing the module display to fail.

[0003] The existing technology usually adopts the method of coating a layer of soft silicone on the step surface of the display module. The main function of this layer of soft silicone is to prevent water from entering and protect the circuit and bonding area of ​​the step surface from being corroded by water and oxygen, thereby increasing the service life of the module. However, it does not increase the compressive strength of the step surface. Therefore, the step surface of the existing OLED display module is still relatively susceptible to stress damage during assembly and operation, resulting in failure of the display module. Utility Model Content

[0004] In order to solve the problem of display module failure caused by the step surface being broken under stress during operation or assembly, the present application provides a display device.

[0005] The present application provides a display device that adopts the following technical solution:

[0006] A display device comprises a substrate, a packaging cover, a chip, an FPC wiring board and a conductive circuit layer arranged between the substrate and the packaging cover, wherein the substrate comprises a display area and a binding area, the display area and the binding area are used together for the conductive circuit layer to be arranged, the packaging cover is arranged in the display area, the chip and the FPC wiring board are arranged in the binding area and are electrically connected to the conductive circuit layer; and further comprises a protective cover arranged in the binding area, the protective cover is connected to the conductive circuit layer to encapsulate the chip therein.

[0007] By adopting the above-mentioned technical solution, the present application sets a protective cover in the binding area, and encapsulates the chip inside through the protective cover, so as to achieve the effect of protecting the chip, and utilizes the design of adding a protective cover to enable the binding area to be changed from the original single-layer glass structure to a double-layer glass structure, thereby achieving the effect of improving the strength of the binding area of ​​the display device, and solving the problem that the binding area of ​​the display device is easily subjected to stress during operation or assembly, resulting in broken screen failure.

[0008] In a specific possible implementation manner, the protective cover is provided with a groove, the chip is inserted into the groove, and the groove allows the protective cover to avoid the chip.

[0009] By adopting the above technical solution and utilizing the groove on the protective cover, when the protective cover is used for packaging, the groove can allow the protective cover to avoid the chip to prevent the chip from being crushed, and the protective cover can better protect the chip after installation to reduce the risk of chip breakage.

[0010] In a specific possible implementation manner, a gap is left between the outer wall of the chip and the inner wall of the groove.

[0011] By adopting the above technical solution, the protective cover may be displaced during the installation process. By leaving a gap between the outer wall of the chip and the inner wall of the groove, the setting of the gap can provide a certain safety distance during the installation of the protective cover to prevent the protective cover from being displaced and crushing the chip during the installation process.

[0012] In a specific possible implementation manner, a buffer pad is provided on the inner wall of the groove on one side close to the chip.

[0013] By adopting the above technical solution, the protective cover may be offset during the installation process. At this time, the buffer pad set in the groove can prevent the protective cover from directly contacting the chip and prevent the protective cover from being offset and crushing the chip during the installation process.

[0014] In a specific possible implementation manner, the protection cover extends to the FPC wiring board and is connected thereto, the protection cover is fitted with the packaging cover, and the sum of the lengths of the protection cover and the packaging cover is equal to the length of the substrate.

[0015] By adopting the above technical solution and utilizing the above design method, the aesthetic appearance requirements of the display device can be met while improving the strength of the binding area, so that the outer edge of the entire display device is neat and beautiful.

[0016] In a specific possible implementation manner, the protection cover is connected to the FPC wiring board and the conductive circuit layer through a packaging adhesive layer.

[0017] By adopting the above technical solution, the protective cover is connected to the FPC wiring board and the conductive circuit layer by using the packaging adhesive layer. The packaging adhesive layer has good adhesion effect and can prevent water vapor from entering. While protecting the circuit on the binding area, the binding area protective cover can also be tightly attached to the conductive circuit layer and the FPC wiring board at this position, thereby achieving the purpose of encapsulating the chip.

[0018] In a specific possible implementation scheme, a support portion is further provided on the binding area, and the support portion is provided between the chip and the FPC wiring board. The support portion is flush with a surface of the FPC wiring board away from the conductive circuit layer, and the support portion is connected to the protective cover and provides support.

[0019] By adopting the above technical solution, during the process of installing the protective cover, the support part arranged on the binding area is utilized. The support part is arranged between the chip and the FPC wiring board and connected to the protective cover. The support part can provide support for the FPC wiring board, thereby reducing the pressure on the FPC wiring board and providing additional protection for the FPC wiring board.

[0020] In a specific implementation manner, a surface of the support portion away from the chip is fitted with the FPC wiring board, and a surface of the support portion close to the chip is flush with an inner wall of the groove away from the packaging cover.

[0021] By adopting the above technical solution and utilizing the above design method, it is possible to provide better support for the FPC wiring board, thereby further reducing the pressure on the FPC wiring board.

[0022] In a specific possible implementation manner, a gasket is further provided between the protective cover and the FPC wiring board.

[0023] By adopting the above technical solution, during the installation of the protective cover, the gasket provided between the protective cover and the FPC wiring board can reduce the pressure of the protective cover on the FPC wiring board and disperse the force, thereby preventing the FPC from being damaged by excessive pressure.

[0024] In a specific possible implementation manner, the height of the protection cover is equal to the height of the packaging cover, and the protection cover is flush with a surface of a side of the packaging cover away from the conductive circuit layer.

[0025] By adopting the above technical solution and utilizing the above design method, the aesthetic appearance requirements of the display device can be met while improving the strength of the binding area, and the outer edge of the entire display device can be further made neat, thereby further improving the aesthetic effect.

[0026] In summary, the present application includes at least one of the following beneficial technical effects:

[0027] 1. The present application uses a protective cover to be set in the binding area, and the chip is encapsulated inside the protective cover, so as to achieve the effect of protecting the chip. In addition, the design of adding a protective cover allows the binding area to be changed from the original single-layer glass structure to a double-layer glass structure, thereby achieving the effect of improving the strength of the binding area of ​​the display device, and solving the problem that the binding area of ​​the display device is easily subjected to stress during operation or assembly, resulting in broken screen failure;

[0028] 2. The present application utilizes the setting of the groove on the protective cover. When the protective cover is used for packaging, the groove can allow the protective cover to avoid the chip to prevent the chip from being crushed, and the protective cover can better protect the chip after installation to reduce the risk of chip breakage;

[0029] 3. The present application realizes chip encapsulation by the protective cover through the encapsulation adhesive layer. The encapsulation adhesive layer not only has a water vapor-proof effect, but also has a sticky effect. While protecting the circuit of the binding area, the protective cover can also be tightly attached to the binding area. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic diagram of the structure of the display device in the first embodiment of the present application.

[0031] Figure 2 It is a schematic diagram of the structure of the display device in the second embodiment of the present application.

[0032] Figure 3 It is a schematic diagram of the structure of the display device in the third embodiment of the present application.

[0033] Figure 4 yes Figure 3 Enlarged view of part A in the middle.

[0034] Figure 5 It is a schematic diagram of the structure of the display device in the fourth embodiment of the present application.

[0035] Figure 6 yes Figure 5 Enlarged view of part B in the middle.

[0036] Explanation of the reference numerals: 1. substrate; 2. conductive circuit layer; 21. ITO layer; 22. metal layer; 3. packaging cover; 4. chip; 5. FPC wiring board; 6. protective cover; 61. groove; 62. gap; 7. packaging glue layer; 8. buffer pad; 9. pad; 10. support part; 11. polarizer; 12. organic material layer. DETAILED DESCRIPTION

[0037] The following is combined with Figure 1-6 This application is described in further detail.

[0038] Example 1

[0039] Reference Figure 1The embodiment of the present application discloses a display device. In the embodiment, the display device of the present application can be but is not limited to an OLED display device. The display device includes a substrate 1, a packaging cover 3, a chip 4, an FPC wiring board 5, and a conductive circuit layer 2 arranged between the substrate 1 and the packaging cover 3. The substrate 1 and the packaging cover 3 are made of glass. The substrate 1 includes a display area and a binding area. The display area and the binding area are used to provide the conductive circuit layer 2. In the embodiment, the conductive circuit layer 2 includes an ITO layer 21 and a metal layer 22 stacked on the substrate 1 from bottom to top. The conductive circuit layer 2 located in the display area is An organic material layer 12 is provided on the circuit layer 2, a packaging cover 3 is provided on the back of the display area and encapsulates the organic material layer 12 therein, the packaging cover 3 is connected to the conductive circuit layer 2 of the display area by a packaging glue, the chip 4 and the FPC wiring board 5 are provided in the binding area and electrically connected to the conductive circuit layer 2, in this embodiment, the chip 4 is provided between the FPC wiring board 5 and the packaging cover 3, the chip 4 sequentially passes through the metal layer 22 and the ITO layer 21 and is electrically connected to the metal layer 22 and the ITO layer 21 to achieve binding, one side of the FPC wiring board 5 is electrically connected and bound to the metal layer 22 of the conductive circuit layer 2, and the other side extends out of the substrate 1;

[0040] In this embodiment, a polarizer 11 is further provided on the side of the substrate 1 away from the conductive circuit layer 2. In the display device of the present application, the polarizer 11 can help adjust the transmission direction of light, so that it matches other optical elements and achieves a better display effect.

[0041] The display device further includes a protective cover 6 disposed in the binding area, the protective cover 6 is connected to the conductive circuit layer 2 to encapsulate the chip 4 therein, in this embodiment, the material of the protective cover 6 is glass, and the material selection of the protective cover 6 needs to control its weight to avoid excessive pressure on the chip 4, and also needs to select a glass material with good light transmittance;

[0042] The protective cover 6 is provided with a groove 61, and the chip 4 is inserted into the groove 61. The groove 61 allows the protective cover 6 to avoid the chip 4; when installing the protective cover 6, the groove 61 can allow the protective cover 6 to avoid the chip 4 to prevent the chip 4 from being crushed, and the protective cover 6 can better protect the chip 4 after installation, reducing the risk of chip 4 being broken;

[0043] A gap 62 is left between the outer wall of the chip 4 and the inner wall of the groove 61; during the installation of the protective cover 6, the protective cover 6 may be offset. By using the gap 62 left between the outer wall of the chip 4 and the inner wall of the groove 61, the setting of the gap 62 can provide a certain safety distance during the installation of the protective cover 6, thereby preventing the protective cover 6 from being offset and crushing the chip 4 during the installation process;

[0044] During the manufacturing process, a conductive circuit layer 2 is arranged on the substrate 1. Specifically, an ITO layer 21 and a metal layer 22 are sequentially stacked on the substrate 1. The ITO layer 21 and the metal layer 22 are arranged along the display area and the binding area of ​​the entire substrate 1. A polarizer 11 is arranged on the side of the substrate 1 away from the conductive circuit layer 2. The conductive circuit layer 2 in the display area is encapsulated in the substrate 1 through the encapsulation cover 3. Then, the chip 4 and the FPC wiring board 5 are bound in the binding area. The chip 4 passes through the ITO layer 21 and the metal layer 22 and is electrically connected and bound. The FPC wiring board 5 is arranged on the metal layer 22 and is electrically connected and bound. Then, The chip 4 is encapsulated with a protective cover 6, a packaging glue layer 7 is applied on the conductive circuit layer 2, and the protective cover is covered on the chip 4. The chip 4 is inserted into the groove 61, and the protective cover is bonded and connected to the conductive circuit layer 2 through the packaging glue layer 7, so that the chip 4 is encapsulated therein; thereby achieving the effect of protecting the chip 4, and by adding the design of the protective cover 6, the binding area can be changed from the original single-layer glass structure to a double-layer glass structure, thereby achieving the effect of improving the strength of the binding area of ​​the display device, and solving the problem that the binding area of ​​the display device is susceptible to stress during operation or assembly, resulting in broken screen failure.

[0045] The protective cover 6 extends onto the FPC wiring board 5 and is connected thereto. In this embodiment, the FPC wiring board 5 has a certain degree of flexibility. The protective cover 6 is fitted with the packaging cover 3, and the sum of the lengths of the protective cover 6 and the packaging cover 3 is equal to the length of the substrate 1. Through the above design, the aesthetic appearance requirements of the display device can be met while improving the strength of the binding area, so that the outer edge of the entire display device is neat and beautiful.

[0046] The height of the protective cover 6 is equal to the height of the packaging cover 3. The protective cover 6 is flush with the surface of the side of the packaging cover 3 away from the conductive circuit layer 2. In this embodiment, the thickness range of the protective cover 6 and the packaging cover 3 includes but is not limited to 0.5 mm-1.5 mm. This thickness range can meet the requirements of protection and optical performance. Through the above design method, the aesthetic appearance requirements of the display device can be met while improving the strength of the binding area, and the outer edge of the entire display device can be further made neat, further improving the aesthetic effect.

[0047] The protective cover 6 is connected to the FPC wiring board 5 and the conductive circuit layer 2 through the packaging glue layer 7; the protective cover 6 is connected to the FPC wiring board 5 and the conductive circuit layer 2 through the packaging glue layer 7. The packaging glue layer 7 has a good adhesion effect and can prevent water vapor from entering. While protecting the circuit in the binding area, the binding area protective cover 6 can also be tightly attached to the conductive circuit layer 2 and the FPC wiring board 5 at this position, thereby achieving the purpose of encapsulating the chip 4.

[0048] The implementation principle of Example 1 is as follows: the present application mainly encapsulates the chip 4 by means of the additional protective cover 6 to achieve the effect of protecting the chip 4, and through the design of the additional protective cover 6, the binding area can be changed from the original single-layer glass structure to a double-layer glass structure, thereby achieving the effect of improving the strength of the binding area of ​​the display device, and solving the problem that the binding area of ​​the display device is susceptible to stress during operation or assembly, resulting in broken screen failure;

[0049] During the manufacturing process, a conductive circuit layer 2 is arranged on the substrate 1. Specifically, an ITO layer 21 and a metal layer 22 are sequentially stacked on the substrate 1. The ITO layer 21 and the metal layer 22 are arranged along the display area and the binding area of ​​the entire substrate 1. A polarizer 11 is arranged on the side of the substrate 1 away from the conductive circuit layer 2. The conductive circuit layer 2 in the display area is encapsulated by the encapsulation cover 3 and the substrate 1.

[0050] Then, the chip 4 and the FPC wiring board 5 are bound in the binding area. The chip 4 passes through the ITO layer 21 and the metal layer 22 and is electrically connected and bound. The FPC wiring board 5 is arranged on the metal layer 22 and is electrically connected and bound. Then, the chip 4 is packaged with a protective cover 6, and a packaging glue layer 7 is applied on the conductive circuit layer 2 and the FPC wiring board 5. The protective cover is covered on the chip 4, and the chip 4 is inserted into the groove 61. The protective cover is bonded and connected to the conductive circuit layer 2 and the FPC wiring board 5 through the packaging glue layer 7, so that the chip 4 is encapsulated inside, thereby achieving the effect of protecting the chip 4.

[0051] Example 2

[0052] Reference Figure 2 The difference between this embodiment and embodiment 1 is that a buffer pad 8 is provided on the inner wall of the groove 61 close to the chip 4. In this embodiment, the buffer pad 8 is arranged along the inner wall of the groove 61. The buffer pad 8 can prevent the protective cover 6 from directly contacting the chip 4, thereby preventing the protective cover 6 from being displaced and crushing the chip 4 during the installation process.

[0053] The implementation principle of Example 2 is: during the installation of the protective cover 6, the protective cover 6 may be offset. At this time, the buffer pad 8 set in the groove 61 can prevent the protective cover 6 from directly contacting the chip 4, thereby preventing the protective cover 6 from being offset and crushing the chip 4 during the installation process.

[0054] Example 3

[0055] Reference Figure 3 and Figure 4The difference between this embodiment and embodiment 1 is that a gasket 9 is further provided between the protective cover 6 and the FPC wiring board 5. In this embodiment, one side of the gasket 9 is connected to the FPC wiring board 5, and the other side of the gasket 9 is connected to the protective cover 6 through the packaging glue layer 7. The cross-sectional area of ​​the gasket 9 is equal to the cross-sectional area of ​​the contact surface between the FPC wiring board 5 and the protective cover 6. The gasket 9 covers the contact surface between the FPC wiring board 5 and the protective cover 6. The gasket 9 can reduce the pressure of the protective cover 6 on the FPC wiring board 5 and disperse the force, thereby preventing the FPC from being damaged by excessive pressure.

[0056] The implementation principle of Example 3 is: during the installation of the protective cover 6, the gasket 9 is set between the protective cover 6 and the FPC wiring board 5. The gasket 9 can reduce the pressure of the protective cover 6 on the FPC wiring board 5 and disperse the force, thereby preventing the FPC from being damaged by excessive pressure.

[0057] Example 4

[0058] Reference Figure 5 and Figure 6 The difference between this embodiment and the first embodiment is that a support portion 10 is further provided on the binding area, and the support portion 10 is provided between the chip 4 and the FPC wiring board 5. The support portion 10 is flush with the surface of the side of the FPC wiring board 5 away from the conductive circuit layer 2. The support portion 10 is connected to the protective cover 6 and provides support. In this embodiment, the support portion 10 and the FPC wiring board 5 and the conductive circuit layer 2 are all connected to the protective cover 6 through the packaging glue layer 7, which reduces the pressure on the FPC wiring board 5 and provides additional protection for the FPC wiring board 5.

[0059] The surface of the support part 10 away from the chip 4 is fitted with the FPC wiring board 5, and the surface of the support part 10 close to the chip 4 is flush with the inner wall of the groove 61 away from the packaging cover 3; thereby better support can be provided for the FPC wiring board 5, and the pressure on the FPC wiring board 5 can be further reduced.

[0060] The implementation principle of Example 4 is: during the installation of the protective cover 6, through the support part 10 set on the binding area, the support part 10 is set between the chip 4 and the FPC wiring board 5 and connected to the protective cover 6. The support part 10 can provide support for the FPC wiring board 5, thereby reducing the pressure on the FPC wiring board 5 and providing additional protection for the FPC wiring board 5.

[0061] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A display device, characterized in that: The invention comprises a substrate (1), a packaging cover (3), a chip (4), an FPC wiring board (5), and a conductive circuit layer (2) arranged between the substrate (1) and the packaging cover (3), wherein the substrate (1) comprises a display area and a binding area, wherein the display area and the binding area are used together to provide the conductive circuit layer (2), the packaging cover (3) is arranged in the display area, the chip (4) and the FPC wiring board (5) are arranged in the binding area and are electrically connected to the conductive circuit layer (2); and the invention also comprises a protective cover (6) arranged in the binding area, wherein the protective cover (6) is connected to the conductive circuit layer (2) to encapsulate the chip (4) therein.

2. The display device according to claim 1, characterized in that: The protective cover (6) is provided with a groove (61), the chip (4) is inserted into the groove (61), and the groove (61) allows the protective cover (6) to avoid the chip (4).

3. The display device according to claim 2, characterized in that: A gap (62) is left between the outer wall of the chip (4) and the inner wall of the groove (61).

4. The display device according to claim 2, characterized in that: A buffer pad (8) is provided on the inner wall of the groove (61) on one side close to the chip (4).

5. The display device according to claim 2, characterized in that: The protective cover (6) extends onto the FPC wiring board (5) and is connected thereto; the protective cover (6) and the packaging cover (3) are arranged in close contact with each other; and the sum of the lengths of the protective cover (6) and the packaging cover (3) is equal to the length of the substrate (1).

6. The display device according to claim 5, characterized in that: The protective cover (6) is connected to the FPC wiring board (5) and the conductive circuit layer (2) via a packaging adhesive layer (7).

7. The display device according to claim 6, characterized in that: A support portion (10) is also provided on the binding area. The support portion (10) is provided between the chip (4) and the FPC wiring board (5). The support portion (10) is flush with a surface of the FPC wiring board (5) on a side away from the conductive circuit layer (2). The support portion (10) is connected to the protective cover (6) and provides support.

8. The display device according to claim 7, characterized in that: The surface of the support portion (10) on the side away from the chip (4) is arranged in close contact with the FPC wiring board (5), and the surface of the support portion (10) on the side close to the chip (4) is flush with the inner wall of the groove (61) on the side away from the packaging cover (3).

9. The display device according to claim 6, characterized in that: A gasket (9) is also provided between the protective cover (6) and the FPC wiring board (5).

10. The display device according to claim 1, characterized in that: The height of the protective cover (6) is equal to the height of the packaging cover (3), and the protective cover (6) is flush with a surface of a side of the packaging cover (3) away from the conductive circuit layer (2).

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