Mounting and adjusting device for disc feeding system of semiconductor substrate precision polishing machine

Abstract

The mounting and adjusting device for the upper disc system of the semiconductor substrate precision polishing machine is simple and convenient to adjust, is not limited in mounting, simplifies the overall mounting process, and is more accurate in adjustment compared with an existing adjusting mode. The device comprises an upper disc system (1), an adjusting screw (6), an adjusting plate (7) and an upper disc system mounting plate (8), the disc feeding system is installed on the disc feeding system installation plate, the adjusting plate is installed on a main body of the semiconductor substrate precision polishing machine, adjusting lugs (71) are arranged on the left side face and the right side face of the adjusting plate, kidney-shaped through holes (81) are formed in the upper surface of the disc feeding system installation plate, and the disc feeding system installation plate is connected with the adjusting plate through the kidney-shaped holes and screws. The adjusting screws are installed in the adjusting lugs of the adjusting plate, the upper disc system installing plate and the adjusting plate are adjusted in the left-right direction by adjusting the screws in the kidney-shaped holes, and the upper disc system installing plate and the adjusting plate are adjusted in the front-back direction by adjusting the adjusting screws in the adjusting lugs.

Description

Technical Field

[0001] The utility model relates to the technical field of polishing equipment, in particular to an upper plate system installation and adjustment device of a semiconductor substrate precision polishing machine. Background Art

[0002] Figure 1 The installation and adjustment method of the upper disk system of the semiconductor substrate precision polishing machine in the prior art is shown. The installation and adjustment device includes: an upper disk system 1, a base plate 2, a cylinder seat saddle 3, a gear shaft 4, and a handle 5. The base plate 2 is installed on the main body of the semiconductor substrate precision polishing machine, the cylinder seat saddle 3 is connected to the base plate 2 by a dovetail groove, and the upper disk system 1 is fixed on the cylinder seat saddle 3; the adjustment handle 5 is connected to the gear shaft 4, a rack is provided on the side of the cylinder seat saddle 3, and the gear shaft 4 is meshed with the rack of the cylinder seat saddle 3, so that the position of the upper disk system 1 can be adjusted by turning the handle.

[0003] However, the installation and adjustment of this upper plate system is very complicated and limited by the installation position. When assembling the entire plate system, it is necessary to install the middle part of the upper plate system first, and then install the lower and upper parts, which is very inconvenient. When adjusting the distance, it is necessary to adjust it according to the change of the forward and backward distance of the rack, and the adjustment is not very precise. Summary of the invention

[0004] In order to overcome the defects of the prior art, the technical problem to be solved by the utility model is to provide an upper disk system installation and adjustment device for a semiconductor substrate precision polishing machine, which is simple and convenient to adjust, has no restrictions on installation, simplifies the overall installation process, and is more precise than the existing adjustment method.

[0005] The technical solution of the utility model is: an upper plate system installation and adjustment device for a semiconductor substrate precision polishing machine, which comprises: an upper plate system, an adjustment screw, an adjustment plate, and an upper plate system installation plate;

[0006] The upper disk system is installed on the upper disk system mounting plate, and the adjustment plate is installed on the main body of the semiconductor substrate precision polishing machine. Adjustment ears are provided on the left and right sides of the adjustment plate, and a waist-shaped through hole is provided on the upper surface of the upper disk system mounting plate. The upper disk system mounting plate is connected to the adjustment plate through the waist-shaped hole and a screw. The adjusting screw is installed in the adjusting ear of the adjustment plate. The upper disk system mounting plate and the adjustment plate are adjusted in the left and right directions by adjusting the screw in the waist-shaped hole, and the upper disk system mounting plate and the adjustment plate are adjusted in the front and rear directions by adjusting the adjusting screw in the adjusting ear.

[0007] The upper disk system of the utility model is fixed on the upper disk system mounting plate, and the adjustment plate is mounted on the main body of the semiconductor substrate precision polishing machine. The upper disk system mounting plate is connected to the adjustment plate through waist-shaped holes and screws. The upper disk system mounting plate and the adjustment plate are adjusted in the left-right direction by adjusting the screws in the waist-shaped holes, and the upper disk system mounting plate and the adjustment plate are adjusted in the front-back direction by adjusting the adjustment screws in the adjustment ears. Therefore, the adjustment is simple and convenient, and the installation is not restricted. The upper disk system can be installed on the upper disk system mounting plate from top to bottom as a whole, which simplifies the overall installation process, reduces parts, reduces the difficulty of parts processing and assembly, and adopts a screw adjustment method, which is more precise than the existing adjustment method. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 The present invention shows a schematic structural diagram of an upper plate system installation adjustment device of a semiconductor substrate precision polishing machine in the prior art.

[0009] Figure 2 The utility model shows a schematic structural diagram of an upper plate system installation adjustment device of a semiconductor substrate precision polishing machine according to the present invention.

[0010] Figure 3 The schematic diagram of the structure of the adjustment plate of the upper plate system installation adjustment device of the semiconductor substrate precision polishing machine according to the utility model is shown.

[0011] Figure 4 A structural schematic diagram of an upper disk system mounting plate of an upper disk system mounting adjustment device of a semiconductor substrate precision polishing machine according to the utility model is shown. DETAILED DESCRIPTION

[0012] like Figure 2 As shown, an upper plate system installation and adjustment device for a semiconductor substrate precision polishing machine comprises: an upper plate system 1, an adjustment screw 6, an adjustment plate 7, and an upper plate system installation plate 8;

[0013] The upper disk system is installed on the upper disk system mounting plate, and the adjustment plate is installed on the main body of the semiconductor substrate precision polishing machine. Adjustment ears 71 are provided on the left and right sides of the adjustment plate, and a waist-shaped through hole 81 is provided on the upper surface of the upper disk system mounting plate. The upper disk system mounting plate is connected to the adjustment plate through the waist-shaped hole and a screw. The adjusting screw is installed in the adjusting ear of the adjustment plate. The upper disk system mounting plate and the adjustment plate are adjusted in the left and right direction by adjusting the screw in the waist-shaped hole, and the upper disk system mounting plate and the adjustment plate are adjusted in the front and rear direction by adjusting the adjusting screw in the adjusting ear.

[0014] The upper disk system of the utility model is fixed on the upper disk system mounting plate, and the adjustment plate is mounted on the main body of the semiconductor substrate precision polishing machine. The upper disk system mounting plate is connected to the adjustment plate through waist-shaped holes and screws. The upper disk system mounting plate and the adjustment plate are adjusted in the left-right direction by adjusting the screws in the waist-shaped holes, and the upper disk system mounting plate and the adjustment plate are adjusted in the front-back direction by adjusting the adjustment screws in the adjustment ears. Therefore, the adjustment is simple and convenient, and the installation is not restricted. The upper disk system can be installed on the upper disk system mounting plate from top to bottom as a whole, which simplifies the overall installation process, reduces parts, reduces the difficulty of parts processing and assembly, and adopts a screw adjustment method, which is more precise than the existing adjustment method.

[0015] Preferably, if Figure 4 As shown, a large circular hole 82 is provided at the center of the upper plate system mounting plate, and the lower part of the upper plate system is inserted into the large circular hole. Such a structure is very simple to install, and does not take up space due to the addition of adjustment parts, so that the installation is not restricted.

[0016] Preferably, if Figure 3 As shown, three waist-shaped through holes are respectively arranged on the front and rear sides of the upper surface of the upper plate system mounting plate, and three threaded holes 72 are respectively arranged on the front and rear sides of the upper surface of the adjustment plate. The design of three waist-shaped through holes on the front and rear sides can make the adjustment more stable.

[0017] Preferably, if Figure 3 As shown, the adjustment plate is a rectangular frame, and the upper and lower edges inside the rectangular frame have rounded edges 73. In this way, when the upper plate system mounting plate is close to the upper and lower edges inside the rectangular frame, the circular upper plate system can contact the adjustment plate with the largest area, increasing the front and rear adjustment range.

[0018] The above description is only a preferred embodiment of the present invention and does not constitute any form of limitation to the present invention. Any simple modification, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the protection scope of the technical solution of the present invention.

Claims

1. The upper plate system of the semiconductor substrate precision polishing machine is installed with an adjustment device, characterized in that: It includes: Upper plate system (1), adjusting screw (6), adjusting plate (7), upper plate system mounting plate (8); The upper disk system is mounted on an upper disk system mounting plate, and the adjustment plate is mounted on the main body of the semiconductor substrate precision polishing machine. The left and right sides of the adjustment plate are provided with adjustment ears (71), and the upper surface of the upper disk system mounting plate is provided with a waist-shaped through hole (81). The upper disk system mounting plate is connected to the adjustment plate through the waist-shaped hole and a screw, and the adjustment screw is mounted in the adjustment ear of the adjustment plate. The upper disk system mounting plate and the adjustment plate are adjusted in the left-right direction by adjusting the screw in the waist-shaped hole, and the upper disk system mounting plate and the adjustment plate are adjusted in the front-back direction by adjusting the adjustment screw in the adjustment ear.

2. The upper plate system installation and adjustment device of the semiconductor substrate precision polishing machine according to claim 1 is characterized in that: A large circular hole (82) is provided at the center of the upper disk system mounting plate, and the lower part of the upper disk system is inserted into the large circular hole.

3. The upper plate system installation adjustment device of the semiconductor substrate precision polishing machine according to claim 2 is characterized in that: Three waist-shaped through holes are respectively arranged on the front and rear sides of the upper surface of the upper disk system installation plate, and three threaded holes (72) are respectively arranged on the front and rear sides of the upper surface of the adjustment plate.

4. The upper plate system installation adjustment device of the semiconductor substrate precision polishing machine according to claim 3 is characterized in that: The adjustment plate is a rectangular frame, and the upper and lower edges inside the rectangular frame have rounded edges (73).

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