Sheet disassembling equipment

Abstract

The utility model relates to a piece disassembling device. The piece disassembling device comprises a first streamline, a second streamline, a first discharging module, a first carrying module and a second carrying module. The first streamline and the second streamline are arranged at intervals, and the first streamline and the second streamline can split a product into a plurality of parts; the first blanking module is arranged between the first flow line and the second flow line; the first carrying module can carry the parts split in the first flow line to the first discharging module; the second carrying module can carry the parts split in the second flow line to the first discharging module. After the glass cover plate and the gasket are split through the first flow line and the second flow line, the first carrying module and the second carrying module carry the glass cover plate to the first discharging module to be discharged, and therefore the piece dismounting efficiency can be effectively improved. And meanwhile, the first carrying module, the second carrying module and the first discharging module are all arranged between the first streamline and the second streamline, so that the wafer disassembling equipment is more compact, the occupied space is reduced, and the space utilization rate is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of automation equipment, in particular to a piece disassembling device. Background Art

[0002] During the transportation of glass cover plates, gaskets need to be placed between adjacent glass cover plates, and the glass cover plates need to be separated from the gaskets before they are used. Existing disassembly equipment for separating glass cover plates from gaskets generally soaks the glass cover plates and gaskets in a solution first, and then transports the glass cover plates to the unloading module for unloading after the disassembly is completed. However, existing disassembly equipment usually adopts linear modules, and the modules in the disassembly equipment are built one by one along a straight line according to the operation sequence, resulting in a large overall space occupied by the equipment. Utility Model Content

[0003] Based on this, it is necessary to provide a disassembly device that occupies less space in order to solve the problem that the existing disassembly device occupies a large space.

[0004] A chip removal device, comprising:

[0005] First Streamline;

[0006] A second streamline is arranged at an interval with the first streamline, and both the first streamline and the second streamline can separate the product into a plurality of components;

[0007] A first material discharge module, disposed between the first flow line and the second flow line;

[0008] a first transport module, disposed between the first flow line and the second flow line, and capable of transporting the components separated from the first flow line to the first unloading module; and

[0009] The second transport module is disposed between the first streamline and the second streamline, and the second transport module can transport the components separated from the second streamline to the first unloading module.

[0010] In one embodiment, the first flow line includes a loading module, a loading and transporting module, and a disassembly module;

[0011] The loading module is used to convey the material frame carrying the product, and the loading and transporting module can transport the material frame at the loading module to the disassembling module, and the disassembling module can disassemble the product into several parts;

[0012] The first transport module can transport the components separated by the stripping module to the first unloading module.

[0013] In one embodiment, the film stripping module includes a soaking position and a film stripping position;

[0014] The loading and transporting module can transport the material frame to the soaking position so that the product is soaked in the solution, and the loading and transporting module can also transport the material frame from the soaking position to the disassembling position;

[0015] The first transport module can transport the split components from the splitting position to the first unloading module.

[0016] In one embodiment, the loading and handling module includes a first loading drive, a second loading drive and a first grabbing assembly;

[0017] The first feeding drive is connected to the second feeding drive so that the second feeding drive moves along a first direction, the second feeding drive is connected to the first grabbing assembly so that the first grabbing assembly moves along a second direction, and the first grabbing assembly is used to grab or release the material frame;

[0018] The first direction is perpendicular to the second direction.

[0019] In one embodiment, the first gripping assembly includes a connecting plate, a first clamping drive member and a first clamping claw;

[0020] The second feeding drive is connected to the connecting plate, and the first clamping drive is disposed on the connecting plate and connected to the first clamping claw, so that the first clamping claw clamps or releases the material frame.

[0021] In one embodiment, the first flow line further includes a material unloading and handling module and a second material unloading module;

[0022] The material unloading and transporting module can obtain the components separated by the disassembling module and / or the material frame at the disassembling module, and transport the components and / or the material frame to the second material unloading module.

[0023] In one embodiment, the material unloading and handling module includes a first material unloading drive member, a second material unloading drive member, a mounting plate, a second grabbing assembly and a third grabbing assembly;

[0024] The first material unloading driving member is connected to the second material unloading driving member so that the second material unloading driving member moves along the first direction, the second material unloading driving member is connected to the mounting plate so that the mounting plate moves along the second direction, the second grabbing assembly and the third grabbing assembly are both arranged on the mounting plate, and the second grabbing assembly is used to grab or release the parts split by the stripping module, and the third grabbing assembly is used to grab or release the material frame;

[0025] The first direction is perpendicular to the second direction.

[0026] In one embodiment, the second grabbing assembly includes a lifting driving member and a suction member;

[0027] The lifting drive member is arranged on the mounting plate and connected to the adsorption member. The lifting drive member can drive the adsorption member to move along the second direction so that the adsorption member extends or retracts from the third grabbing component, and the adsorption member can grab or release the gasket.

[0028] In one embodiment, the third gripping assembly includes a second clamping drive and a second clamping claw;

[0029] The second clamping driving member is disposed on the mounting plate and connected to the second clamping jaw so that the second clamping jaw clamps or releases the material frame.

[0030] In one embodiment, the second flow line includes a loading module, a loading and transporting module, and a disassembly module;

[0031] The loading module is used to convey the material frame carrying the product, and the loading and transporting module can transport the material frame at the loading module to the disassembling module, and the disassembling module can disassemble the product into several parts;

[0032] The second transport module can transport the components separated by the stripping module to the first unloading module.

[0033] In one embodiment, the second flow line further includes a material unloading and handling module and a second material unloading module;

[0034] The material unloading and transporting module can obtain the components separated by the disassembling module and / or the material frame at the disassembling module, and transport the components and / or the material frame to the second material unloading module.

[0035] With the above-mentioned disassembling equipment, after the first streamline and the second streamline separate the glass cover plate from the gasket, the first conveying module and the second conveying module convey the glass cover plate to the first unloading module for unloading. The two streamlines perform the disassembling action and convey it through the two conveying modules, which can effectively improve the efficiency of disassembling. At the same time, the first conveying module, the second conveying module and the first unloading module are all arranged between the first streamline and the second streamline, making the disassembling equipment more compact, reducing the space occupied and improving the space utilization. In addition, the two streamlines and the two conveying modules share the first unloading module, which reduces the cost of the disassembling equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0037] Figure 1 A schematic diagram of the structure of a chip removal device provided in one embodiment of the present application;

[0038] Figure 2 for Figure 1 The schematic diagram of the structure of the loading and handling module and the disassembling module in the disassembling equipment shown;

[0039] Figure 3 for Figure 1 The structural schematic diagram of the material unloading and handling module in the disassembly equipment shown;

[0040] Figure 4 for Figure 3 The schematic diagram of the structure of the mounting plate, the second grabbing assembly and the third grabbing assembly in the blanking and handling module is shown. DETAILED DESCRIPTION

[0041] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0042] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0043] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0044] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0045] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0046] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0047] In order to facilitate understanding of the technical solution of the present application, the glass cover plate is used as an example to illustrate the prior art disassembly equipment: In the prior art disassembly equipment, a robot arm constructed with linear modules is usually used to transport the glass cover plate, and each module needs to be built in a straight line in accordance with the operation sequence, resulting in a large overall space occupied by the equipment. At the same time, due to the inherent workflow of the disassembly equipment, for example, the module for transporting the glass cover plate or the gasket needs to move back and forth, and the transportation process of these modules is time-consuming, which will affect the efficiency of disassembly.

[0048] In addition, when removing the alternately stacked gaskets and glass cover plates, in order to avoid deformation of the glass cover plates, the glass cover plates need to be soaked in a solution first, and then removed after the soaking is completed. It is necessary to wait for the operation to be completed before moving the glass cover plates, which is time-consuming and also leads to low removal efficiency.

[0049] like Figure 1 As shown, an embodiment of the present application provides a chip removal device 10, including a first streamline 110, a second streamline 120, a first unloading module 200, a first conveying module 310 and a second conveying module 320.

[0050] The first flow line 110 and the second flow line 120 are arranged at intervals, and both the first flow line 110 and the second flow line 120 can divide the product into several parts.

[0051] The first unloading module 200, the first handling module 310 and the second handling module 320 are all disposed between the first flow line 110 and the second flow line 120. The first handling module 310 can carry the components separated from the first flow line 110 to the first unloading module 200, and the second handling module 320 can carry the components separated from the second flow line 120 to the first unloading module 200, so that the components are unloaded through the first unloading module 200.

[0052] It should be noted that in this embodiment, the product is a glass cover plate and a gasket arranged alternately in layers, so it can be seen that the disassembled parts of the product include a glass cover plate and a gasket. Among them, the first handling module 310 and the second handling module 320 are used to transport the glass cover plate to the first unloading module 200, so that the first unloading module 200 unloads the glass cover plate. Of course, in other embodiments, the product can also be other combined structures, which are not limited here. In order to facilitate the understanding of this application, the following description is taken as an example of a glass cover plate and a gasket.

[0053] With the above-mentioned disassembling equipment, after the first streamline 110 and the second streamline 120 separate the glass cover plate from the gasket, the first transport module 310 and the second transport module 320 transport the glass cover plate to the first unloading module 200 for unloading. The two streamlines perform the disassembly action and transport it through the two transport modules, which can effectively improve the efficiency of disassembling. At the same time, the first transport module 310, the second transport module 320 and the first unloading module 200 are all arranged between the first streamline 110 and the second streamline 120, making the disassembling equipment more compact, reducing space occupation and improving space utilization. In addition, the two streamlines and the two transport modules share the first unloading module 200, which reduces the cost of the disassembling equipment.

[0054] It should be further explained that the glass cover plate can be transported by conveying wheels in the first unloading module, and the first transport module 310 and the second transport module 320 can cooperate with a robotic arm and an adsorption module to adsorb, grasp and transport the glass cover plate.

[0055] In one embodiment, the first flow line 110 includes a loading module 400, a loading and transporting module 500, and a disassembling module 600. The loading module 400 is used to transport a material frame carrying a product, the loading and transporting module 500 can transport the material frame at the loading module 400 to the disassembling module 600, and the disassembling module 600 can disassemble the product into a glass cover plate and a gasket.

[0056] It can be seen that the first conveying module 310 is capable of conveying the glass cover plate separated by the stripping module 600 to the first unloading module 200 .

[0057] Furthermore, the first flow line 110 further includes a material unloading and handling module 700 and a second material unloading module 800. The material unloading and handling module 700 can obtain the gaskets separated by the separation module and / or the material frame at the disassembly module 600, and transport the gaskets and / or the material frame to the second material unloading module 800, so that the second material unloading module 800 unloads the material frame and the gaskets.

[0058] It should be noted that after the loading module 400 transports the material frame of the Tth batch to the disassembling module 600, the unloading transport module 700 first transports a gasket from the disassembling module 600 to the empty material frame at the unloading module, and then the first transport module 310 moves a glass cover plate away from the disassembling module 600, and the alternating actions are performed in this way until all the gaskets and glass cover plates in the material frame are moved away, and then the unloading module unloads the material frame and the gasket. The unloading transport module 700 then transports the empty material frame from the disassembling module 600 to the unloading module.

[0059] It should be explained that when T is 1, the empty material frame at the unloading module can be placed manually.

[0060] In one embodiment, the second flow line 120 includes a loading module 400, a loading and transporting module 500, and a disassembling module 600. The loading module 400 is used to transport a material frame carrying a product, the loading and transporting module 500 can transport the material frame at the loading module 400 to the disassembling module 600, the disassembling module 600 can disassemble the product into a glass cover plate and a gasket, and the second transporting module 320 can transport the glass cover plate disassembled by the disassembling module 600 to the first unloading module 200.

[0061] Furthermore, the second flow line 120 further includes a material unloading and handling module 700 and a second material unloading module 800. The material unloading and handling module 700 can obtain the gaskets separated by the disassembling module 600 and / or the material frame at the disassembling module 600, and transport the gaskets and / or the material frame to the second material unloading module 800, so that the second material unloading module 800 unloads the material frame and the gaskets.

[0062] It is understandable that the structure and operation of the second streamline 120 are the same as those of the first streamline 110, and they are arranged symmetrically. The first handling module 310 is disposed adjacent to the first streamline 110 to facilitate the acquisition of the glass cover plate split by the first streamline 110, and the second handling module 320 is disposed adjacent to the second streamline 120 to facilitate the acquisition of the glass cover plate split by the second streamline 120.

[0063] Specific to Figure 1 In the embodiment shown, the loading module 400, the stripping module 600 and the second unloading module 800 are arranged in sequence along a first direction, and the first streamlines 110 and the second streamlines 120 are arranged at intervals along a third direction perpendicular to the first direction. The first unloading module 200 is disposed between the two loading modules 400.

[0064] See also Figure 2 In one embodiment, the loading and handling module 500 includes a first loading drive 510, a second loading drive 520 and a first grabbing assembly 530. The first loading drive 510 is connected to the second loading drive 520 so that the second loading drive 520 moves in a first direction, the second loading drive 520 is connected to the first grabbing assembly 530 so that the first grabbing assembly 530 moves in a second direction, and the first grabbing assembly 530 is used to grab or release the material frame.

[0065] The second direction is perpendicular to the first direction and the third direction.

[0066] The first loading drive 510 first drives the first grabbing assembly 530 to move above the loading module 400, and then the second loading drive 520 drives the first grabbing assembly 530 to descend to grab the material frame at the loading module 400, and then the first grabbing assembly 530 rises, and the first loading drive 510 drives the first grabbing assembly 530 to move to the disassembly module 600.

[0067] Optionally, the first loading drive member 510 is a linear module, and the second loading drive member 520 is a cylinder.

[0068] Further, the first grabbing assembly 530 includes a connecting plate 531, a first clamping driving member 532 and a first clamping claw 533. The second feeding driving member 520 is connected to the connecting plate 531 so that the connecting plate 531 moves along the second direction. The first clamping driving member 532 is disposed on the connecting plate 531 and is connected to the first clamping claw 533 so that the first clamping claw 533 clamps or releases the material frame.

[0069] Optionally, the first clamping driving member 532 is a cylinder.

[0070] In one embodiment, the stripping module 600 includes a soaking position 610 and a stripping position 620. The loading and transporting module 500 can obtain the material frame at the loading module 400 and transport the material frame to the soaking position 610 so that the product is soaked in the solution, which is convenient for subsequent products. The loading and transporting module 500 can also transport the material frame from the soaking position 610 to the stripping position 620, so as to split the product at the stripping position 620. In this way, when the products in the material frame of batch T are split at the stripping position 620, the loading and transporting module 500 transports the material frame of batch T+1 to the soaking position 610, so that stripping and soaking are carried out simultaneously, further improving the stripping efficiency.

[0071] It can be seen that the first conveying module 310 or the second conveying module 320 can convey the split glass cover plate from the debonding position 620 to the first unloading module 200 , and the unloading conveying module 700 can convey the gasket or material frame from the debonding position 620 to the second unloading module 800 .

[0072] It should be explained that the method of disassembling the product at the disassembly position 620 is relatively conventional and will not be described in detail here.

[0073] Specific to Figure 2 In the illustrated embodiment, the soaking position 610 and the stripping position 620 are arranged in sequence along the first direction. After the first clamp 533 clamps the material frame, it first moves to the top of the soaking position 610, and then descends to allow the product to be immersed in the solution. After the soaking is completed, the first clamp 533 rises and moves to the top of the stripping position 620, and then the first clamp 533 descends and releases the material frame to the stripping position 620. Then the loading and transporting module 500 transports the next batch of material frames to the soaking position 610.

[0074] See also Figure 3 In one embodiment, the material unloading and handling module 700 includes a first material unloading driving member 710 , a second material unloading driving member 720 , a mounting plate 730 , a second grabbing assembly 740 and a third grabbing assembly 750 .

[0075] The first material unloading driving member 710 is connected to the second material unloading driving member 720 so that the second material unloading driving member 720 moves in the first direction, the second material unloading driving member 720 is connected to the mounting plate 730 so that the mounting plate 730 moves in the second direction, the second grabbing assembly 740 and the third grabbing assembly 750 are both arranged on the mounting plate 730, and the second grabbing assembly 740 and the third grabbing assembly 750 are used to grab the gasket and the material frame respectively. In this way, the grabbing assemblies for the gasket and the material frame are driven by the same set of driving members, which simplifies the structure, improves the maintainability of the equipment, and further reduces the space occupied by the equipment.

[0076] It can be understood that the first material unloading drive member 710 drives the mounting plate 730 to move to the top of the stripping position 620, the second material unloading drive member 720 drives the mounting plate 730 to descend, and then the second grabbing assembly 740 grabs the gasket, and then the mounting plate 730 rises and moves to the top of the material frame at the unloading module, and then the mounting plate 730 descends and releases the gasket into the material frame. After the gasket at the unloading position 620 is transported, the mounting plate 730 returns to the top of the unloading position 620, and then the mounting plate 730 descends, the third grabbing assembly 750 grabs the empty material frame, and then the mounting plate 730 rises and moves to the top of the second unloading module 800, and finally the mounting plate 730 descends to release the empty material frame to the second unloading module 800.

[0077] Optionally, the first material removal driving member 710 and the second material removal driving member 720 are both linear modules.

[0078] See also Figure 4 In one embodiment, the second grabbing assembly 740 includes a lifting driving member 741 and a suction member 742. The lifting driving member 741 is disposed on the mounting plate 730 and connected to the suction member 742 to drive the suction member 742 to move along the second direction so that the suction member 742 extends or retracts from the third grabbing assembly 750. The suction member 742 can grab or release the gasket.

[0079] It can be understood that in order to prevent the third grasping component 750 from affecting the grasping of the gasket, or the adsorption component 742 from affecting the grasping of the material frame, a lifting drive component 741 is provided to drive the adsorption component 742 to move along the second direction, so that the gasket is grasped when the adsorption component 742 extends out of the third grasping component 750, and the material frame is grasped through the third grasping component 750 when the adsorption component 742 retracts.

[0080] Optionally, the lifting drive member 741 is a cylinder.

[0081] See also Figure 4In one embodiment, the third grabbing assembly 750 includes a second clamping driving member 751 and a second clamping claw 752. The second clamping driving member 751 is disposed on the mounting plate 730 and connected to the second clamping claw 752 so that the second clamping claw 752 clamps or releases the material frame.

[0082] It should be noted that the two second clamping jaws 752 opposite to each other can move closer to or farther away from each other to clamp or release the material frame, and the second grabbing assembly 740 is located between the two second clamping jaws 752 opposite to each other to make the structure of the unloading and handling module 700 more compact.

[0083] Optionally, the second clamping driving member 751 is a cylinder.

[0084] In order to facilitate understanding of the technical solution of the present application, the first streamline 110 is taken as an example. Figure 1 The working process of the chip removal device in the above embodiment is described as follows:

[0085] The first grabbing assembly 530 first moves to the top of the loading module 400, then descends and grabs the material frame at the loading module 400. Next, it moves to the top of the soaking position 610, and descends until the product is soaked in the solution. After the soaking is completed, the first grabbing assembly 530 moves to the stripping position 620 and releases the material frame, so that the product is split at the stripping position 620.

[0086] After the product is split, the first transport module 310 transports the glass cover plate at the stripping position 620 to the first unloading module 200 for unloading. The suction member 742 in the second grabbing assembly 740 extends from the second clamping claw 752, then sucks and grabs the gasket at the stripping position 620, and transports the gasket to the material frame at the second unloading module 800. After the gasket is transported, the suction member 742 retracts, and the empty material frame at the stripping position 620 is grabbed by the third grabbing assembly 750, and the empty material frame is transported to the second unloading module 800.

[0087] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0088] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A chip removal device, characterized in that: include: First Streamline; A second streamline is arranged at an interval with the first streamline, and both the first streamline and the second streamline can separate the product into a plurality of components; A first material discharge module, disposed between the first flow line and the second flow line; a first transport module, disposed between the first flow line and the second flow line, and capable of transporting the components separated from the first flow line to the first unloading module; and The second transport module is disposed between the first streamline and the second streamline, and the second transport module can transport the components separated from the second streamline to the first unloading module.

2. The chip removal device according to claim 1, characterized in that: The first streamline includes a loading module, a loading and handling module, and a disassembly module; The loading module is used to convey the material frame carrying the product, and the loading and transporting module can transport the material frame at the loading module to the disassembling module, and the disassembling module can disassemble the product into several parts; The first transport module can transport the components separated by the stripping module to the first unloading module.

3. The chip removal device according to claim 2, characterized in that: The film removal module includes a soaking position and a film removal position; The loading and transporting module can transport the material frame to the soaking position so that the product is soaked in the solution, and the loading and transporting module can also transport the material frame from the soaking position to the disassembling position; The first transport module can transport the split components from the splitting position to the first unloading module.

4. The chip removal device according to claim 3, characterized in that: The loading and handling module includes a first loading drive member, a second loading drive member and a first grabbing assembly; The first feeding drive is connected to the second feeding drive so that the second feeding drive moves along a first direction, the second feeding drive is connected to the first grabbing assembly so that the first grabbing assembly moves along a second direction, and the first grabbing assembly is used to grab or release the material frame; The first direction is perpendicular to the second direction.

5. The chip removal device according to claim 4, characterized in that: The first grabbing assembly includes a connecting plate, a first clamping driving member and a first clamping claw; The second feeding drive is connected to the connecting plate, and the first clamping drive is disposed on the connecting plate and connected to the first clamping claw, so that the first clamping claw clamps or releases the material frame.

6. The chip removal device according to claim 2, characterized in that: The first streamline also includes a material unloading and handling module and a second material unloading module; The material unloading and transporting module can obtain the components separated by the disassembly module and / or the material frame at the disassembly module, and transport the components and / or the material frame to the second material unloading module.

7. The chip removal device according to claim 6, characterized in that: The material unloading and handling module includes a first material unloading driving member, a second material unloading driving member, a mounting plate, a second grabbing assembly and a third grabbing assembly; The first material unloading driving member is connected to the second material unloading driving member so that the second material unloading driving member moves along the first direction, the second material unloading driving member is connected to the mounting plate so that the mounting plate moves along the second direction, the second grabbing assembly and the third grabbing assembly are both arranged on the mounting plate, and the second grabbing assembly is used to grab or release the parts split by the stripping module, and the third grabbing assembly is used to grab or release the material frame; The first direction is perpendicular to the second direction.

8. The chip removal device according to claim 7, characterized in that: The second grabbing assembly includes a lifting driving member and a suction member; The lifting drive member is arranged on the mounting plate and connected to the adsorption member. The lifting drive member can drive the adsorption member to move along the second direction so that the adsorption member extends or retracts from the third grabbing component, and the adsorption member can grab or release the gasket.

9. The chip removal device according to claim 7, characterized in that: The third gripping assembly includes a second clamping drive and a second clamping claw; The second clamping driving member is disposed on the mounting plate and connected to the second clamping jaw so that the second clamping jaw clamps or releases the material frame.

10. The chip removal device according to any one of claims 1 to 9, characterized in that: The second streamline includes a loading module, a loading and transporting module and a disassembly module; The loading module is used to convey the material frame carrying the product, and the loading and transporting module can transport the material frame at the loading module to the disassembling module, and the disassembling module can disassemble the product into several parts; The second transport module can transport the components separated by the stripping module to the first unloading module.

11. The chip removal device according to claim 10, characterized in that: The second streamline further includes a material unloading and handling module and a second material unloading module; The material unloading and transporting module can obtain the components separated by the disassembly module and / or the material frame at the disassembly module, and transport the components and / or the material frame to the second material unloading module.

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