Oxygen analyzer protection device and wafer annealing equipment

Abstract

The utility model provides an oxygen analyzer protection device and wafer annealing equipment, and relates to the technical field of semiconductor preparation. The oxygen analyzer protection device is applied to an oxygen analyzer, and the oxygen analyzer is connected with a wafer annealing cavity through a gas sampling pipe. The oxygen analyzer protection device comprises a nitrogen pipeline and a valve mechanism. The valve mechanism comprises a first valve and a second valve, the first valve is arranged on the gas sampling pipe, and the second valve is arranged on the nitrogen pipeline. The nitrogen pipeline is communicated with the gas sampling pipe, and the pipeline joint of the nitrogen pipeline and the gas sampling pipe is located between the first valve and the oxygen analyzer. According to the utility model, the oxygen analyzer can be effectively protected, and the service life of the oxygen analyzer can be prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor preparation, in particular to an oxygen analyzer protection device and wafer annealing equipment. Background Art

[0002] Wafer annealing is an important process in the wafer preparation process. By heating the wafer and keeping it warm under certain conditions, the lattice structure can be changed, impurities and stress can be eliminated, and the electrical properties and structural integrity of the wafer can be improved.

[0003] In order to ensure that oxygen is not mixed into the annealing chamber during wafer annealing, it is necessary to detect the gas in the working annealing chamber through instruments such as oxygen analyzers. However, the inventors have found that when the annealing chamber is opened for maintenance, the oxygen analyzer will inhale the atmosphere, thereby affecting the service life of the oxygen analyzer. Utility Model Content

[0004] The purpose of the present utility model includes, for example, providing an oxygen analyzer protection device and a wafer annealing device, which can at least partially solve the above-mentioned technical problems.

[0005] The embodiments of the present invention can be implemented as follows:

[0006] In a first aspect, an embodiment of the utility model provides an oxygen analyzer protection device, which is applied to an oxygen analyzer, wherein the oxygen analyzer is connected to a wafer annealing chamber through a gas sampling tube; the oxygen analyzer protection device includes a nitrogen pipeline and a valve mechanism;

[0007] The valve mechanism comprises a first valve and a second valve, wherein the first valve is arranged on the gas sampling tube, and the second valve is arranged on the nitrogen pipeline;

[0008] The nitrogen pipeline is in communication with the gas sampling tube, and a pipeline connection between the nitrogen pipeline and the gas sampling tube is located between the first valve and the oxygen analyzer.

[0009] Optionally, the valve mechanism further comprises a third valve;

[0010] The third valve is mechanically connected to the first valve and the second valve through a gas tee.

[0011] Optionally, the first valve is a normally closed valve, and the second valve is a normally open valve.

[0012] Optionally, the first valve is a normally open valve, and the second valve is a normally closed valve.

[0013] Optionally, the valve mechanism further comprises a fourth valve;

[0014] The fourth valve is a manual valve, which is arranged on the gas sampling tube and located between the first valve and the wafer annealing chamber.

[0015] Optionally, the oxygen analyzer protection device further comprises a gas filter;

[0016] The gas filter is arranged on the gas sampling tube and is located between the pipeline connection and the oxygen analyzer.

[0017] Optionally, the gas sampling tube is made of stainless steel.

[0018] In a second aspect, an embodiment of the utility model provides a wafer annealing device, the wafer annealing device comprising an oxygen analyzer protection device, a wafer annealing chamber and an oxygen analyzer, wherein the oxygen analyzer is connected to the wafer annealing chamber via a gas sampling tube; the oxygen analyzer protection device comprises a nitrogen pipeline and a valve mechanism, and the nitrogen pipeline is arranged on the pipeline of the gas sampling tube between the oxygen analyzer and the wafer annealing chamber;

[0019] The valve mechanism comprises a first valve and a second valve, wherein the first valve is arranged on the gas sampling tube, and the second valve is arranged on the nitrogen pipeline;

[0020] The nitrogen pipeline is in communication with the gas sampling tube, and a pipeline connection between the nitrogen pipeline and the gas sampling tube is located between the first valve and the oxygen analyzer.

[0021] Optionally, the wafer annealing equipment further includes a first exhaust pipe;

[0022] One end of the first exhaust pipe is connected to the exhaust port of the wafer annealing chamber;

[0023] The gas sampling pipe is communicated with the first exhaust pipe.

[0024] Optionally, the wafer annealing equipment further includes a second exhaust pipe and an exhaust pump;

[0025] The gas outlet of the oxygen analyzer and the exhaust pump are connected to two ends of the second exhaust pipe respectively.

[0026] The beneficial effects of the embodiments of the present utility model include, for example:

[0027] By providing an oxygen analyzer protection device provided with a nitrogen pipeline and a valve mechanism, when the wafer annealing chamber is not working, nitrogen is introduced through the nitrogen pipeline and passes through the oxygen analyzer, so that gas flows into the air inlet of the oxygen analyzer even when the wafer annealing chamber is opened for maintenance. Therefore, negative pressure will not be formed at the air outlet of the oxygen analyzer, and the atmosphere is prevented from entering the cell tube inside the oxygen analyzer, which effectively increases the service life of the oxygen analyzer. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0029] Figure 1 A schematic diagram of an existing oxygen analyzer detecting an annealing chamber provided in an embodiment of the utility model;

[0030] Figure 2 A schematic diagram of the structure of an oxygen analyzer protection device provided in an embodiment of the utility model;

[0031] Figure 3 A schematic diagram of a valve mechanism of an oxygen analyzer protection device provided by an embodiment of the utility model;

[0032] Figure 4 A schematic structural diagram of a wafer annealing device provided in an embodiment of the utility model.

[0033] Icons: 10-wafer annealing equipment; 01-pipeline connection; 02-gas filter; 11-wafer annealing chamber; 111-first exhaust pipe; 12-oxygen analyzer; 121-second exhaust pipe; 122-exhaust pump; 13-gas sampling tube; 14-oxygen analyzer protection device; 141-valve mechanism; 1411-first valve; 1412-second valve; 1413-third valve; 1414-fourth valve; 142-nitrogen pipeline; 15-gas tee. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0035] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0037] In the description of the present utility model, it should be understood that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the utility model product is conventionally placed when in use, or are the orientations or positional relationships conventionally understood by those skilled in the art. They are only for the convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present utility model.

[0038] Furthermore, the terms “first”, “second”, “third”, etc. are merely used for distinguishing descriptions and are not to be understood as indicating or implying relative importance.

[0039] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0040] The rapid annealing process is an essential part of the wafer preparation process. Taking the Centura 5200 series RTP (Rapid Thermal Processing) as an example, it includes multiple chambers such as a high-temperature annealing chamber, a cooling chamber, and a transfer chamber. Among them, in the RTP's RTA (Rapid Thermal Annealing) process, the high-temperature annealing chamber needs to ensure that no oxygen enters during operation. Therefore, Figure 1As shown, an oxygen analyzer is generally connected to the gas outlet of the high-temperature annealing process chamber to sample and analyze the gas in the chamber to detect whether oxygen is discharged from the high-temperature annealing process chamber. If so, it indicates that the wafer preparation has failed.

[0041] When the high-temperature annealing process chamber is not working (for example, the chamber is opened for maintenance or overhaul), the passage of the gas sampling tube between the wafer annealing chamber and the oxygen analyzer is closed by the valve, and no gas flows into the inlet end of the oxygen analyzer, while the exhaust pump connected to the outlet end of the oxygen analyzer will form a negative pressure to absorb the atmosphere. After the atmosphere enters the oxygen analyzer, it will indirectly consume the life of the cell tube inside the oxygen analyzer, thereby affecting the service life of the oxygen analyzer.

[0042] Based on the above situation, the embodiment of the utility model provides an oxygen analyzer protection device and a wafer annealing equipment, which can effectively alleviate the above technical problems.

[0043] Please refer to Figure 2 , is a schematic diagram of the structure of an oxygen analyzer protection device 14 provided in an embodiment of the utility model, which is applied to an oxygen analyzer 12, wherein the oxygen analyzer 12 is connected to a wafer annealing chamber 11 via a gas sampling tube 13. The oxygen analyzer protection device 14 includes a nitrogen pipeline 142 and a valve mechanism 141.

[0044] The valve mechanism 141 includes a first valve 1411 and a second valve 1412 . The first valve 1411 is disposed on the gas sampling tube 13 , and the second valve 1412 is disposed on the nitrogen pipeline 142 .

[0045] The nitrogen pipeline 142 is in communication with the gas sampling tube 13 , and a pipeline connection point 01 between the nitrogen pipeline 142 and the gas sampling tube 13 is located between the first valve 1411 and the oxygen analyzer 12 .

[0046] The two ends of the gas sampling tube 13 are respectively connected to the gas outlet end of the wafer annealing chamber 11 and the gas inlet end of the oxygen analyzer 12. When the wafer annealing chamber 11 is working, the first valve 1411 is opened and the second valve 1412 is closed. The gas is discharged from the gas outlet end of the wafer annealing chamber 11 and flows into the oxygen analyzer 12 after passing through the first valve 1411. The oxygen analyzer 12 samples and analyzes the gas flowing out of the wafer annealing chamber 11 to detect whether oxygen is discharged from the wafer annealing chamber 11.

[0047] When the wafer annealing chamber 11 stops working, the first valve 1411 is closed and the second valve 1412 is opened, and no gas in the wafer annealing chamber 11 flows from its outlet through the gas sampling tube 13 into the oxygen analyzer 12. The nitrogen in the nitrogen pipeline 142 flows into the gas sampling tube 13 through the second valve 1412 and the pipeline connection 01, and enters the oxygen analyzer 12, thereby ensuring that the outlet of the oxygen analyzer 12 does not generate negative pressure, so that the atmosphere is sucked back from the outlet of the oxygen analyzer 12 into the cell tube of the oxygen analyzer 12, thereby ensuring the service life of the oxygen analyzer 12.

[0048] Alternatively, if Figure 3 As shown, the valve mechanism 141 further includes a third valve 1413. The third valve 1413 is mechanically connected to the first valve 1411 and the second valve 1412 through the gas three-way 15.

[0049] The third valve 1413 may be a solenoid valve. When the wafer annealing chamber 11 is working, the third valve 1413 supplies gas to the first valve 1411 through the gas tee 15 to open the first valve 1411. When the wafer annealing chamber 11 stops working, the third valve 1413 supplies gas to the second valve 1412 through the gas tee 15 to open the second valve 1412. This avoids the need to open and close the first valve 1411 and the second valve 1412 separately when the wafer annealing chamber 11 is working or not working, which is more convenient and quick.

[0050] Optionally, the first valve 1411 is a normally closed valve, and the second valve 1412 is a normally open valve.

[0051] Furthermore, the first valve 1411 can be set as a normally closed valve, and the second valve 1412 can be set as a normally open valve. When the wafer annealing chamber 11 is working, the third valve 1413 pushes the first valve 1411 open through gas, and the second valve 1412 is in a closed state; when the wafer annealing chamber 11 stops working, the third valve 1413 pushes the second valve 1412 open through gas, and the first valve 1411 is in a normally closed state.

[0052] Optionally, the first valve 1411 is a normally open valve, and the second valve 1412 is a normally closed valve.

[0053] In an optional implementation, the first valve 1411 may be set as a normally open valve, and the second valve 1412 may be set as a normally closed valve. Then, when the wafer annealing chamber 11 is working, the first valve 1411 is kept in a normally open state; and when the wafer annealing chamber 11 is not working, the first valve 1411 is closed, and the third valve 1413 is used to pneumatically push open the second valve 1412.

[0054] Alternatively, if Figure 3 As shown, the valve mechanism 141 further includes a fourth valve 1414. The fourth valve 1414 is a manual valve, which is disposed on the gas sampling tube 13 and is located between the first valve 1411 and the wafer annealing chamber 11.

[0055] The fourth valve 1414 is disposed between the wafer annealing chamber 11 and the first valve 1411. When the first valve 1411 fails, in order to ensure that no gas flows from the first valve 1411 to the oxygen analyzer 12 through the gas sampling tube 13, the staff can manually close the passage between the wafer annealing chamber 11 and the oxygen analyzer 12 through the fourth valve 1414, thereby further protecting the service life of the oxygen analyzer 12.

[0056] Alternatively, if Figure 3 As shown, the oxygen analyzer protection device 14 further includes a gas filter 02. The gas filter 02 is arranged on the gas sampling pipe 13, and is located between the pipe connection 01 and the oxygen analyzer 12.

[0057] A gas filter 02 is arranged between the pipeline connection 01 and the oxygen analyzer 12. Whether it is the gas flowing into the oxygen analyzer 12 when the wafer is working or the nitrogen flowing into the oxygen analyzer 12 when the wafer annealing chamber 11 is not working, it can be filtered by the gas filter 02 before flowing into the oxygen analyzer 12. This can prevent the impurities from flowing into the oxygen analyzer 12 and affecting the detection accuracy of the oxygen analyzer 12, and prevent the impurities from flowing into the oxygen analyzer 12 through the nitrogen pipeline 142 and affecting the life of the oxygen analyzer 12.

[0058] Optionally, the gas sampling tube 13 is made of stainless steel.

[0059] Stainless steel has the advantages of corrosion resistance, good high temperature strength, easy cleaning and maintenance, and can be applied to various environments and media, especially in high temperature, high pressure and corrosive environments. Therefore, stainless steel can be used as the material of the gas sampling tube 13. In order to ensure that the sampling accuracy of the oxygen analyzer 12 is not affected, a polished stainless steel tube can be used to reduce the effect of surface roughness on the oxygen content.

[0060] Based on the same inventive concept, the embodiment of the utility model specification provides a wafer annealing device 10, which includes an oxygen analyzer protection device 14, a wafer annealing chamber 11, and an oxygen analyzer 12, and the oxygen analyzer 12 is connected to the wafer annealing chamber 11 through a gas sampling tube 13. The oxygen analyzer protection device 14 includes a nitrogen pipeline 142 and a valve mechanism 141, and the nitrogen pipeline 142 is arranged on the pipeline of the gas sampling tube 13 between the oxygen analyzer 12 and the wafer annealing chamber 11.

[0061] The valve mechanism 141 includes a first valve 1411 and a second valve 1412 . The first valve 1411 is disposed on the gas sampling tube 13 , and the second valve 1412 is disposed on the nitrogen pipeline 142 .

[0062] The nitrogen pipeline 142 is in communication with the gas sampling tube 13 , and a pipeline connection point 01 between the nitrogen pipeline 142 and the gas sampling tube 13 is located between the first valve 1411 and the oxygen analyzer 12 .

[0063] Regarding the above-mentioned wafer annealing equipment 10, its function has been described in detail in the embodiment of the oxygen analyzer protection device 14 provided in this specification, and will not be elaborated here.

[0064] Alternatively, if Figure 4 As shown, the wafer annealing equipment 10 further includes a first exhaust pipe 111. One end of the first exhaust pipe 111 is connected to the exhaust port of the wafer annealing chamber 11. The gas sampling pipe 13 is in communication with the first exhaust pipe 111.

[0065] Since the oxygen analyzer 12 does not need to collect a large amount of gas flowing out of the wafer annealing chamber 11 when sampling the gas in the wafer annealing chamber 11, a first exhaust pipe 111 may be provided to connect the first exhaust pipe 111 to the gas outlet of the wafer annealing chamber 11, and the gas sampling pipe 13 is connected to the first exhaust pipe 111. When the wafer annealing chamber 11 is working, most of the gas flowing out of the wafer annealing chamber 11 is discharged through the first exhaust pipe 111, and a small part of the gas flows into the oxygen analyzer 12 through the gas sampling pipe 13 for sampling and analysis.

[0066] Alternatively, if Figure 4 As shown, the wafer annealing equipment 10 further includes a second exhaust pipe 121 and an exhaust pump 122. The gas outlet of the oxygen analyzer 12 and the exhaust pump 122 are connected to both ends of the second exhaust pipe 121, respectively.

[0067] When the wafer annealing chamber 11 is working, the exhaust pump 122 can speed up the flow of gas through the oxygen analyzer 12 ; when the wafer annealing chamber 11 is not working, the exhaust pump 122 is turned off, so that nitrogen flows through the oxygen analyzer 12 and is discharged through the second exhaust pipe 121 .

[0068] The utility model at least has the following beneficial effects:

[0069] 1. By providing an oxygen analyzer protection device provided with a nitrogen pipeline and a valve mechanism, when the wafer annealing chamber is not working, nitrogen is introduced through the nitrogen pipeline and passes through the oxygen analyzer, so that gas flows into the air inlet of the oxygen analyzer even when the wafer annealing chamber is opened for maintenance. Therefore, negative pressure will not be formed at the air outlet of the oxygen analyzer, and the atmosphere is prevented from entering the cell tube inside the oxygen analyzer, which effectively increases the service life of the oxygen analyzer.

[0070] 2. By setting a manual valve between the first valve on the gas sampling tube and the wafer annealing chamber, when the first valve fails, the manual valve can be used to close the passage between the wafer annealing chamber and the oxygen analyzer to prevent impurities from flowing into the oxygen analyzer, thereby further protecting the oxygen analyzer.

[0071] 3. By setting a gas filter between the pipeline connection on the gas sampling tube and the oxygen analyzer, some impurities can be filtered out at the gas filter, effectively improving the accuracy of the oxygen analyzer during use.

[0072] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An oxygen analyzer protection device, characterized in that: Applied to an oxygen analyzer, the oxygen analyzer is connected to a wafer annealing chamber through a gas sampling tube; the oxygen analyzer protection device includes a nitrogen pipeline and a valve mechanism; The valve mechanism comprises a first valve and a second valve, wherein the first valve is arranged on the gas sampling tube, and the second valve is arranged on the nitrogen pipeline; The nitrogen pipeline is in communication with the gas sampling tube, and a pipeline connection between the nitrogen pipeline and the gas sampling tube is located between the first valve and the oxygen analyzer.

2. The oxygen analyzer protection device according to claim 1, characterized in that: The valve mechanism further includes a third valve; The third valve is mechanically connected to the first valve and the second valve through a gas tee.

3. The oxygen analyzer protection device according to claim 1, characterized in that: The first valve is a normally closed valve, and the second valve is a normally open valve.

4. The oxygen analyzer protection device according to claim 1, characterized in that: The first valve is a normally open valve, and the second valve is a normally closed valve.

5. The oxygen analyzer protection device according to claim 1, characterized in that: The valve mechanism further includes a fourth valve; The fourth valve is a manual valve, which is arranged on the gas sampling tube and located between the first valve and the wafer annealing chamber.

6. The oxygen analyzer protection device according to claim 1, characterized in that: The oxygen analyzer protection device also includes a gas filter; The gas filter is arranged on the gas sampling tube and is located between the pipeline connection and the oxygen analyzer.

7. The oxygen analyzer protection device according to claim 1, characterized in that: The gas sampling tube is made of stainless steel.

8. A wafer annealing device, characterized in that: The wafer annealing equipment comprises an oxygen analyzer protection device, a wafer annealing chamber and an oxygen analyzer, wherein the oxygen analyzer is connected to the wafer annealing chamber through a gas sampling tube; the oxygen analyzer protection device comprises a nitrogen pipeline and a valve mechanism, wherein the nitrogen pipeline is arranged on the pipeline of the gas sampling tube between the oxygen analyzer and the wafer annealing chamber; The valve mechanism comprises a first valve and a second valve, wherein the first valve is arranged on the gas sampling tube, and the second valve is arranged on the nitrogen pipeline; The nitrogen pipeline is in communication with the gas sampling tube, and a pipeline connection between the nitrogen pipeline and the gas sampling tube is located between the first valve and the oxygen analyzer.

9. The wafer annealing equipment according to claim 8, characterized in that: The wafer annealing equipment also includes a first exhaust pipe; One end of the first exhaust pipe is connected to the exhaust port of the wafer annealing chamber; The gas sampling pipe is communicated with the first exhaust pipe.

10. The wafer annealing equipment according to claim 9, characterized in that: The wafer annealing equipment also includes a second exhaust pipe and an exhaust pump; The gas outlet of the oxygen analyzer and the exhaust pump are connected to two ends of the second exhaust pipe respectively.

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