Package structure

Abstract

The utility model discloses a packaging structure, and the structure comprises a slide holder, and a first surface of the slide holder is provided with a chip; one end of the pin is connected with the slide holder; the radiator is located on the second surface of the slide holder, and the first surface is opposite to the second surface; the clamping structure is used for clamping the slide holder in the edge area of the slide holder from the thickness direction; the plastic package body wraps the slide holder, the chip, the pin part and the clamping structure part; wherein heat-conducting insulating glue is further arranged between the first surface of the radiator and the second surface of the plastic package body, and the radiator is connected with the plastic package body through the heat-conducting insulating glue. The packaging structure provided by the utility model not only solves the warping problem caused by high temperature, but also improves the heat dissipation efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of packaging, and more specifically, to a packaging structure. Background Art

[0002] For power devices in the fields of automobiles, railways, power transmission and distribution, oil and gas development, etc., the operating temperature of power devices is getting higher and higher due to the characteristics of high voltage, high current, and high power, and the performance of power devices can be improved by increasing the operating temperature within the limit temperature of power devices. The use of third-generation semiconductor materials allows the maximum operating junction temperature to reach above 300°C, which is much higher than the 150°C of silicon devices. Therefore, the third-generation semiconductor packaging structure must meet the requirements of high-temperature operation. One of the most important challenges in the industrial field is the heat dissipation and cooling of power devices. The high power of third-generation semiconductors generates a large amount of concentrated heat, which requires improvements in the heat dissipation of the packaging structure.

[0003] In addition, under high heat conditions, the packaging structure will warp, which is mainly caused by the mismatch of thermal expansion coefficients between different materials. The plastic package of the packaging structure is mainly made of epoxy resin materials, which will expand and contract when the temperature changes. When the thermal expansion coefficients of other materials do not match, the contact interface will delaminate or break.

[0004] Therefore, how to design a packaging structure that can meet a large number of heat dissipation requirements while avoiding the warping of the plastic package, lead frame, and ceramic substrate during thermal expansion is an urgent problem that needs to be solved at this stage. Utility Model Content

[0005] In view of this, the purpose of the utility model is to provide a packaging structure, which not only solves the warping problem caused by high temperature, but also improves the heat dissipation efficiency.

[0006] The utility model provides a packaging structure, comprising: a wafer stage, a first surface of which is provided with a chip; a pin, one end of which is connected to the wafer stage; a heat sink, which is located on the second surface of the wafer stage, and the first surface and the second surface are opposite to each other; a clamping structure, which clamps the wafer stage in the thickness direction at the edge area of ​​the wafer stage; a plastic package body, which covers the wafer stage, the chip, part of the pin and part of the clamping structure; wherein a thermally conductive insulating adhesive is further arranged between the first surface of the heat sink and the second surface of the plastic package body, and the heat sink is connected to the plastic package body through the thermally conductive insulating adhesive.

[0007] Optionally, at least a portion of the second surface of the wafer carrier is exposed from the second surface of the plastic package body, and the heat sink is connected to the wafer carrier via the thermally conductive insulating adhesive.

[0008] Optionally, the heat sink includes a heat dissipation substrate and a heat dissipation column located on a second surface of the heat dissipation substrate, and the first surface of the heat dissipation substrate is opposite to the second surface of the wafer carrier.

[0009] Optionally, the heat sink includes an elastic structure located on the first surface of the heat dissipation substrate, and when the second surface of the wafer carrier is not exposed from the second surface of the plastic packaging body, the elastic structure is connected to the second surface of the plastic packaging body, and when at least part of the second surface of the wafer carrier is exposed from the second surface of the plastic packaging body, the elastic structure is connected to the second surface of the wafer carrier.

[0010] In the above packaging structure, the area of ​​the second surface of the wafer stage exposed from the second surface of the plastic packaging body is 55% to 70% of the area of ​​the second surface of the plastic packaging body.

[0011] Optionally, a portion of the second surface of the wafer carrier exposed from the second surface of the plastic package body is covered by a protective layer.

[0012] Optionally, the thermally conductive insulating adhesive covers the elastic structure of the heat sink.

[0013] Optionally, the thickness of the thermally conductive insulating adhesive is 2 mm to 3 mm, and the height of the clamping structure exposed from the thermally conductive insulating adhesive is 2 mm to 3 mm.

[0014] Optionally, the clamping structure includes a first part, a second part and a connecting part, the connecting part connects the first part with the second part, the connecting part is perpendicular to the first part and the second part, and the first part and the second part clamp the wafer stage from the first surface and the second surface of the wafer stage respectively.

[0015] Optionally, the clamping structure further includes a stress release end, wherein the stress release end is located at a corner between the connecting portion and the second portion, and the stress release end extends in a direction away from the wafer stage at the corner.

[0016] Optionally, the clamping structure includes at least two, and the two clamping structures clamp the wafer stage from two sides of the wafer stage respectively.

[0017] Optionally, a side surface of the second portion of the clamping structure contacts the first surface of the heat dissipation substrate.

[0018] Optionally, the elastic structure includes a sleeve, an elastic member and a top block, one end of the sleeve is connected to the heat dissipation substrate, and the other end of the sleeve faces the wafer carrier. The elastic member is located in the sleeve and connects the sleeve and the top block. The top block can move in the sleeve. With the support of the elastic member, the top block at least partially extends out of the sleeve, so that the top of the top block contacts the second surface of the wafer carrier or the second surface of the plastic package body.

[0019] Optionally, the elastic member is in a compressed state.

[0020] Optionally, the elastic structure comprises a plurality of elastic structures, and the plurality of elastic structures are arranged in a uniform array.

[0021] Optionally, the wafer carrier comprises a copper-clad ceramic substrate or a lead frame.

[0022] Beneficial effects of the utility model:

[0023] The packaging structure provided by the utility model installs a clamping structure on a wafer stage, and then uses a heat-conducting insulating adhesive to connect the heat sink to the wafer stage, thereby preventing the wafer stage from deforming and enhancing the heat dissipation capacity of the packaging structure. The use of a clamping structure instead of welding can also effectively avoid failure problems caused by weak welding.

[0024] Furthermore, the heat sink also includes an elastic structure, which can effectively prevent the wafer stage from deforming and causing warping through the clamping structure and the mechanical and physical properties of the elastic structure, thereby not only enhancing the high-temperature applicability of the packaging structure, but also further enhancing the stability of the packaging structure. Due to the retractable characteristics of the elastic structure, while preventing the wafer stage from warping, it also avoids deformation or cracking of the top of the wafer stage.

[0025] In the packaging structure, the first surface of the heat sink is opposite to the second surface of the wafer carrier, and at least a portion of the second surface of the wafer carrier is exposed from the plastic package, thereby achieving extremely high heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The above and other objects, features and advantages of the present invention will become more apparent through the following description of the embodiments of the present invention with reference to the accompanying drawings.

[0027] Figure 1 A top view showing the packaging structure of the first embodiment of the utility model;

[0028] Figure 2 A right side view showing the packaging structure of the first embodiment of the utility model;

[0029] Figure 3 The packaging structure of the first embodiment of the utility model is shown along Figure 1 Schematic cross-sectional view of the AA line;

[0030] Figure 4 The packaging structure of the second embodiment of the utility model is shown along Figure 1 Schematic cross-sectional view of the AA line;

[0031] Figure 5 A schematic diagram showing an elastic structure in a packaging structure of a first embodiment of the utility model;

[0032] Figure 6 The packaging structure of the first embodiment of the utility model is shown along Figure 1 Schematic cross-sectional view of the middle BB line;

[0033] Figure 7 A schematic diagram showing the packaging structure of the first embodiment of the utility model before plastic packaging;

[0034] Figure 8 A three-dimensional schematic diagram showing the packaging structure of the first embodiment of the utility model;

[0035] Fig. 9 A schematic diagram showing a packaging structure of a third embodiment of the present utility model;

[0036] Fig.10 The packaging structure of the third embodiment of the utility model is shown along Fig. 9 Schematic cross-sectional view of the CC line. DETAILED DESCRIPTION

[0037] Various embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. In each of the accompanying drawings, the same elements are represented by the same or similar reference numerals. For the sake of clarity, the various parts in the accompanying drawings are not drawn to scale.

[0038] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0039] Figure 1 and Figure 2 The top view and right view of the packaging structure of the first embodiment of the utility model are shown respectively. Figure 1As shown, the packaging structure includes a wafer carrier 111, pins 112, a heat sink 120 and a plastic package 130, wherein at least one chip is arranged on the first surface of the wafer carrier 111, a plurality of pins 112 are connected to the wafer carrier 111, the wafer carrier 111, the chip and parts of the pins 112 are covered by the plastic package 130, one end of the pin 112 is connected to the wafer carrier 111, and the other end of the pin 112 extends out of the plastic package 130; the heat sink 120 is located on one side of the second surface of the wafer carrier 111, and the heat sink 120 is located on the second surface of the wafer carrier 111. The first surface of the heat sink 120 is connected to the second surface of the plastic package 130 through a heat-conducting insulating adhesive 140 (blocked and invisible in the figure). Preferably, a portion of the second surface of the wafer carrier 111 is exposed from the second surface of the plastic package 130, the first surface is opposite to the second surface, and the first surface of the heat sink 120 is connected to the second surface of the wafer carrier 111 through the heat-conducting insulating adhesive 140; the clamping structure 150 clamps the wafer carrier 111 in the thickness direction at the edge area of ​​the wafer carrier 111; a portion of the clamping structure 150 is attached to the wafer carrier 111 along the thickness direction. The wafer carrier 111 is covered by the plastic package 130. The clamping structure 150 includes at least two, and the two clamping structures 150 clamp the wafer carrier 111 from both sides of the wafer carrier 111. Further, the clamping structure 150 is, for example, four, and the four clamping structures 150 are respectively located at the four corners of the wafer carrier 111; the heat sink 120 includes a heat sink substrate 123 and a heat sink column 124, and the heat sink column 124 is located on the second surface of the heat sink substrate 123 and connected to the heat sink substrate 123. The heat sink 120 also includes an elastic structure (Figure When the second surface of the stage 111 is not exposed from the second surface of the plastic package 130, the elastic structure is located between the first surface of the heat dissipation substrate 123 and the second surface of the plastic package 130. When at least part of the second surface of the stage 111 is exposed from the second surface of the plastic package 120, the elastic structure is located between the first surface of the heat dissipation substrate 123 and the second surface of the stage 111. The elastic structure can provide an elastic force pointing in the direction of the stage 111 to the second surface of the stage 111. Specifically, the clamping structure 150 can withstand the stress generated by the expansion of the stage 111 under high temperature conditions. The elastic structure can provide an elastic force during the deformation of the stage 111. The elastic force can prevent the stage 111 from warping, thereby improving the warping problem.

[0040] See also Figure 2The right side view is shown to better illustrate the up-and-down relationship of the various parts in the packaging structure of the first embodiment. Specifically, the heat sink 120 includes a heat sink substrate 123 and a heat sink column 124, the heat sink column 124 is located on the second surface of the heat sink substrate 123 and is connected to the heat sink substrate 123, the plastic package 130 is located on the side of the first surface of the heat sink substrate 123, the wafer stage 111 is covered by the plastic package 130 and is not visible, at least part of the second surface of the wafer stage 111 is exposed from the second surface of the plastic package 130, the heat sink 123 is connected to the wafer stage 111 through a thermally conductive insulating adhesive 140, and the clamping structure 150 clamps the wafer stage 111 in the thickness direction at the edge area of ​​the wafer stage 111. The heat sink 120 also includes an elastic structure, which is located between the heat sink substrate 123 and the wafer stage 111, one end of the elastic structure is connected to the first surface of the heat sink substrate 123, and the other end of the elastic structure is in contact with the second surface of the wafer stage 111 or the second surface of the plastic package 130, so as to provide a downward elastic force to the wafer stage 111 to reduce the warping caused by high-temperature deformation of the wafer stage 111. Furthermore, the heat-conducting insulating adhesive 140 is partially filled between the heat-dissipating substrate 123 and the wafer carrier 111 to connect the heat sink 120 to the plastic package 130 (or the wafer carrier 111). The heat-conducting insulating adhesive 140, for example, covers the surface of the wafer carrier 111 exposed from the plastic package 130 to insulate and prevent leakage. The area of ​​the wafer carrier 111 covered by the heat-conducting insulating adhesive 140 is, for example, less than or equal to the area of ​​the wafer carrier 111 exposed from the plastic package 130. The heat-conducting insulating adhesive 140 also covers the elastic structure of the heat sink 120. The thickness of the heat-conducting insulating adhesive 140 is, for example, 2 mm to 3 mm, and the thickness of the heat-conducting insulating adhesive 140 can also be uniformed by the elastic structure. One side surface of the clamping structure 150 contacts the first surface of the heat-dissipating substrate 123, and the height of the clamping structure 150 exposed from the heat-conducting insulating adhesive 140 is 2 mm to 3 mm.

[0041] Figure 3 The packaging structure of the first embodiment of the utility model is shown along Figure 1 AA line cross-sectional view; Figure 3As can be seen in the figure, the wafer stage 111 is, for example, a DBC (copper-clad ceramic) substrate, the wafer stage 111 is covered by the plastic package 130 and at least part of the second surface of the wafer stage 111 is exposed from the second surface of the plastic package 130. Specifically, the area of ​​the second surface of the wafer stage 111 exposed from the plastic package 130 accounts for 55% to 70% of the total area of ​​the second surface of the plastic package 130. If the exposed area is too large, the risk of insulation failure is likely to occur. If the exposed area is too small, the warping problem of the wafer stage 111 cannot be avoided. The heat dissipation substrate 123 of the radiator 120 is connected to the wafer stage 111 through the thermal conductive insulating glue 140. The clamping structure 150 clamps the wafer stage 111 in the thickness direction at the edge area of ​​the wafer stage 111. The second surface of the heat dissipation substrate 123 is provided with a plurality of heat dissipation columns 124 to increase the heat dissipation area. Of course, part of the clamping structure 150 is also covered by the plastic package 130.

[0042] The clamping structure 150 includes a first portion 151, a second portion 152 and a connecting portion 153. The connecting portion 153 connects the first portion 151 and the second portion 152 to form a C-shaped structure. The connecting portion 153 is perpendicular to the first portion 151 and the second portion 152. The first portion 151 and the second portion 152 clamp the stage 111 from the first surface and the second surface of the stage 111, respectively. An elastic structure 122 is also provided between the first surface of the heat dissipation substrate 123 and the second surface of the stage 111. Specifically, the height of the elastic structure 122 in a relaxed state is, for example, greater than the distance between the heat dissipation substrate 123 and the stage 111, that is, the elastic structure 122 located between the heat dissipation substrate 123 and the stage 111 is in a compressed state, and the elastic structure 122 provides an elastic force pointing in the direction of the stage 111 to the stage 111. Furthermore, the surface of the wafer stage 111 exposed from the plastic package 130 needs to be treated with oxidation prevention, such as coating a protective layer. When the wafer stage 111 is a ceramic substrate DBC, the protective layer is formed by coating an antioxidant, for example. The elastic structure 122 is coated with a thermally conductive insulating adhesive 140. The thermally conductive insulating adhesive 140 can not only cover the exposed surface of the wafer stage 111 to prevent leakage, but also can effectively conduct the heat of the wafer stage 111 to the heat dissipation substrate 123 of the heat sink 120. The thickness of the thermally conductive insulating adhesive 140 is, for example, 2 mm to 3 mm.

[0043] Figure 4 The packaging structure of the second embodiment of the utility model is shown along Figure 1; The second embodiment is similar to the first embodiment, except that the clamping structure 150 in the second embodiment not only includes the first part 151, the second part 152 and the connecting part 153, but also has a stress release end 154 extending upward (in the direction away from the wafer stage 111) at the corner of the second part 152 and the connecting part 153. Since the clamping structure 150 needs to use insulating materials, specifically, the clamping structure 150 uses a combination of copper and ceramic or copper and diamond, and since such materials are brittle, the clamping structure 150 cannot be processed into a rounded corner during processing, but the use of a right-angle structure will cause stress concentration at the right angle. Therefore, in the second embodiment, a stress release end 154 extending upward is provided at the corner of the second part 152 and the connecting part 153, and the stress is released through the stress release end 154. Of course, the stress release end 154 can also assist in heat dissipation, and the length of the stress release end 154 can also be adjusted according to needs.

[0044] Figure 5 Shows Figure 3 The detailed structure of the elastic structure 122 is shown in FIG. 1 . Specifically, the elastic structure 122 includes a sleeve 1221, an elastic member 1222 and a top block 1223, wherein the sleeve 1221 is, for example, a cylindrical sleeve, and one end of the bottom thereof has a transversely extending base to better connect with the heat dissipation substrate 123 of the heat sink 120, as shown in FIG. Figure 5 In the cross-sectional view of , the sleeve 1221 is T-shaped, and the elastic member 1222 is, for example, a spring. The elastic member 1222 is located in the sleeve 1221, and the original length (not stretched or compressed) of the elastic member 1222 is, for example, smaller than the depth of the sleeve 1221. One end of the elastic member 1222 is connected to the bottom of the sleeve 1221, and the other end is connected to the top block 1223. The top block 1223 is at least partially located in the sleeve 1221, and the top end of the top block 1223 extends out of the sleeve 1221 and contacts the wafer stage 111. The top block 1223 can move in the sleeve 1221 along the axial direction of the sleeve 1221. Of course, the height of the sleeve 1221 needs to be smaller than the distance between the wafer stage 111 and the heat dissipation substrate 123, and when the wafer stage 111 and the heat dissipation substrate 123 are connected by the thermally conductive insulating adhesive 140, the elastic member 1222 is in a compressed state, so that the top block 1223 in the elastic structure 122 between the wafer stage 111 and the heat dissipation substrate 123 provides elastic force to the wafer stage 111. In this embodiment, the elastic structure 122 is made of metal, such as copper, to facilitate heat dissipation.

[0045] Figure 6 The packaging structure of the first embodiment of the utility model is shown along Figure 1 Schematic diagram of the cross section along the BB line; Figure 6As can be seen in the figure, the second surface of the wafer stage 111 is arranged opposite to the first surface of the heat dissipation substrate 123 of the radiator 120, and the clamping structure 150 includes, for example, 4, and the 4 clamping structures 150 are arranged at the four corners of the heat dissipation substrate 123 and connected to the wafer stage 111. The elastic structure 122 includes, for example, 6, 3 in each row, and arranged in a uniform array along two rows. Of course, the number of the clamping structures 150 and the number of the elastic structures 122 can be adjusted according to demand, and the clamping structures 150 can be, for example, 2 to 8, and the number of the elastic structures 122 can be, for example, 4 to 8. The first surface of the wafer stage 111 is provided with a chip 113, and one end of the pin 112 is connected to the wafer stage 111 in the plastic package 130, and the other end extends out of the plastic package 130. Specifically, the chip 113 includes, for example, a MEMS sensor chip, an IGBT chip, a MOS chip, a driver chip, etc.

[0046] Figure 7 and Figure 8 The schematic diagram of the package structure of the first embodiment of the utility model before and after plastic packaging are respectively shown; the chip 113 in the package structure is connected to the first surface of the wafer stage 111 through, for example, bonding wires, conductive glue, solder, etc., and the pin 112 is also connected to the first surface of the wafer stage 111. The wafer stage 111 is clamped and fixed in the thickness direction by a clamping structure 150 arranged at the edge of the wafer stage 111, and a uniformly arrayed elastic structure is arranged between the heat dissipation substrate 123 of the heat sink 120 and the wafer stage 111 (obscured and invisible in the figure).

[0047] Specifically, the chip 113 is first fixed to the first surface of the wafer stage 111 and electrically connected to the wafer stage 111 through bonding wires; then the clamping structure 150 is connected to the wafer stage 111, for example, the clamping structure 150 can directly clamp the wafer stage 111, or a groove is set on the wafer stage 111, and the clamping structure 150 is inserted into the groove to clamp the wafer stage 111; then, an anti-oxidation protective layer is coated on the second surface of the wafer stage 111; and then a plastic encapsulation process is performed to encapsulate the wafer stage 111 through the plastic encapsulation body 130. The stage 111, the chip 113, the bonding wires, part of the pins 112, and part of the clamping structure 150 are covered and protected; after the plastic packaging is completed, the second surface of the wafer carrier 111 exposed from the second surface of the plastic packaging body 130 is coated with a thermally conductive insulating adhesive 140, and then the heat sink 120 is connected to the thermally conductive insulating adhesive 140, and then cured at a certain temperature to complete the overall packaging. After the packaging is completed, the first surface of the heat dissipation substrate 123 of the heat sink 120 is in contact with the second surface of the clamping structure 150.

[0048] Among them, if the wafer carrier 111 is a DBC substrate, after installing the clamping structure 150, the pins 112 and the wafer carrier 111 (DBC substrate) need to be welded and connected; if the wafer carrier 111 is a lead frame, the wafer carrier 111 and the pins 112 are an integrated structure.

[0049] During the packaging process, especially in the high temperature working environment of the plastic sealing process, or under the condition of continuous maintenance of the working temperature in the later stage, the wafer stage 111 is prone to warping, resulting in deformation of bending upward or bending downward. If an external force can be applied to prevent such deformation under high temperature before the deformation occurs, the warping problem can be avoided, thereby improving the reliability and life of the packaging structure. The clamping structure 150 tightly clamps the wafer stage 111 that is deformed, and provides resistance to prevent deformation when deformation occurs.

[0050] The elastic structure 122 is integrated with the heat dissipation substrate 123; when the heat sink 120 is bonded to the wafer carrier 111, the fixed height of the elastic structure 122 can, on the one hand, make the thickness of the thermally conductive insulating adhesive 140 in the middle uniform; on the other hand, if the wafer carrier 111 bulges toward the side of the heat sink 120 due to high-temperature thermal expansion, the elastic structure 122 is stressed to offset the stress of material expansion and avoid warping caused by deformation. At the same time, because the elastic structure 122 can rebound, the risk of concentrated force causing cracks in the wafer carrier 111 is avoided.

[0051] In this packaging structure, the heat dissipation substrate 123 of the heat sink 120 is in contact with the clamping structure 150, and the elastic structure 122 of the heat sink 120 is in contact with the wafer stage 111, and the spring in the elastic structure 122 is in a compressed state. When the wafer stage 111 is warped and deformed, if the wafer stage 111 bulges toward the side of the heat sink 120, the elastic structure 122 generates a force to resist the bulge and prevent warping. The function of the clamping structure 150 is to resist deformation and prevent warping when the wafer stage 111 bulges toward the side away from the heat sink 120. The size of the force resisting deformation can be controlled by controlling the contact area between the clamping structure 150 and the wafer stage 111.

[0052] Fig. 9 A schematic diagram showing a packaging structure of a third embodiment of the present utility model; Fig.10 The packaging structure of the third embodiment of the utility model is shown along Fig. 9The third embodiment is similar to the first embodiment, and the main difference is that the packaging type of the third embodiment is different. Specifically, the plastic package 130 is smaller, the number of pins 112 is less, and the pins 112 extend from one side of the plastic package 130 and extend in a straight line without bending. The packaging structure of the third embodiment also has a wafer carrier 111, a heat sink 120, a clamping structure 150, an elastic structure 122, a thermally conductive insulating adhesive 140 and a plastic package 130 similar to those of the first embodiment. It can be understood that for packaging structures of other packaging types, corresponding elastic structures 122 and clamping structures 150 can also be provided to prevent warping and improve heat dissipation efficiency. When the packaging structure is small, the radiator 120 may not be provided with an elastic structure 122, and can be directly connected to the plastic package 130 or the wafer carrier 111 through the thermally conductive insulating adhesive 140.

[0053] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or equipment. In the absence of further restrictions, the elements defined by the statement "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or equipment including the elements.

[0054] The embodiments of the present invention are described above, and these embodiments do not describe all the details in detail, nor do they limit the present invention to the specific embodiments described. Obviously, many modifications and changes can be made based on the above description. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can make good use of the present invention and the modifications based on the present invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A packaging structure, characterized in that: include: A wafer stage, wherein a chip is disposed on a first surface of the wafer stage; A pin, one end of which is connected to the wafer stage; A heat sink is located on the second surface of the wafer stage, the first surface and the second surface are opposite to each other; A clamping structure, wherein the clamping structure clamps the wafer stage in the thickness direction at the edge area of ​​the wafer stage; A plastic package covering the wafer carrier, the chip, a portion of the pins and a portion of the clamping structure; Wherein, a heat-conducting insulating adhesive is further arranged between the first surface of the heat sink and the second surface of the plastic package body, and the heat sink is connected to the plastic package body through the heat-conducting insulating adhesive.

2. The packaging structure according to claim 1, characterized in that: At least a portion of the second surface of the wafer carrier is exposed from the second surface of the plastic package body, and the heat sink is connected to the wafer carrier through the thermally conductive insulating adhesive.

3. The packaging structure according to claim 1 or 2, characterized in that: The heat sink includes a heat dissipation substrate and a heat dissipation column located on a second surface of the heat dissipation substrate, and the first surface of the heat dissipation substrate is opposite to the second surface of the wafer stage.

4. The packaging structure according to claim 3, characterized in that: The heat sink also includes an elastic structure located on the first surface of the heat dissipation substrate. When the second surface of the wafer carrier is not exposed from the second surface of the plastic packaging body, the elastic structure is connected to the second surface of the plastic packaging body. When at least part of the second surface of the wafer carrier is exposed from the second surface of the plastic packaging body, the elastic structure is connected to the second surface of the wafer carrier.

5. The packaging structure according to claim 2, characterized in that: The area of ​​the second surface of the wafer stage exposed from the second surface of the plastic packaging body is 55% to 70% of the area of ​​the second surface of the plastic packaging body.

6. The packaging structure according to claim 2, characterized in that: The portion of the second surface of the wafer carrier exposed from the second surface of the plastic package body is covered by a protective layer.

7. The packaging structure according to claim 4, characterized in that: The thermally conductive insulating adhesive covers the elastic structure of the heat sink.

8. The packaging structure according to claim 1, characterized in that: The thickness of the thermally conductive insulating adhesive is 2 mm to 3 mm, and the height of the clamping structure exposed from the thermally conductive insulating adhesive is 2 mm to 3 mm.

9. The packaging structure according to claim 3, characterized in that: The clamping structure includes a first part, a second part and a connecting part, wherein the connecting part connects the first part with the second part, the connecting part is perpendicular to the first part and the second part, and the first part and the second part clamp the wafer stage from the first surface and the second surface of the wafer stage respectively.

10. The packaging structure according to claim 9, characterized in that: The clamping structure also includes a stress release end, which is located at a corner between the connecting portion and the second portion, and the stress release end extends in a direction away from the wafer carrier at the corner.

11. The packaging structure according to claim 1, characterized in that: The clamping structures include at least two, and the two clamping structures clamp the wafer stage from two sides of the wafer stage respectively.

12. The packaging structure according to claim 9, characterized in that: A side surface of the second portion of the clamping structure contacts the first surface of the heat dissipation substrate.

13. The packaging structure according to claim 4, characterized in that: The elastic structure includes a sleeve, an elastic member and a top block, one end of the sleeve is connected to the heat dissipation substrate, and the other end of the sleeve faces the wafer carrier. The elastic member is located in the sleeve and connects the sleeve and the top block. The top block can move in the sleeve. The top block at least partially extends out of the sleeve under the support of the elastic member, so that the top of the top block contacts the second surface of the wafer carrier or the second surface of the plastic package body.

14. The packaging structure according to claim 13, characterized in that: The elastic member is in a compressed state.

15. The packaging structure according to claim 4, characterized in that: The elastic structure includes a plurality of elastic structures, and the plurality of elastic structures are arranged in a uniform array.

16. The packaging structure according to claim 1, characterized in that: The wafer carrier comprises a copper-clad ceramic substrate or a lead frame.

Images