Liquid-cooled heat dissipation structure

By using S-type cooling pipes and wave-type heat sinks in the liquid-cooled heat sink structure, the problem of insufficient contact area between the heat sink and the cooling medium circulation tube in the traditional structure is solved, and the heat dissipation performance is significantly improved.

CN222602848UActive Publication Date: 2025-03-11亿隅半导体科技(上海)有限公司
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Patent Information

Application Number
CN202420798746.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-17
Publication Date
2025-03-11
Estimated Expiration
2034-04-17

AI Technical Summary

Technical Problem

It is difficult for the traditional liquid-cooled heat dissipation structure to effectively increase the contact area between the heat sink and the cooling medium circulation tube in a limited space, resulting in insufficient heat dissipation performance.

Method used

A liquid-cooled heat dissipation structure is designed, and at least two sets of cooling pipes arranged in an S-shaped shape in the vertical direction are used, and a plurality of heat sinks are installed on the outer wall of the cooling medium circulation tube. The side walls, bottom walls and top walls of the heat sink are arranged as wave-shaped structures to increase the contact area and air circulation gap.

Benefits of technology

By increasing the contact area between the heat sink and the cooling medium circulation tube and the air circulation gap, the heat conduction effect and heat dissipation performance of the heat sink are significantly improved, effectively solving the problem of insufficient heat dissipation performance of traditional structures in limited spaces.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a liquid-cooled heat dissipation structure, which comprises a shell, a cooling medium circulation assembly and a plurality of heat dissipation fins, a mounting cavity communicated with the outside is formed in the shell; the cooling medium circulating assembly comprises a cooling medium circulating pipe; the cooling medium circulating pipe is fixedly mounted in the mounting cavity, and two ends of the cooling medium circulating pipe extend out of the mounting cavity; the cooling medium circulating pipe comprises at least two groups of cooling pipelines which are arranged in an S shape in the vertical direction; the multiple sets of cooling channels are arranged in parallel and communicate with one another, and a height difference is formed between every two adjacent sets of cooling channels. The multiple cooling fins are fixedly mounted on the outer wall of the cooling medium circulating pipe and located in the mounting cavity, and a gap is reserved between every two adjacent cooling fins. Through the arrangement, the contact area between the cooling fins and the cooling medium circulating pipe is increased in an effective space, so that the heat conduction effect of the cooling fins is improved, and the purpose of correspondingly improving the heat dissipation performance is achieved.
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Description

Technical Field

[0001] The utility model relates to the field of device heat dissipation, in particular to a liquid cooling type heat dissipation structure. Background Art

[0002] Medium frequency power supply is an indispensable equipment in industrial production, and its normal use is inseparable from effective heat dissipation. The heat dissipation methods of medium frequency power supply mainly include air cooling, water cooling and oil cooling. At present, the traditional liquid cooling heat dissipation structure usually includes components such as cooling medium circulation pipe, circulating water tank, circulating pump and heat sink. It uses the circulating water tank, circulating pump and cooling medium circulation pipe to form a liquid cooling circulation system to dissipate heat from the device, and sets a heat sink on the cooling medium circulation pipe to achieve heat conduction between the device and the cooling medium circulation pipe, so as to achieve the purpose of improving the heat dissipation effect. Since the effect of heat conduction mainly depends on the contact area between the heat sink and the cooling medium circulation pipe, how to increase the contact area between the heat sink and the cooling medium circulation pipe in a limited space has become the focus of improving the heat dissipation performance.

[0003] Therefore, a liquid-cooled heat dissipation structure is needed to increase the contact area between the heat sink and the cooling medium circulation pipe within the effective space, thereby improving the heat conduction effect of the heat dissipation device to be cooled and correspondingly improving the heat dissipation performance. Utility Model Content

[0004] The purpose of the utility model is to provide a liquid-cooled heat dissipation structure, so as to increase the contact area between the heat sink and the cooling medium circulation pipe within the effective space, thereby improving the heat conduction effect of the heat sink and correspondingly improving the heat dissipation performance.

[0005] In order to solve the above technical problems, the utility model provides a liquid-cooled heat dissipation structure, including a shell, a cooling medium circulation component and a plurality of heat sinks;

[0006] The housing is provided with a mounting cavity which is in communication with the outside world;

[0007] The cooling medium circulation assembly includes a cooling medium circulation pipe;

[0008] The cooling medium circulation pipe is fixedly installed in the installation cavity, and both ends extend to the outside of the installation cavity;

[0009] The cooling medium circulation pipe comprises at least two groups of cooling pipes arranged in an S shape in the vertical direction;

[0010] The plurality of groups of cooling pipes are arranged in parallel and are interconnected, and a height difference is formed between two adjacent groups of cooling pipes;

[0011] The plurality of heat sinks are fixedly mounted on the outer wall of the cooling medium circulation pipe and are located inside the mounting cavity, and a gap is reserved between two adjacent heat sinks.

[0012] Furthermore, the heat sink wraps the multiple groups of cooling pipes.

[0013] Furthermore, the side walls, bottom wall and top wall of the heat sink are all arranged in a wave-shaped structure.

[0014] Furthermore, the cooling medium circulation assembly further includes a first connecting pipe and a second connecting pipe connected to the same cooling medium circulation box;

[0015] The first connecting pipe is connected to the input end of the cooling medium circulation pipe;

[0016] The second connecting pipe is connected to the output end of the cooling medium circulation pipe.

[0017] Furthermore, the first connecting pipe and the second connecting pipe are both configured as hoses.

[0018] Furthermore, a cooling medium circulation pump is provided on the first connecting pipe.

[0019] Furthermore, the input end and the output end of the cooling medium circulation pipe are located on the same side of the inner cavity of the shell.

[0020] Furthermore, a heat dissipation fan is provided on the housing;

[0021] The heat dissipation fan is located below the installation cavity.

[0022] Furthermore, the shell is provided with a connection hole connected to the component to be cooled.

[0023] Furthermore, frames are provided on both sides of the inner wall of the shell;

[0024] The tops of the two racks are fixedly connected with a same cover plate;

[0025] The cover plate and the two frames surround and form the installation cavity with openings on both sides and the bottom.

[0026] Compared with the prior art, the present invention has at least the following beneficial effects:

[0027] By providing a cooling medium circulation pipe including at least two groups of cooling pipes arranged in an S-shape in the vertical direction, and connecting the heat sink to the cooling medium circulation pipe, the contact area between the heat sink and the cooling pipe in the vertical and horizontal directions can be correspondingly increased, thereby improving the cooling effect of the heat sink. Accordingly, when the heat sink contacts the component to be dissipated, the heat sink can better dissipate heat for the component to be dissipated, thereby achieving the purpose of increasing the contact area between the heat sink and the cooling medium circulation pipe within the effective space, thereby improving the heat conduction effect of the heat sink and correspondingly improving the heat dissipation performance.

[0028] Furthermore, since there is a height difference between two adjacent groups of cooling pipes, the cooling pipes can be used to cool the heat sink at different heights, thereby increasing the coverage area of ​​the heat sink during cooling and correspondingly increasing the cooling rate of the heat sink, thereby further improving the heat dissipation effect when the heat sink contacts the components to be cooled. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the overall structure of the liquid-cooled heat dissipation structure of the utility model;

[0030] Figure 2 This is a schematic diagram of the structure of the cooling medium circulation pipe in the liquid cooling heat dissipation structure of the utility model;

[0031] Figure 3 It is a structural schematic diagram of the heat sink in the liquid-cooled heat dissipation structure of the utility model.

[0032] Figure numbers: 1. Shell; 11. Cooling fan; 12. Connection hole; 13. Frame; 14. Cover plate; 2. Cooling medium circulation assembly; 21. Cooling medium circulation pipe; 22. First connecting pipe; 23. Second connecting pipe; 3. Heat sink. DETAILED DESCRIPTION

[0033] The following will be combined with a schematic diagram to describe the liquid cooling heat dissipation structure of the present invention in more detail, wherein the preferred embodiment of the present invention is shown, and it should be understood that those skilled in the art can modify the present invention described herein, while still achieving the beneficial effects of the present invention. Therefore, the following description should be understood as being widely known to those skilled in the art, and not as a limitation to the present invention.

[0034] The present invention is described in more detail in the following paragraphs by way of example with reference to the accompanying drawings. The advantages and features of the present invention will become more apparent from the following description. It should be noted that the accompanying drawings are in very simplified form and in non-precise proportions, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention.

[0035] like Figure 1 to Figure 2As shown, an embodiment of the utility model proposes a liquid-cooled heat dissipation structure, including a shell 1, a cooling medium circulation component 2 and a plurality of heat sinks 3.

[0036] An installation cavity connected to the outside is formed in the shell 1. By setting the installation cavity that can be connected to the outside, when the heat sink 3 is placed inside the installation cavity and the heat dissipation component is dissipated, the heat absorbed by the heat sink 3 can be transferred to the outside with the help of circulating air, so as to further improve the heat dissipation effect.

[0037] Among them, the component to be cooled can be set as a medium frequency power supply.

[0038] The cooling medium circulation component 2 includes a cooling medium circulation pipe 21 .

[0039] The cooling medium circulation pipe 21 is fixedly installed in the installation cavity, and both ends extend to the outside of the installation cavity. The cooling medium circulation pipe 21 is used to cool the heat sink 3, so that the heat sink 3 can perform heat dissipation and cooling operations on the heat dissipation components, that is, the heat sink 3 is used as an intermediate component to complete the heat dissipation of the heat dissipation components.

[0040] It should be particularly noted that the cooling medium circulation pipe 21 includes at least two groups of cooling pipes arranged in an S shape in the vertical direction. By setting up a cooling medium circulation pipe 21 including multiple groups of cooling pipes, and the cooling pipes are S-shaped, when the heat sink 3 is installed on the cooling medium circulation pipe 21, the contact area of ​​the cooling medium circulation pipe 21 in the vertical and horizontal directions can be effectively increased, thereby effectively improving the cooling effect on the heat sink 3, and then correspondingly improving the heat conduction effect between the heat sink 3 and the components to be cooled, thereby achieving the purpose of improving the heat dissipation performance.

[0041] Among them, multiple groups of cooling pipes are arranged in parallel and interconnected, and a height difference is formed between two adjacent groups of cooling pipes. The height difference between the two adjacent groups of cooling pipes is utilized to cool the heat sink 3 at different heights, thereby improving the cooling range and cooling rate of the heat sink 3, thereby achieving the purpose of improving the subsequent heat dissipation effect.

[0042] The plurality of heat sinks 3 are fixedly mounted on the outer wall of the cooling medium circulation pipe 21 and are located inside the mounting cavity, and a gap is reserved between two adjacent heat sinks 3. Through the reserved gap and the mounting cavity connected to the outside, the outside air can flow in the gap, and can also carry away the heat on the heat sink 3 accordingly, thereby achieving the purpose of further improving the heat dissipation effect.

[0043] The device is provided with a cooling medium circulation pipe 21 including at least two groups of cooling pipes arranged in an S shape in the vertical direction, and the heat sink 3 is connected to the cooling medium circulation pipe 21, that is, the contact area between the heat sink 3 and the cooling pipe in the vertical direction and the horizontal direction can be correspondingly increased, thereby improving the cooling effect of the heat sink 3. Correspondingly, when the heat sink 3 contacts the heat dissipation component, the heat sink 3 can better dissipate heat for the heat dissipation component, thereby achieving the purpose of increasing the contact area between the heat sink 3 and the cooling medium circulation pipe 21 within the effective space, thereby improving the heat conduction effect of the heat sink 3 and correspondingly improving the heat dissipation performance.

[0044] In addition, since there is a height difference between two adjacent groups of cooling pipes, the cooling pipes can be used to cool the heat sink 3 at different heights, thereby increasing the coverage area of ​​the heat sink 3 during cooling, and correspondingly increasing the cooling rate of the heat sink 3, so as to further improve the heat dissipation effect when the heat sink 3 contacts the components to be cooled.

[0045] The heat sink 3 wraps the plurality of cooling pipes, that is, the heat sink 3 is connected to the plurality of cooling pipes, so as to correspondingly enhance the cooling effect of the cooling medium circulation pipe 21 on the heat sink 3 .

[0046] like Figure 3 As shown, in a further embodiment, in order to increase the gap for external air circulation to further improve the heat dissipation effect, the side walls, bottom walls and top walls of the heat sink 3 are all set to have a wavy structure, and accordingly, the area in contact between the heat sink 3 and the external air is also correspondingly increased, so that the external air can better carry away the heat on the surface of the heat sink 3, thereby improving the heat dissipation effect.

[0047] In other embodiments, the cooling medium circulation assembly 2 is further defined to enable the cooling medium to circulate better.

[0048] The cooling medium circulation assembly 2 further includes a first connecting pipe 22 and a second connecting pipe 23 which are connected to the same cooling medium circulation box (not shown in the figure).

[0049] The first connecting pipe 22 is connected to the input end of the cooling medium circulation pipe 21, and the second connecting pipe 23 is connected to the output end of the cooling medium circulation pipe 21. That is, the cooling medium in the cooling medium circulation box is input into the cooling medium circulation pipe 21 through the first connecting pipe 22, and then discharged into the cooling medium circulation box through the second connecting pipe 23, so as to realize the circulation of the cooling medium and complete the refrigeration operation of the heat sink 3.

[0050] In this embodiment, the cooling medium can be set to coolant, cooling water or oil, etc.

[0051] It should be noted that a cooling medium circulation pump is provided on the first connecting pipe 22 .

[0052] In addition, the first connecting tube 22 and the second connecting tube 23 can be configured as hoses, that is, the first connecting tube 22 and the second connecting tube 23 can be bent to avoid installation interference caused by the inability to move the first connecting tube 22 and the second connecting tube 23 during subsequent installation of the device.

[0053] Please continue reading Figure 1 The input end and the output end of the cooling medium circulation pipe 21 are located on the same side of the inner cavity of the shell 1 to reduce the space occupied by the first connecting pipe 22 and the second connecting pipe 23 during installation.

[0054] In other embodiments, a heat dissipation fan 11 is disposed on the housing 1, and the heat dissipation fan 11 is located below the installation cavity.

[0055] Preferably, the housing 1 is provided with a connection hole 12 for connecting with a component to be cooled.

[0056] In addition, frames 13 are provided on both sides of the inner wall of the housing 1 , and the tops of the two frames 13 are fixedly connected to the same cover plate 14 .

[0057] Among them, the installation cavity with openings on both sides and the bottom is formed between the cover plate 14 and the two frames 13, so as to increase the path for the outside air to circulate in the installation cavity, making it easier for the outside air to carry away the heat on the surface of the heat sink 3, thereby better improving the heat dissipation effect of the heat dissipation components.

[0058] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A liquid cooling heat dissipation structure, characterized in that: It includes a shell, a cooling medium circulation component and a plurality of heat sinks; The housing is provided with a mounting cavity which is in communication with the outside world; The cooling medium circulation assembly includes a cooling medium circulation pipe; The cooling medium circulation pipe is fixedly installed in the installation cavity, and both ends extend to the outside of the installation cavity; The cooling medium circulation pipe comprises at least two groups of cooling pipes arranged in an S shape in the vertical direction; The plurality of groups of cooling pipes are arranged in parallel and are interconnected, and a height difference is formed between two adjacent groups of cooling pipes; The plurality of heat sinks are fixedly mounted on the outer wall of the cooling medium circulation pipe and are located inside the mounting cavity, and a gap is reserved between two adjacent heat sinks.

2. The liquid cooling heat dissipation structure according to claim 1, characterized in that: The heat sink wraps a plurality of groups of cooling pipes.

3. The liquid cooling heat dissipation structure according to claim 1, characterized in that: The side walls, bottom wall and top wall of the heat sink are all arranged in a wave-shaped structure.

4. The liquid cooling heat dissipation structure according to claim 1, characterized in that: The cooling medium circulation assembly also includes a first connecting pipe and a second connecting pipe which are connected to the same cooling medium circulation box; The first connecting pipe is connected to the input end of the cooling medium circulation pipe; The second connecting pipe is connected to the output end of the cooling medium circulation pipe.

5. The liquid cooling heat dissipation structure according to claim 4, characterized in that: The first connecting pipe and the second connecting pipe are both configured as hoses.

6. The liquid cooling heat dissipation structure according to claim 4, characterized in that: The first connecting pipe is provided with a cooling medium circulation pump.

7. The liquid cooling heat dissipation structure according to claim 1, characterized in that: The input end and the output end of the cooling medium circulation pipe are located on the same side of the inner cavity of the shell.

8. The liquid cooling heat dissipation structure according to claim 1, characterized in that: A heat dissipation fan is provided on the housing; The heat dissipation fan is located below the installation cavity.

9. The liquid cooling heat dissipation structure according to claim 1, characterized in that: The shell is provided with a connection hole connected to the component to be cooled.

10. The liquid cooling heat dissipation structure according to claim 1, characterized in that: Frames are arranged on both sides of the inner wall of the shell; The tops of the two racks are fixedly connected with a same cover plate; The cover plate and the two frames surround and form the installation cavity with openings on both sides and the bottom.