Integrated circuit layered packaging device with high safety

Abstract

The utility model discloses an integrated circuit layered packaging device with high safety, which belongs to the technical field of integrated circuit packaging, solves the problem that a battery cell is damaged due to improper protection when an integrated circuit is used in the prior art, and comprises a connecting bottom plate, and four corners of the top end of the connecting bottom plate are fixedly connected with connecting bases. A supporting rod is slidably connected to the inner surface of the connecting base, a heat conduction plate is fixedly connected to the top end of the supporting rod, a plurality of heat dissipation holes in a rectangular array are formed in the outer surface of the heat conduction plate, and a plurality of guide pieces in a rectangular array are fixedly connected to the four edges of the top end of the connecting base plate. A packaging shell is fixedly connected to the center of the top end of the connecting bottom plate, and the guide piece is in an L shape. According to the utility model, the circuit chip is fixed in the packaging shell, so that the circuit chip can be better protected during use through the arrangement of the heat conducting plate, the electromagnetic shielding plate, the insulating bottom plate and the epoxy resin, and the safety of the whole integrated circuit is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of integrated circuit packaging, and in particular relates to an integrated circuit layered packaging device with high safety. Background Art

[0002] Integrated circuit packaging is both the pinnacle and the base of the electronics pyramid. There are good reasons to say that it is both. In terms of the density of electronic components (such as transistors), ICs represent the cutting edge of electronics. But ICs are also a starting point, a basic building block that is the basis of most electronic systems in our lives. Likewise, ICs are more than just a single chip or basic electronic structure. ICs come in many different types (analog, digital, RF, sensors, etc.), and therefore have different packaging needs and requirements. This article provides a comprehensive review of IC packaging technology, and introduces in broad strokes the various materials and processes used to manufacture these indispensable packaging structures.

[0003] An integrated circuit packaging structure with patent announcement number CN205282471U in the prior art includes an integrated circuit body, a welding surface of the integrated circuit body is provided with a plurality of pads, the welding surface is used for wiring and welding, the pads extend from the side of the integrated circuit body to the welding surface, the plurality of pads include a pad to be marked, one side of the pad to be marked is provided with an identification mark, the diameter of the identification mark or the diameter of the circumscribed circle is 0.5 to 3.5 mm, and the distance between the identification mark and the pad to be marked is more than 0.5 mm.

[0004] However, the surface of the integrated circuit body in this structure is exposed to the outside, which may easily cause overheating and damage to the battery cell. Therefore, a highly safe integrated circuit layered packaging device is needed to solve the problems existing in the prior art. Utility Model Content

[0005] The purpose of the utility model is to provide a highly secure integrated circuit layered packaging device to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a highly safe integrated circuit layered packaging device, comprising a connecting base plate, the top four corners of the connecting base plate are fixedly connected to a connecting base, the inner surface of the connecting base is slidably connected to a support rod, the top of the support rod is fixedly connected to a heat conducting plate, the outer surface of the heat conducting plate is provided with a plurality of heat dissipation holes in a rectangular array, the top four sides of the connecting base plate are fixedly connected to a plurality of guide plates in a rectangular array, the top center of the connecting base plate is fixedly connected to a packaging shell, the guide plate is L-shaped, and the top of the guide plate passes through the packaging shell and extends to the interior.

[0007] As a preferred embodiment, a connecting plate is provided inside the packaging shell, a circuit chip is fixedly connected to the bottom end of the connecting plate, an electromagnetic shielding plate is fixedly connected to the bottom end of the circuit chip, silver paste is provided between the circuit chip and the electromagnetic shielding plate, an insulating bottom plate is fixedly connected to the bottom end of the electromagnetic shielding plate, the bottom end of the insulating bottom plate is fixedly connected to the connecting bottom plate, epoxy resin is provided on the top end of the connecting plate, and a plurality of bumps in a rectangular array are provided on the top end of the connecting plate.

[0008] As a preferred implementation manner, a gold wire is fixedly connected to the top of the bump, and the other end of the gold wire is fixedly connected to the top of the guide sheet.

[0009] As a preferred implementation, the connection base and the support rod are made of ceramic, and the connection base and the support rod are detachable.

[0010] Compared with the prior art, the advantages of the utility model are:

[0011] 1. The circuit chip is arranged in the packaging shell through the heat conducting plate, electromagnetic shielding plate, epoxy resin and insulating bottom plate. The heat emitted by the circuit chip is transferred to the heat conducting plate through the packaging shell, so that the heat on the heat conducting plate is dissipated through the heat dissipation holes on its surface, thereby improving the heat dissipation efficiency of the circuit chip. The heat emitted by the circuit chip is absorbed by the epoxy resin and transferred to the heat conducting plate, thereby reducing the occurrence of local overheating of the circuit chip, thereby improving the safety of the device. The insulating bottom plate allows the circuit chip to be installed and placed between the packaging shell and the connecting bottom plate to provide insulation conditions, thereby improving the protection capability of the device.

[0012] 2. By connecting the base and the support rod, the heat conducting plate and the connecting bottom plate can be disassembled and installed at any time, so that the heat conducting plate can protect the package shell when the integrated circuit is installed and welded, thereby preventing the heat generated by welding from damaging the internal circuit chip, thereby improving the service life of the circuit chip. When the integrated circuit is used for a long time, dust on the surface of the heat conducting plate and the package shell can be quickly cleaned, thereby improving the convenience of the device, thereby further improving the practicality of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0014] Figure 2 It is a cross-sectional structural schematic diagram of the utility model;

[0015] Figure 3It is a schematic diagram of the separation structure of the connection base and the support rod of the utility model.

[0016] In the figure: 1. connecting base plate; 2. connecting base; 3. support rod; 4. heat conducting plate; 5. heat dissipation hole; 6. guide plate; 7. packaging shell; 8. gold wire; 9. connecting plate; 10. circuit chip; 11. electromagnetic shielding plate; 12. insulating base plate; 13. silver paste; 14. epoxy resin; 15. bump. DETAILED DESCRIPTION

[0017] The present invention will be further described below in conjunction with the embodiments.

[0018] See also Figure 1-3 The utility model provides a high-safety integrated circuit layered packaging device, including a connecting base 1, the top four corners of the connecting base 1 are fixedly connected to a connecting base 2, the inner surface of the connecting base 2 is slidably connected to a support rod 3, the top of the support rod 3 is fixedly connected to a heat conducting plate 4, the outer surface of the heat conducting plate 4 is provided with a plurality of heat dissipation holes 5 in a rectangular array, the top four sides of the connecting base 1 are fixedly connected to a plurality of guide pieces 6 in a rectangular array, the top center of the connecting base 1 is fixedly connected to a packaging shell 7, the guide piece 6 is L-shaped, and the top of the guide piece 6 penetrates the packaging shell 7 and extends to the inside.

[0019] Further as Figure 1 , Figure 2 and Figure 3 As shown, a connecting plate 9 is provided inside the package shell 7, a circuit chip 10 is fixedly connected to the bottom end of the connecting plate 9, an electromagnetic shielding plate 11 is fixedly connected to the bottom end of the circuit chip 10, a silver paste 13 is provided between the circuit chip 10 and the electromagnetic shielding plate 11, an insulating bottom plate 12 is fixedly connected to the bottom end of the electromagnetic shielding plate 11, and the bottom end of the insulating bottom plate 12 is fixedly connected to the connecting bottom plate 1, an epoxy resin 14 is provided on the top end of the connecting plate 9, and a plurality of convex points 15 in a rectangular array are provided on the top end of the connecting plate 9, and the circuit chip 10 is provided in the package shell 7 through the heat conducting plate 4, the electromagnetic shielding plate 11, the epoxy resin 14 and the insulating bottom plate 12. The heat dissipated by the circuit chip 10 is transferred to the heat-conducting plate 4 through the packaging shell 7, so that the heat on the heat-conducting plate 4 is dissipated through the heat dissipation holes 5 on its surface, thereby improving the heat dissipation efficiency of the circuit chip 10. The heat emitted by the circuit chip 10 is absorbed by the epoxy resin 14 and transferred to the heat-conducting plate 4, thereby reducing the occurrence of local overheating of the circuit chip 10, thereby improving the safety of the device. The insulating bottom plate 12 is used to provide insulation conditions for the circuit chip 10 to be installed and placed between the packaging shell 7 and the connecting bottom plate 1, thereby improving the protection capability of the device.

[0020] Further as Figure 2As shown, it is worth to explain in detail that the top of the bump 15 is fixedly connected with a gold wire 8 , and the other end of the gold wire 8 is fixedly connected with the top of the guide piece 6 .

[0021] Further as Figure 3 As shown, it is worth specifically explaining that the material of the connecting base 2 and the support rod 3 is ceramic, and the connecting base 2 and the support rod 3 are detachable. By connecting the base 2 and the support rod 3, the heat conducting plate 4 and the connecting bottom plate 1 can be disassembled and installed at any time, so that the heat conducting plate 4 can protect the packaging shell 7 when the integrated circuit is installed and welded, thereby preventing the heat generated by welding from damaging the internal circuit chip 10, thereby improving the service life of the circuit chip 10, so that when the integrated circuit is used for a long time, dust on the surface of the heat conducting plate 4 and the packaging shell 7 can be quickly cleaned, thereby improving the convenience of the device, thereby further improving the practicality of the device, because the material of the connecting base 2 and the support rod 3 is ceramic, the integrated circuit can better transfer heat to the heat conducting plate 4 when it is in use.

[0022] This solution has the following working process: first, the circuit chip 10 transmits data through the guide plate 6 and the gold wire 8, so that the heat generated during the use of the circuit chip 10 can be transferred to the packaging shell 7 through the epoxy resin 14, and then the heat is absorbed by the heat conducting plate 4, so that the heat is volatilized and dissipated through the heat dissipation holes 5 on the surface of the heat conducting plate 4. When the integrated circuit is welded, the heat conducting plate 4 and the connecting base plate 1 can be connected to each other through the support rod 3 and the connecting base 2, so that the heat generated by the welding can be directly absorbed and discharged. When there is dust on the surface of the heat conducting plate 4 and the packaging shell 7, the heat conducting plate 4 and the connecting base plate 1 are separated through the support rod 3 and the connecting base 2, so as to be effectively cleaned.

[0023] According to the above working process, it can be known that: the circuit chip 10 is arranged in the package shell 7 through the heat conducting plate 4, the electromagnetic shielding plate 11, the epoxy resin 14 and the insulating bottom plate 12, and the heat emitted by the circuit chip 10 is transferred to the heat conducting plate 4 through the package shell 7 through the heat conducting plate 4, so that the heat on the heat conducting plate 4 is dissipated through the heat dissipation holes 5 on its surface, thereby improving the heat dissipation efficiency of the circuit chip 10, and the heat emitted by the circuit chip 10 is absorbed by the epoxy resin 14 and transferred to the heat conducting plate 4, thereby reducing the occurrence of local overheating of the circuit chip 10, thereby improving the safety of the device, and the insulating bottom plate 12 is used to make the circuit chip 10 The circuit chip 10 is installed and placed between the packaging shell 7 and the connecting base plate 1 to provide insulation conditions, thereby improving the protection ability of the device. By connecting the base 2 and the support rod 3, the heat conducting plate 4 and the connecting base plate 1 can be disassembled and installed at any time, so that the heat conducting plate 4 can protect the packaging shell 7 when the integrated circuit is installed and welded, thereby preventing the heat generated by welding from damaging the internal circuit chip 10, thereby improving the service life of the circuit chip 10. When the integrated circuit is used for a long time, dust on the surface of the heat conducting plate 4 and the packaging shell 7 can be quickly cleaned, thereby improving the convenience of the device, thereby further improving the practicality of the device.

[0024] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions only describe the principles of the present invention. The present invention may be subject to various changes and improvements without departing from the spirit and scope of the present invention. These changes and improvements fall within the scope of the present invention. The scope of protection claimed by the present invention is defined by the attached claims and their equivalents.

Claims

1. A highly secure integrated circuit layered packaging device, comprising a connection base plate (1), characterized in that: The four corners of the top of the connecting base plate (1) are fixedly connected to a connecting base (2); the inner surface of the connecting base (2) is slidably connected to a supporting rod (3); the top of the supporting rod (3) is fixedly connected to a heat conducting plate (4); the outer surface of the heat conducting plate (4) is provided with a plurality of heat dissipation holes (5) in a rectangular array; the four sides of the top of the connecting base plate (1) are fixedly connected to a plurality of guide pieces (6) in a rectangular array; the center of the top of the connecting base plate (1) is fixedly connected to a packaging shell (7); the guide piece (6) is L-shaped; the top of the guide piece (6) passes through the packaging shell (7) and extends to the inside.

2. The high-security integrated circuit layered packaging device according to claim 1, characterized in that: A connecting plate (9) is provided inside the packaging shell (7); a circuit chip (10) is fixedly connected to the bottom end of the connecting plate (9); an electromagnetic shielding plate (11) is fixedly connected to the bottom end of the circuit chip (10); a silver paste (13) is provided between the circuit chip (10) and the electromagnetic shielding plate (11); an insulating base plate (12) is fixedly connected to the bottom end of the electromagnetic shielding plate (11); the bottom end of the insulating base plate (12) is fixedly connected to the connecting base plate (1); an epoxy resin (14) is provided at the top end of the connecting plate (9); and a plurality of convex points (15) in a rectangular array are provided at the top end of the connecting plate (9).

3. The high-security integrated circuit layered packaging device according to claim 2, characterized in that: The top end of the protrusion (15) is fixedly connected to a gold wire (8), and the other end of the gold wire (8) is fixedly connected to the top end of the guide plate (6).

4. The high-security integrated circuit layered packaging device according to claim 1, characterized in that: The connecting base (2) and the supporting rod (3) are made of ceramic, and the connecting base (2) and the supporting rod (3) are detachable.

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