Heat dissipation structure, circuit module and air conditioner outdoor unit

Abstract

The utility model discloses a heat dissipation structure, a circuit module and an air conditioner outdoor unit, the heat dissipation structure is used for heat dissipation of the circuit module, the heat dissipation structure comprises a heat dissipation device and a support, one side of the heat dissipation device forms an uneven heat conduction surface, and the heat conduction surface is used for being attached to an electronic component assembly in the circuit module to be subjected to heat dissipation. The support is used for being connected between a circuit board and a heat dissipation device in a circuit module to be cooled, the support is provided with a frame used for surrounding an electronic component assembly, the frame is provided with long holes used for heat dissipation, one side of the frame is used for being attached to the circuit board, and the other side of the frame is matched with and attached to a heat conduction face of the heat dissipation device in shape. Winged insects can be prevented from entering the support, the electronic component assembly is prevented from being damaged by the winged insects, and the long holes in the support are beneficial to heat dissipation of the electronic component assembly.

Description

Technical Field

[0001] The utility model belongs to the technical field of air conditioners, and specifically relates to a heat dissipation structure, a circuit module and an air conditioner outdoor unit. Background Art

[0002] Some electronic components used in the circuit board of the air conditioner outdoor unit will generate a lot of heat during operation, causing the local temperature to be too high. In order to ensure the reliability of the system, a heat dissipation device needs to be added. The circuit board, electronic components and heat dissipation device of the air conditioner outdoor unit are usually installed on a bracket, which is then installed on the inner wall of the chassis of the air conditioner outdoor unit.

[0003] The existing bracket structure of the air conditioner outdoor unit only has the function of supporting and positioning. Since it is placed outdoors for a long time, flying insects are easy to accumulate near the IGBT, rectifier bridge, diode, IPM and other heating components on the circuit board, causing damage to key components and affecting the product life. Utility Model Content

[0004] The utility model aims at the above problems in the prior art and provides a heat dissipation structure, a circuit module and an air conditioner outdoor unit.

[0005] In order to achieve the above technical objectives, the utility model adopts the following technical solutions:

[0006] According to a first aspect of the utility model, a heat dissipation structure is provided for dissipating heat from a circuit module, the heat dissipation structure comprising:

[0007] A heat dissipation device, wherein one side of the heat dissipation device forms an uneven heat-conducting surface, and the heat-conducting surface is used to abut against electronic component assemblies in a circuit module to be cooled;

[0008] A bracket, wherein the bracket is used to be connected between a circuit board in a circuit module to be cooled and the heat dissipation device, the bracket is provided with a frame for surrounding the electronic component assembly, the frame is provided with long holes for heat dissipation, one side of the frame is used to fit with the circuit board, and the other side of the frame is adapted to and fits with the shape of the heat conductive surface of the heat dissipation device.

[0009] In some embodiments of the utility model, the frame of the bracket includes a protective plate forming a frame-type structure and a heightened plate connected to the protective plate, one side of the protective plate is in contact with the circuit board, and the heightened plate is staggeredly connected to the other side of the protective plate, and the long hole is formed between the protective plate and the heightened plate.

[0010] In some embodiments of the present invention, the heat-conducting surface at least includes a first surface and a second surface higher than the first surface, the first surface is in contact with the protective plate, and the second surface is in contact with the heightened plate.

[0011] In some embodiments of the present invention, a plurality of heat sinks arranged at intervals are provided on a side of the heat dissipation device away from the bracket.

[0012] According to a second aspect of the present invention, a circuit module is provided, including a circuit module, wherein the circuit module includes a circuit board and an electronic component assembly, and the circuit module also includes the above-mentioned heat dissipation structure.

[0013] In some embodiments of the present invention, a first positioning portion and a first positioning hole for plug-fitting are provided between the bracket in the heat dissipation structure and the circuit board.

[0014] In some embodiments of the present invention, a second positioning portion and a second positioning hole for plug-fitting are provided between the bracket and the heat dissipation device in the heat dissipation structure.

[0015] In some embodiments of the present invention, the electronic component assembly is fixedly connected to the bracket.

[0016] In some embodiments of the utility model, the electronic component assembly includes an IPM, a diode, an IGBT and a rectifier bridge, and the inner side of the frame is provided with an IPM support portion for installing the IPM, a diode support portion for installing the diode, an IGBT support portion for installing the IGBT and a rectifier bridge support portion for installing the rectifier bridge.

[0017] According to a third aspect of the utility model, an air-conditioner outdoor unit is also provided, comprising the above-mentioned circuit module.

[0018] Compared with the prior art, the advantages and positive effects of the utility model are:

[0019] The heat dissipation structure provided by the utility model comprises a bracket and a heat dissipation device. The bracket of the heat dissipation structure is fixedly connected between the circuit board of the circuit module to be cooled and the heat dissipation device. The frame of the bracket surrounds the electronic component assembly of the circuit module to be cooled. The heat conduction surface of the heat dissipation device is arranged in an uneven structure so that it can be abutted against the electronic component assemblies of different heights, thereby achieving a better heat dissipation effect. The opposite sides of the frame are respectively fitted with the circuit board and the heat conduction surface, which can prevent flying insects from entering the bracket and avoid the electronic component assembly being damaged by flying insects, thereby affecting the product life. Long holes are arranged on the frame so that air inside and outside the bracket can flow, which is beneficial to the heat dissipation of the electronic component assembly. The long holes are narrow gaps, which can prevent flying insects from entering.

[0020] After reading the specific embodiments of the present invention in conjunction with the accompanying drawings, other features and advantages of the present invention will become more clear. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 It is a schematic diagram of the overall structure of the circuit module provided by the utility model;

[0023] Figure 2 It is an exploded diagram of the circuit module provided by the utility model;

[0024] Figure 3 yes Figure 2 A schematic diagram of the structure of the heat dissipation device;

[0025] Figure 4 yes Figure 2 One of the structural diagrams of the middle bracket;

[0026] Figure 5 yes Figure 2 The second schematic diagram of the structure of the middle bracket;

[0027] Figure 6 yes Figure 2 A cross-sectional view of the middle bracket;

[0028] Figure 7 yes Figure 6 A magnified view of the local structure.

[0029] In the figure,

[0030] 1. Circuit board;

[0031] 11. A first positioning hole;

[0032] 2. Electronic components and assemblies;

[0033] 21. IPM; 22. Diode; 23. IGBT; 24. Rectifier bridge;

[0034] 3. Heat dissipation device;

[0035] 31. heat conducting surface; 311. first surface; 312. second surface;

[0036] 32. heat sink; 33. second positioning hole;

[0037] 4. Bracket;

[0038] 40. Long hole; 41. IPM support part; 42. Diode support part; 43. IGBT support part; 44. Rectifier bridge support part;

[0039] 45. Protective plate; 46. Heightening plate; 47. First positioning portion; 48. Second positioning portion; 49. Structural hole. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0041] In the description of the present invention, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore, should not be understood as a limitation on the present invention.

[0042] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances. In the description of the implementation method, specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0043] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features.

[0044] In the description of the present invention, unless otherwise specified, "plurality" means two or more. Unless otherwise specified, the numerical range herein includes not only the entire range within its two endpoints, but also several sub-ranges contained therein.

[0045] The utility model provides a heat dissipation structure, such as Figure 1 and Figure 2As shown, the heat dissipation structure is used to dissipate heat from the circuit module. The circuit module includes a circuit board 1 and an electronic component assembly 2. The electronic component assembly 2 includes a plurality of electronic components of different heights connected to the circuit board 1.

[0046] The heat dissipation structure includes a heat dissipation device 3 and a bracket 4. An uneven heat conduction surface 31 is formed on one side of the heat dissipation device 3, and the heat conduction surface 31 is used to abut against the electronic component assembly 2 in the circuit module to be cooled.

[0047] The bracket 4 is used to connect between the circuit board 1 and the heat sink 3. The bracket 4 is provided with a frame surrounding the electronic component assembly 2 in the circuit module to be cooled. The frame is provided with a long hole 40 for cooling. One side of the frame is in contact with the circuit board 1, and the other side of the frame is adapted to and in contact with the heat conducting surface 31 of the heat sink 3.

[0048] Electronic components will generate a lot of heat during operation. The heat conducting surface 31 of the heat dissipation device 3 is set to a structure corresponding to the height of multiple electronic components of different heights, so that multiple electronic components can be attached to the heat conducting surface 31, which can achieve a better heat dissipation effect. The opposite sides of the frame of the bracket 4 are respectively attached to the circuit board 1 and the heat conducting surface 31, which can prevent flying insects from entering the bracket 4 and avoid the electronic component assembly 2 from being damaged by flying insects, which affects the product life. Long holes 40 are set on the frame of the bracket 4 so that air inside and outside the bracket 4 can flow, which is beneficial to the heat dissipation of the electronic component assembly 2. The long holes 40 are narrow gaps that can prevent flying insects from entering.

[0049] The heat dissipation structure provided in this embodiment is used to dissipate heat from the circuit module of the air conditioner outdoor unit. The electronic component assembly 2 is a heating element on the circuit board 1 and is centrally arranged on the area of ​​the circuit board 1 that cooperates with the heat dissipation device 3. Other areas of the circuit board 1 can be arranged with other electronic components.

[0050] In some embodiments, Figure 4 and Figure 6 As shown, the bracket 4 includes a protective plate 45 forming a frame structure and a heightened plate 46 connected to the protective plate 45, one side of the protective plate 45 is in contact with the circuit board 1, and the heightened plate 46 is staggeredly connected to the other side of the protective plate 45, that is, the heightened plate 46 is connected to the side of the protective plate 45 close to the heat sink 3, and the long hole 40 is formed between the protective plate 45 and the heightened plate 46. The gap formed by the staggered connection of the protective plate 45 and the heightened plate 46 serves as the long hole 40, and no hole wall is formed, so that airflow can pass quickly, which is conducive to improving heat dissipation efficiency.

[0051] like Figure 3 As shown, the heat conducting surface 31 of the heat dissipation device 3 includes at least a first surface 311 and a second surface 312. Figure 4From a viewing angle, the second surface 312 is higher than the first surface 311, the first surface 311 is in contact with the protection plate 45 of the bracket 4, and the second surface 312 is in contact with the heightening plate 46. The bracket 4 is formed into a shape adapted to the heat conducting surface 31 by connecting the heightening plate 46 to the protection plate 45.

[0052] Of course, according to the types and positions of the multiple electronic components, the heat conducting surface 31 of the heat dissipation device 3 can be provided with other surfaces accordingly, so that the multiple electronic components can be close to the heat conducting surface 31 to ensure the heat dissipation effect. The position and height of the heightening plate 46 are set according to the shape of the heat conducting surface 31, so that the frame of the bracket 4 can be completely fitted with the heat conducting surface 31 without leaving any gap.

[0053] Specifically, continue to refer to Figure 3 A plurality of heat sinks 32 arranged at intervals are provided on the side of the heat sink 3 away from the bracket 4. The heat sink 32 can increase the heat dissipation area and improve the heat dissipation effect.

[0054] The utility model also provides a circuit module, a circuit module, the circuit module includes a circuit board 1 and an electronic component assembly 2, and also includes the heat dissipation structure provided above. The heat dissipation structure includes a heat dissipation device 3 and a bracket 4, and the electronic component assembly 2 includes a plurality of electronic components of different heights connected to the circuit board 1. An uneven heat-conducting surface 31 is formed on one side of the heat dissipation device 3, and the heat-conducting surface 31 is used to abut against the electronic component assembly 2. The bracket 4 is used to be connected between the circuit board 1 and the heat dissipation device 3, and the bracket 4 is provided with a frame surrounding the electronic component assembly 2, and the frame is provided with a long hole 40 for heat dissipation. One side of the frame is in contact with the circuit board 1, and the other side of the frame is adapted to and in contact with the heat-conducting surface 31 of the heat dissipation device 3.

[0055] The other structures, principles, functions, etc. of the heat dissipation device 3 and the bracket 4 can all refer to the heat dissipation structure provided above in the present invention, and will not be described in detail here.

[0056] In one embodiment, a plug-fitting first positioning portion 47 and a first positioning hole 11 are provided between the bracket 4 and the circuit board 1, which facilitates the positioning of the bracket 4 and the circuit board 1 during installation. Specifically, the first positioning portion 47 is provided on the side of the bracket 4 close to the circuit board 1, the first positioning hole 11 is provided on the circuit board 1, and the first positioning portion 47 is adaptively plugged into the first positioning hole 11.

[0057] In one embodiment, a second positioning portion 48 and a second positioning hole 33 are provided between the bracket 4 and the heat sink 3, which facilitates the positioning of the bracket 4 and the heat sink 3 during installation. Specifically, the second positioning portion 48 is on the side of the bracket 4 close to the heat sink 3, the second positioning hole 33 is provided on the heat sink 3, and the second positioning portion 48 is adaptively plugged into the heat sink 3.

[0058] In one embodiment, the electronic component assembly 2 includes an IPM (intelligent power module) 21, and an IPM support portion 41 for mounting the IPM 21 is disposed inside the frame of the bracket 4. The IPM 21 can be fixedly connected to the IPM support portion 41 by fasteners.

[0059] In one embodiment, the electronic component assembly 2 includes a diode 22, and a diode support portion 42 for mounting the diode 22 is disposed on the inner side of the frame of the bracket 4. The diode 22 can be fixedly connected to the diode support portion 42 by a fastener.

[0060] In one embodiment, the electronic component assembly 2 includes an IGBT (insulated gate bipolar transistor) 23, and an IGBT support portion 43 for mounting the IGBT 23 is disposed on the inner side of the frame of the bracket 4. The IGBT 23 can be fixedly connected to the IGBT support portion 43 by fasteners.

[0061] In one embodiment, the electronic component assembly 2 includes a rectifier bridge 24, and a rectifier bridge support portion 44 for mounting the rectifier bridge 24 is disposed on the inner side of the frame of the bracket 4. The rectifier bridge 24 can be fixedly connected to the rectifier bridge support portion 44 by fasteners.

[0062] In a specific embodiment, the electronic component assembly 2 includes an IPM 21, a diode 22, an IGBT 23 and a rectifier bridge 24, and an IPM support portion 41, a diode support portion 42, an IGBT support portion 43 and a rectifier bridge support portion 44 are provided on the inner side of the bracket 4. The IPM 21, the diode 22, the IGBT 23 and the rectifier bridge 24 are respectively matched at positions corresponding to the height of the heat conducting surface 31.

[0063] Specifically, the IPM support part 41, the diode support part 42, the IGBT support part 43, the rectifier bridge support part 44, the protective plate 45 and the heightening plate 46 of the bracket 4 can be an integrated structure. The circuit board 1, the bracket 4 and the heat sink 3 are provided with corresponding holes, and fasteners are inserted into the holes to fix the circuit board 1, the bracket 4 and the heat sink 3 together.

[0064] The IPM support portion 41 , the diode support portion 42 , the IGBT support portion 43 , and the rectifier bridge support portion 44 are also respectively provided with structural holes 49 for installing fasteners to fix the electronic components.

[0065] The position of each structural hole 49 corresponds to the position of the plurality of first positioning holes 11, and the first positioning portion 47 can form a raised annular structure at the edge of each structural hole 49. During installation, the first positioning portion 47 cooperates with the first positioning hole 11 to locate the relative position of the circuit board 1 and the bracket 4, and the fastener passes through the structural hole 49 and the first positioning hole 11 to fix each electronic component at the corresponding position of the bracket 4.

[0066] The utility model also provides an air conditioner outdoor unit, including the above-mentioned circuit module, the circuit module includes a circuit board 1, an electronic component assembly 2, a heat sink 3 and a bracket 4. The specific structure, principle, effect, etc. of the circuit board 1, the electronic component assembly 2, the heat sink 3 and the bracket 4 can refer to the circuit module provided in the above-mentioned figure of the utility model.

[0067] In detail, the air conditioner outdoor unit includes a housing, in which the circuit module is arranged. Other components such as a fan are also arranged in the housing.

[0068] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the above embodiments, it is still possible for a person skilled in the art to modify the technical solutions described in the above embodiments, or to replace some of the technical features therein with equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions claimed to be protected by the present invention.

Claims

1. A heat dissipation structure for dissipating heat from a circuit module, characterized in that: The heat dissipation structure comprises: A heat dissipation device, wherein one side of the heat dissipation device forms an uneven heat-conducting surface, and the heat-conducting surface is used to abut against electronic component assemblies in a circuit module to be cooled; A bracket, wherein the bracket is used to be connected between a circuit board in a circuit module to be cooled and the heat dissipation device, the bracket is provided with a frame for surrounding the electronic component assembly, the frame is provided with long holes for heat dissipation, one side of the frame is used to fit with the circuit board, and the other side of the frame is adapted to and fits with the shape of the heat conductive surface of the heat dissipation device.

2. The heat dissipation structure according to claim 1, characterized in that: The frame of the bracket includes a protective plate forming a frame-shaped structure and a heightened plate connected to the protective plate. One side of the protective plate is in contact with the circuit board, and the heightened plate is staggeredly connected to the other side of the protective plate. The long hole is formed between the protective plate and the heightened plate.

3. The heat dissipation structure according to claim 2, characterized in that: The heat-conducting surface at least includes a first surface and a second surface higher than the first surface, the first surface is in contact with the protection plate, and the second surface is in contact with the heightened plate.

4. The heat dissipation structure according to claim 1, characterized in that: A plurality of heat sinks arranged at intervals are arranged on one side of the heat dissipation device away from the bracket.

5. A circuit module, comprising a circuit module, wherein the circuit module comprises a circuit board and an electronic component assembly, characterized in that: The circuit module also includes the heat dissipation structure described in any one of claims 1 to 4 above.

6. The circuit module according to claim 5, characterized in that: A first positioning portion and a first positioning hole for plug-fitting are arranged between the bracket in the heat dissipation structure and the circuit board.

7. The circuit module according to claim 5, characterized in that: A second positioning portion and a second positioning hole for plug-fitting are provided between the bracket and the heat dissipation device in the heat dissipation structure.

8. The circuit module according to claim 5, characterized in that: The electronic component assembly is fixedly connected to the bracket.

9. The circuit module according to claim 8, characterized in that: The electronic component assembly includes an IPM, a diode, an IGBT and a rectifier bridge. The inner side of the frame is provided with an IPM support portion for mounting the IPM, a diode support portion for mounting the diode, an IGBT support portion for mounting the IGBT and a rectifier bridge support portion for mounting the rectifier bridge.

10. An air conditioner outdoor unit, characterized in that: A circuit module comprising any one of claims 5 to 9.

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