Fixed multilayer circuit board

Abstract

The utility model discloses a fixed multilayer circuit board, which relates to the technical field of circuit boards and comprises a base layer, a heat dissipation structure is arranged on the base layer, a heat conduction layer is arranged on the heat dissipation structure, an insulating layer is arranged at the top of the heat conduction layer, an element is mounted on the insulating layer, the heat dissipation structure is a hollow heat dissipation pipeline, and the heat dissipation pipeline is provided with a plurality of through holes. The heat dissipation pipeline is a whole pipeline, one end of the pipeline is an input end, the other end of the pipeline is an output end, connecting threads are arranged on the input end and the output end, and plugs are inserted into the input end and the output end. According to the heat dissipation structure, the hollow heat dissipation pipeline is arranged, the heat dissipation pipeline can be independently used in the using process, heat dissipation is conducted through the heat dissipation pipeline, a certain heat dissipation effect is achieved, the input end of the heat dissipation pipeline can be connected with a cold air generating device, cold air is conveyed into the heat dissipation pipeline through the cold air generating device, and the heat dissipation effect of the heat dissipation structure can be greatly improved; and the practicability of the device is enhanced.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a fixed multilayer circuit board. Background Art

[0002] A circuit board can be called a printed circuit board or a printed circuit board. A flexible circuit board and a rigid circuit board are used, and after lamination and other processes, they are combined according to relevant process requirements to form a circuit board with the characteristics of a flexible circuit board and a rigid circuit board. As electronic products develop towards miniaturization and digitization, circuit boards also develop towards high density and high progress, and multi-layer circuit boards are born. At present, the existing multi-layer circuit boards often generate heat when used, thereby causing the internal temperature of the equipment to rise. If the heat is not dissipated in time, the equipment will continue to heat up, and the device will fail due to overheating, resulting in a decrease in the reliability of the electronic equipment, which in turn affects people's normal use. Therefore, the utility model proposes a heat dissipation type PCB circuit board. Utility Model Content

[0003] Technical issues solved

[0004] The purpose of the utility model is to make up for the deficiencies of the prior art and provide a fixed multi-layer circuit board.

[0005] Technical Solution

[0006] To achieve the above object, the utility model provides the following technical solution: a fixed multilayer circuit board, comprising a base layer, a heat dissipation structure is arranged on the base layer, a heat conduction layer is arranged on the heat dissipation structure, an insulating layer is arranged on the top of the heat conduction layer, and components are installed on the insulating layer;

[0007] The heat dissipation structure is a hollow heat dissipation pipe, which is a whole pipe. One end of the pipe is the input end, and the other end of the pipe is the output end. The input end and the output end are both provided with connecting threads, and plugs are also inserted in the input end and the output end. A hollow heat dissipation pipe is provided. When in use, the heat dissipation pipe can be used alone, and can achieve a certain heat dissipation effect by fanning itself. The heat dissipation pipe can also be connected to a cold air generating device at the input end, and cold air is transported to the heat dissipation pipe through the device, which can greatly improve the heat dissipation effect of the heat dissipation structure and enhance the practicality of the device.

[0008] Preferably, a second heat dissipation structure is fixedly connected to the bottom of the base layer, a second thermal conductive layer is filled between the base layer and the second heat dissipation structure, a second base layer is connected below the second thermal conductive layer, and a second heat dissipation structure with the same structure as the heat dissipation structure, as well as a second thermal conductive layer and a second base layer are also arranged at the bottom of the base layer. The arrangement of the above structure can further improve the heat dissipation effect of the multilayer circuit board and improve the practicability of the device.

[0009] Preferably, both the base layer and the second base layer are provided with mounting holes, and fixing members are passed through the mounting holes.

[0010] Preferably, the fixing piece is a plastic rivet.

[0011] Preferably, the second heat dissipation structure has the same structure as the heat dissipation structure.

[0012] Preferably, the second heat dissipation structure is a structure composed of a plurality of heat-dissipating fins.

[0013] Preferably, heat dissipation through holes are provided on the second base layer.

[0014] Preferably, cold air flows in the hollow heat dissipation pipe.

[0015] Beneficial effects:

[0016] Compared with the prior art, the fixed multilayer circuit board has the following beneficial effects:

[0017] 1. The utility model provides a hollow heat dissipation pipe, which can be used alone when in use, and can achieve a certain heat dissipation effect by fanning itself. The heat dissipation pipe can also be connected to a cold air generating device at the input end, and cold air is transported to the heat dissipation pipe through the device, which can greatly improve the heat dissipation effect of the heat dissipation structure and enhance the practicability of the device.

[0018] 2. The bottom of the base layer of the utility model is also provided with a second heat dissipation structure having the same structure as the heat dissipation structure, as well as a second heat conductive layer and a second base layer. The arrangement of the above structure can further improve the heat dissipation effect of the multilayer circuit board and improve the practicality of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the structure of the utility model;

[0020] Figure 2 It is a structural schematic diagram of another embodiment of the utility model;

[0021] Figure 3 It is a structural schematic diagram of the heat dissipation structure of the utility model;

[0022] Figure 4 It is a schematic diagram of the installation structure of the fixing member of the utility model.

[0023] In the figure:

[0024] 1. Base layer; 2. Heat dissipation structure; 201. Input end; 202. Output end; 203. Connecting thread; 204. Plug; 3. Heat-conducting layer; 4. Insulating layer; 5. Component; 6. Second heat dissipation structure; 7. Second heat-conducting layer; 8. Second base layer; 9. Mounting hole; 10. Fixing piece. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] See also Figure 1 to Figure 4 As shown, the utility model provides a technical solution: a fixed multilayer circuit board, comprising a base layer 1, a heat dissipation structure 2 is arranged on the base layer 1, a heat conduction layer 3 is arranged on the heat dissipation structure 2, an insulation layer 4 is arranged on the top of the heat conduction layer 3, and a component 5 is installed on the insulation layer 4;

[0027] The heat dissipation structure 2 is a hollow heat dissipation pipe, which is a whole pipe. One end of the pipe is the input end 201, and the other end of the pipe is the output end 202. The input end 201 and the output end 202 are both provided with connecting threads 203, and plugs 204 are also inserted into the input end 201 and the output end 202. A hollow heat dissipation pipe is provided. When in use, the heat dissipation pipe can be used alone, and heat can be fanned by itself to achieve a certain heat dissipation effect. The heat dissipation pipe can also be connected to a cold air generating device at the input end 201, and cold air is transported to the heat dissipation pipe through the device, which can greatly improve the heat dissipation effect of the heat dissipation structure 2 and enhance the practicality of the device.

[0028] Please pay attention to Figure 1 and Figure 2 A second heat dissipation structure 6 is fixedly connected to the bottom of the base layer 1, a second heat conducting layer 7 is filled between the base layer 1 and the second heat dissipation structure 6, a second base layer 8 is connected below the second heat conducting layer 7, heat dissipation holes are arranged on the second base layer 8, and a second heat dissipation structure 6 is also arranged at the bottom of the base layer 1.

[0029] Please pay attention to Figure 1 The second heat dissipation structure 6 in the present application can have the same structure as the heat dissipation structure 2 and the same operating principle. Together with the second thermal conductive layer 7 and the second base layer 8, the arrangement of the above structure can further improve the heat dissipation effect of the multilayer circuit board and improve the practicability of the device.

[0030] Please pay attention to Figure 2The second heat dissipation structure 6 in the present application can also be a structure composed of multiple heat-fanning fins, which, together with the second thermal conductive layer 7 and the second base layer 8, can also further improve the heat dissipation effect of the multi-layer circuit board and improve the practicability of the device.

[0031] The base layer 1 and the second base layer 8 in the present application are both provided with mounting holes 9 , and fixing members 10 are passed through the mounting holes 9 , and the fixing members 10 are plastic rivets.

[0032] Working principle: By setting up a hollow heat dissipation pipe, the heat dissipation pipe can be used alone when in use, and can achieve a certain heat dissipation effect by fanning itself. The heat dissipation pipe can also be connected to a cold air generating device at the input end 201, and cold air is transported to the heat dissipation pipe through the device, which can greatly improve the heat dissipation effect of the heat dissipation structure 2 and enhance the practicability of the device. A second heat dissipation structure 6 with the same structure as the heat dissipation structure 2, as well as a second heat conductive layer 7 and a second base layer 8 are also arranged at the bottom of the base layer 1. The arrangement of the above structure can further improve the heat dissipation effect of the multi-layer circuit board and improve the practicability of the device.

[0033] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A fixed multilayer circuit board, comprising a base layer (1), characterized in that: A heat dissipation structure (2) is arranged on the base layer (1), a heat conduction layer (3) is arranged on the heat dissipation structure (2), an insulation layer (4) is arranged on the top of the heat conduction layer (3), and a component (5) is mounted on the insulation layer (4); The heat dissipation structure (2) is a hollow heat dissipation pipe, which is a whole pipe, one end of the pipe is an input end (201), and the other end of the pipe is an output end (202), the input end (201) and the output end (202) are both provided with connecting threads (203), and the input end (201) and the output end (202) are both plugged with plugs (204).

2. A fixed multilayer circuit board according to claim 1, characterized in that: A second heat dissipation structure (6) is fixedly connected to the bottom of the base layer (1), a second heat conduction layer (7) is filled between the base layer (1) and the second heat dissipation structure (6), and a second base layer (8) is connected below the second heat conduction layer (7).

3. A fixed multilayer circuit board according to claim 1, characterized in that: The base layer (1) and the second base layer (8) are both provided with mounting holes (9), and fixing members (10) are passed through the mounting holes (9).

4. A fixed multilayer circuit board according to claim 3, characterized in that: The fixing piece (10) is a plastic rivet.

5. A fixed multilayer circuit board according to claim 2, characterized in that: The second heat dissipation structure (6) has the same structure as the heat dissipation structure (2).

6. A fixed multilayer circuit board according to claim 2, characterized in that: The second heat dissipation structure (6) is a structure composed of a plurality of heat-dissipating fins.

7. A fixed multilayer circuit board according to claim 2, characterized in that: The second base layer (8) is provided with heat dissipation through holes.

8. The fixed multilayer circuit board according to claim 1, characterized in that: Cold air flows through the hollow heat dissipation duct.

Images