Circuit board forming equipment
By designing automated circuit board molding equipment, and using automated transmission between multiple feeding and forming devices, the problems of low production efficiency and high cost caused by manual intervention in the prior art are solved, and more efficient automated production is achieved.
Patent Information
- Application Number
- CN202421237055.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-31
- Publication Date
- 2025-03-14
- Estimated Expiration
- 2034-05-31
AI Technical Summary
There is a lot of manual intervention in existing circuit board molding operations, resulting in low production efficiency and high labor costs.
A circuit board forming device is designed, including a first feeding device and a first forming device. Through the second feeding device and the second forming device, the automatic transmission and processing of the sheet material is realized, and manual intervention is reduced.
By automating the feeding and forming process, labor costs are reduced, the automation level of circuit board processing is improved, and the continuous production capacity is improved.
Smart Images

Figure CN222621297U_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the technical field of circuit board processing, and specifically relates to a circuit board forming device. Background Art
[0002] With the rapid development of science and technology, printed circuit boards (PCBs) have been widely used around the world, the market size continues to expand, and the production and manufacturing of PCB boards shows a trend of rapidity, automation, intelligence, and unmanned development.
[0003] At present, most PCB board forming operations use manual loading and unloading and manual material sorting, which wastes a lot of labor costs and affects production efficiency. Summary of the invention
[0004] Purpose of the invention: The embodiment of the present application provides a circuit board forming device, which aims to overcome the technical problem that the current forming operation has a lot of manual intervention, which affects the production efficiency.
[0005] Technical solution: The circuit board forming device described in the embodiment of the present application includes:
[0006] A first feeding device and a first forming device, wherein the first feeding device is arranged at one side of the first forming device and is used to convey the sheet material to the first forming device, the first forming device is used to process the sheet material into a semi-finished product, and the first forming device is also used to convey the semi-finished product to the first feeding device;
[0007] A second feeding device and a second molding device, wherein the second feeding device is disposed at one side of the second molding device and is used to transfer the semi-finished product to the second molding device, and the second molding device is used to process the semi-finished product.
[0008] In some embodiments, the first feeding device comprises:
[0009] A first frame, disposed on one side of the first forming device;
[0010] The first conveying mechanism is arranged on the first frame, and is used for carrying the sheet material and conveying the sheet material to the first forming device. The first conveying mechanism is also used for receiving and carrying the semi-finished product.
[0011] In some embodiments, the first feeding device includes a plurality of the first conveying mechanisms, the plurality of the first conveying mechanisms are arranged along a height direction of the first frame, and each of the first conveying mechanisms can move along the height direction relative to the first frame.
[0012] In some embodiments, the first feeding device further comprises:
[0013] The first material bin includes a plurality of first feeding mechanisms, each of which is capable of carrying at least one sheet of material. The first material bin is used to move to one side of the first frame, and the first feeding mechanism is used to supply the sheet of material to the first conveying mechanism.
[0014] In some embodiments, the first forming device comprises:
[0015] First Pedestal;
[0016] A first workbench, disposed on the first base, the first workbench having a first processing area, the sheet material can be carried on the first workbench and located in the first processing area;
[0017] A first processing axis is arranged on the first base and located above the first workbench. The first processing axis can move relative to the first workbench and is used for processing the sheet material in the first processing area into the semi-finished product.
[0018] In some embodiments, the first forming device further comprises:
[0019] A first material moving mechanism, disposed on the first workbench, for moving the sheet material into the first processing area and transferring the semi-finished product to the first material feeding device;
[0020] A first guiding and positioning mechanism, disposed on the first workbench, for guiding the sheet material and positioning the sheet material within the first processing area;
[0021] The first clamping mechanism is arranged on the first workbench and is used for clamping and fixing the sheet material positioned in the first processing area on the first workbench.
[0022] In some embodiments, the first guide and positioning mechanism has a first guide groove, and the sheet material includes a positioning member, and the positioning member can be embedded in the first guide groove and can move along the first guide groove to guide the sheet material through the first guide groove;
[0023] The first guiding and positioning mechanism includes a first clamping portion, the first clamping portion is located in the first processing area, and the first clamping portion is used to clamp the positioning member to position the sheet material in the first processing area.
[0024] In some embodiments, the first workbench is provided with a first avoidance groove, the first clamping mechanism is penetrated through the first avoidance groove, and can move along the first avoidance groove to approach and move away from the sheet material positioned in the first processing area.
[0025] In some embodiments, the second feeding device comprises:
[0026] A second frame, disposed on one side of the second molding device;
[0027] A temporary storage mechanism, disposed on the second frame, the temporary storage mechanism is used to carry the semi-finished product and transfer the semi-finished product to the second forming device;
[0028] The second conveying mechanism is arranged on the second frame and is located on a side of the temporary storage mechanism away from the second forming device. The second conveying mechanism is used to carry the semi-finished product and convey the semi-finished product to the temporary storage mechanism.
[0029] In some embodiments, the second feeding device further comprises:
[0030] The second material bin includes a plurality of second feeding mechanisms, each of which is capable of carrying at least one piece of the semi-finished product. The second material bin is used to move to one side of the second frame, and the second feeding mechanism is used to supply the semi-finished product to the second conveying mechanism.
[0031] In some embodiments, the circuit board forming device further includes a transfer device, and the transfer device is used to transfer the semi-finished product to the second feeding device;
[0032] The transfer device comprises:
[0033] A mobile trolley, used for moving between the first feeding device and the second feeding device;
[0034] The third conveying mechanism is arranged on the moving trolley, and is used for receiving the semi-finished product on the first feeding device and conveying the semi-finished product to the second feeding device.
[0035] In some embodiments, the second molding device comprises:
[0036] Second Plinth;
[0037] A second workbench, disposed on the second base, the second workbench having a second processing area, the semi-finished product can be carried on the second workbench and located in the second processing area;
[0038] The second processing axis is arranged on the second base and located above the second workbench. The second processing axis can move relative to the second workbench and is used for processing the semi-finished product in the second processing area.
[0039] In some embodiments, the second molding device further comprises:
[0040] A second material moving mechanism, disposed on the second workbench, for moving the semi-finished product into the second processing area, and moving the processed semi-finished product out of the second processing area;
[0041] A second guiding and positioning mechanism, disposed on the second workbench, for guiding the semi-finished product and positioning the semi-finished product in the second processing area;
[0042] The second clamping mechanism is arranged on the second workbench and is used for clamping and fixing the semi-finished product positioned in the second processing area on the second workbench.
[0043] In some embodiments, the second guiding and positioning mechanism has a second guiding groove, and the positioning piece of the semi-finished product can be embedded in the second guiding groove and can move along the second guiding groove to guide the semi-finished product through the second guiding groove;
[0044] The second guiding and positioning mechanism includes a second clamping portion, the second clamping portion is located in the second processing area, and the second clamping portion is used to clamp the positioning member to position the semi-finished product in the second processing area.
[0045] In some embodiments, the second workbench is provided with a second avoidance groove, the second clamping mechanism is penetrated through the second avoidance groove, and can move along the second avoidance groove to approach and move away from the semi-finished product positioned in the second processing area.
[0046] In some embodiments, the circuit board forming equipment further includes:
[0047] A material unloading device, arranged at one side of the second forming device, for receiving the processed semi-finished product;
[0048] The sorting device is arranged on one side of the unloading device, and is used to sort out the circuit boards from the processed semi-finished products.
[0049] In some embodiments, the sheet material includes a backing plate and a multi-layer sheet material connected to the backing plate;
[0050] The first forming device is used to process the sheet material into a semi-finished product, so as to process each layer of the sheet material into a connected material frame and circuit board;
[0051] The second molding device is used for processing the semi-finished product to separate the circuit board from the material frame.
[0052] In some embodiments, in the semi-finished product, the material frame and the circuit board of each layer of the material sheet are connected by at least one connecting portion, and the second molding device removes the connecting portion to separate the circuit board from the material frame.
[0053] Beneficial effects: The circuit board forming equipment of the embodiment of the present application is provided with a first feeding device and a first forming device, which can convey the sheet material to the first forming device through the first feeding device, and process the sheet material into a semi-finished product through the first forming device. By setting a second feeding device and a second forming device, the semi-finished product can be conveyed to the second forming device via the second feeding device, so that the semi-finished product can be processed by the second forming device to form a finished circuit board. The circuit board forming equipment uses sheet materials and semi-finished products after the sheet materials are processed once as processing objects, and processes the processing objects twice respectively through the first forming device and the second forming device, and feeds respectively through the first feeding device and the second feeding device, which can reduce manual intervention and save labor costs. In addition, the automation level of circuit board processing is improved, which can reduce the standby time of each device, improve the utilization rate of the device, improve the continuity of production, maintain the production rhythm, reduce the production time cost, and increase output and production capacity. BRIEF DESCRIPTION OF THE DRAWINGS
[0054] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.
[0055] Figure 1 A schematic diagram of the structure of a circuit board forming device provided in an embodiment of the present application;
[0056] Figure 2 A schematic diagram of the exploded structure of a sheet material provided in an embodiment of the present application;
[0057] Figure 3 A schematic diagram of the structure of a semi-finished product provided in an embodiment of the present application;
[0058] Figure 4 for Figure 1 A schematic diagram of the local enlarged structure of the middle A area;
[0059] Figure 5 It is a schematic structural diagram of a first feeding device and a first forming device in the circuit board forming equipment of an embodiment of the present application;
[0060] Figure 6 It is a schematic diagram of the local structure of the first workbench in the first molding device of the embodiment of the present application;
[0061] Figure 7 for Figure 1 A schematic diagram of the local enlarged structure of the middle B area;
[0062] Figure 8 It is a schematic diagram of the structure of the second molding device, the unloading device and the sorting device in the circuit board molding equipment of the embodiment of the present application;
[0063] Fig. 9 is a flow chart of a circuit board forming method provided by some embodiments of the present application;
[0064] Fig.10 is a flow chart of a circuit board forming method provided by other embodiments of the present application;
[0065] Reference numerals: 100-first feeding device; 110-first frame; 120-first conveying mechanism; 130-first silo; 131-first feeding mechanism; 200-first molding device; 210-first base; 220-first workbench; 221-first processing area; 222-first avoidance groove; 230-first processing axis; 240-first material transfer mechanism; 250-first guide positioning mechanism; 251-first guide groove; 252-first clamping part; 260-first pressing mechanism; 300-transfer device; 310-mobile trolley; 320-third conveying mechanism; 400-second feeding device; 410-second frame; 420-temporary storage mechanism; 4 30-second conveying mechanism; 440-second material bin; 441-second feeding mechanism; 500-second molding device; 510-second base; 520-second workbench; 521-second processing area; 522-second avoidance groove; 530-second processing axis; 540-second material moving mechanism; 550-second guide positioning mechanism; 551-second guide groove; 552-second clamping part; 560-second clamping mechanism; 600-unloading device; 700-sorting device; 800-sheet material; 810-pad; 820-material plate; 821-material frame; 822-circuit board; 823-connecting part; 830-positioning piece; 850-semi-finished product; 900-tray. DETAILED DESCRIPTION
[0066] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.
[0067] In the description of the present application, it should be understood that the terms "upper", "lower", "top", "bottom", "inside", "outside", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In the description of the present application, "plurality" means two or more than two, and at least one means one, two or more than two, unless otherwise clearly and specifically defined.
[0068] The milling and forming of PCB boards is an important step in the PCB production process. In related technologies, the general operation process of milling and forming is: pre-processing of materials → punching pin holes on the bakelite board of the workbench, planting pins (for fixing and positioning PCB boards) → manual loading, placing pads (pads to prevent the milling cutter from milling the table), multi-layer PCB boards, positioning by pins - placing pads and PCB boards in sequence, and pressing to prevent warping - forming by the molding machine, the molding machine mills through the PCB boards in each area → manual unloading, manually picking up the finished boards in each area along each axis in sequence; manual material separation and unloading → picking up the finished boards of each axis and each area, taking out the milled outer frame and throwing it in the waste area, and taking out the pads (different pads need to be replaced for different material numbers). In summary, the current molding operation scheme is mainly: pre-processing of materials → manual loading → manual unloading → manual material separation, etc., which will waste a lot of time and labor costs. The collection, classification, transportation, loading and unloading of finished multi-layer boards, pads and waste boards are complicated and require much manual intervention. In addition, the machines need to be stopped and cannot be completed outside the machines. Large-scale production lines will require more standby time, which seriously restricts the utilization rate of the machines and affects the production capacity of molding. The loading and unloading methods of traditional molding machines are contrary to the development trend of rapid, automated and unmanned PCB manufacturing industry.
[0069] The embodiment of the present application provides a circuit board forming device to overcome the above-mentioned technical problems.
[0070] Please also refer to 1 to Figure 3 The embodiment of the present application provides a circuit board forming device, which is used for processing and manufacturing circuit boards. Specifically, the circuit board forming device includes: a first feeding device 100, a first forming device 200, a second feeding device 400 and a second forming device 500.
[0071] The first feeding device 100 is disposed on one side of the first molding device 200 and is used to transfer the sheet material 800 to the first molding device 200. Figure 2The sheet material 800 includes a pad 810 and a multi-layer sheet 820 connected to the pad 810. The pad 810 is located under the multi-layer sheet 820 as a protective plate to prevent the first molding device 200 from being damaged after penetrating the multi-layer sheet 820 during processing. The circuit board molding device directly uses the sheet material 800 as the processing object, which can reduce the process of manually placing the pad 810 and the multi-layer sheet 820 on the first molding device 200 and positioning the two by pins, thereby reducing labor costs and improving processing continuity.
[0072] The first molding device 200 is used to process the sheet material 800 into a semi-finished product 850, so as to process each layer of the sheet material 820 of the sheet material 800 into a connected material frame 821 and a circuit board 822. It should be noted that the semi-finished product 850 described in the embodiment of the present application is a material state in which the sheet material 800 still maintains the material frame 821 and the circuit board 822 connected after being processed by the first molding device 200. For details, please refer to Figure 3 The first molding device 200 can process the sheet material 800 placed thereon, and mill and mold the multi-layer sheet material 820 respectively to form at least one circuit board 822 on the sheet material 820, and the connecting portion 823 between the material frame 821 and the circuit board 822 is not completely milled off during the processing, so as to keep the material frame 821 and the circuit board 822 connected through the connecting portion 823, and maintain the integrity of the material, so as to facilitate the subsequent transfer process and secondary processing process.
[0073] The first molding device 200 is also used to transfer the semi-finished product 850 to the first feeding device 100 so as to facilitate the transfer of the semi-finished product 850 and maintain the production rhythm.
[0074] The second feeding device 400 is disposed at one side of the second molding device 500, and is used to receive the semi-finished product 850 and transfer it to the second molding device 500. The second molding device 500 is used to process the semi-finished product 850 to separate the circuit board 822 from the material frame 821.
[0075] Thus, the circuit board forming equipment uses the sheet material 800 and the semi-finished product 850 after the sheet material 800 is processed once as the processing object, processes the processing object twice respectively through the first forming device 200 and the second forming device 500, and feeds the materials respectively through the first feeding device 100 and the second feeding device 400, which can reduce manual intervention and save labor costs. In addition, the automation level of the circuit board 822 processing is improved, the standby time of each device is reduced, the utilization rate of the device is improved, the continuity of production is improved, the production time cost is reduced, and the output and production capacity are improved.
[0076] Please also read Figure 1 , Figure 4 and Figure 5In some embodiments, the first feeding device 100 includes a first frame 110 and a first conveying mechanism 120. The first frame 110 is disposed on one side of the first molding device 200. The first conveying mechanism 120 is disposed on the first frame 110. The first conveying mechanism 120 is used to carry the sheet material 800 and convey the sheet material 800 to the first molding device 200.
[0077] Among them, the first conveying mechanism 120 can adopt conveying forms such as conveyor belt, chain plate conveying, roller conveying, etc., combined with the drive of the driving motor, to realize the movement of the sheet material 800 carried thereon, and then realize the conveying of the sheet material 800. Specifically, the first conveying mechanism 120 can be aligned with the first workbench 220 of the first molding device 200 at a height to achieve docking, and then move the sheet material 800 located thereon so that the sheet material 800 can be moved to the first workbench 220 of the first molding device 200. After the first molding device 200 processes the sheet material 800 into a semi-finished product 850, the first molding device 200 moves the semi-finished product 850 so that it can be moved to the first conveying mechanism 120. At this time, the first conveying mechanism 120 is also used to receive and carry the semi-finished product 850. By setting the first conveying mechanism 120, the sheet material 800 and the semi-finished product 850 can be carried and both can be conveyed, thereby facilitating the implementation of automated production.
[0078] Optional, please refer again Figure 4 The first conveying mechanism 120 may also be provided with a guiding structure to guide the sheet material 800 or the semi-finished product 850 when conveying the sheet material 800 or receiving the semi-finished product 850, so that it can be accurately moved to the target position, thereby improving the accuracy of automated production.
[0079] See also Figure 5In some embodiments, the first feeding device 100 includes a plurality of first conveying mechanisms 120, which are arranged along the height direction of the first frame 110, and each first conveying mechanism 120 can move relative to the first frame 110 along the height direction. Specifically, the movement of the first conveying mechanism 120 can be achieved by setting a driving motor in combination with a gear rack, a ball screw, a linear guide, a crank slider and other structures. By setting a plurality of first conveying mechanisms 120, the sheet material 800 can be conveyed to the first molding device 200 in batches, and batch loading can be achieved. For example, two layers of first conveying mechanisms 120 can be set, and when the upper first conveying mechanism 120 conveys the sheet material 800 to the first molding device 200, the lower first conveying mechanism 120 receives the sheet material 800, and after the sheet material 800 conveyed by the upper layer is processed into a semi-finished product 850 and returned, the lower first conveying mechanism 120 moves upward and docks with the first molding device 200 to convey the next batch of sheet materials 800. Of course, three or more layers of the first conveying mechanism 120 can be set up as needed, so that loading, unloading and temporary storage do not affect each other, which is conducive to adjusting and maintaining a good production rhythm and improving production efficiency.
[0080] In some embodiments, the first feeding device 100 may include multiple layers of first conveying mechanisms 120, each layer of the first conveying mechanisms 120 includes multiple first conveying mechanisms 120, and the multiple first conveying mechanisms 120 on each layer move synchronously along the height direction to synchronize the upper and lower sheet materials 800, which is convenient for multiple sets of first forming devices 200 to process at the same time, thereby further improving production efficiency.
[0081] Please refer again Figure 5 In some embodiments, the first feeding device 100 further includes a first silo 130, which is used to receive the sheet material 800. The first silo 130 includes a plurality of first feeding mechanisms 131, each of which can carry at least one sheet material 800. The first silo 130 is used to move to one side of the first rack 110, and the first feeding mechanism 131 is used to feed the sheet material 800 to the first conveying mechanism 120. By providing the first silo 130, on the one hand, the sheet material 800 can be received for processing, and on the other hand, the sheet material 800 can be continuously supplied to the first conveying mechanism 120.
[0082] In particular, in some embodiments, the plurality of first feeding mechanisms 131 are arranged in multiple layers up and down. When multiple layers of first conveying mechanisms 120 are provided, the plurality of first feeding mechanisms 131 can supply the sheet material 800 to the first conveying mechanisms 120 of different layers respectively.
[0083] Optionally, the base of the first material bin 130 may be configured as an automated guided vehicle (AGV) to enable the first material bin 130 to move via the AGV.
[0084] In some embodiments, the first feeding device 100 may include a robotic arm, and the sheet material 800 may be fed to the first molding device 200 or the semi-finished product 850 may be removed from the first molding device 200 by means of grabbing by the robotic arm.
[0085] Please refer again Figure 5 In some embodiments, the first molding device 200 includes a first base 210, a first worktable 220, and a first processing axis 230. The first worktable 220 is disposed on the first base 210, and the first worktable 220 has a first processing area 221. The sheet material 800 can be carried on the first worktable 220 and located in the first processing area 221. The first processing axis 230 is disposed on the first base 210 and is located above the first worktable 220. The first processing axis 230 can move relative to the first worktable 220, and is used to process the sheet material 800 in the first processing area 221 into a semi-finished product 850. By controlling the first processing axis 230 to move relative to the first worktable 220, the relative position of the first processing axis 230 and the first worktable 220 can be changed, so that the sheet material 800 carried on the first worktable 220 and located in the first processing area 221 can be processed. Specifically, the first molding device 200 can be configured as a milling machine or a drilling machine, and the first worktable 220 and / or the first processing axis 230 can be moved to achieve relative displacement between the two, thereby achieving processing operations.
[0086] See also Figure 6 In some embodiments, the first molding device 200 further includes a first material moving mechanism 240 , a first guiding and positioning mechanism 250 , and a first pressing mechanism 260 .
[0087] The first material moving mechanism 240 is disposed on the first workbench 220, and is used to move the sheet material 800 to the first processing area 221, and to transfer the semi-finished product 850 to the first feeding device 100. Specifically, the first material moving mechanism 240 can be a conveying form such as a conveyor belt, a chain plate conveyor, a roller conveyor, etc., and can be driven by a driving motor to realize the material transfer. There is no need for manual material placement, which reduces labor costs, improves the level of automation, and improves processing efficiency.
[0088] The first guide positioning mechanism 250 is provided on the first workbench 220, and is used to guide the sheet material 800 and position the sheet material 800 in the first processing area 221. By providing the first guide positioning mechanism 250, the sheet material 800 can be accurately positioned in the first processing area 221, thereby ensuring the processing accuracy.
[0089] The first clamping mechanism 260 is disposed on the first workbench 220, and is used to clamp and fix the sheet material 800 located in the first processing area 221 on the first workbench 220. Thus, the sheet material 800 is prevented from shaking during processing, and the surface of the sheet material 800 is prevented from warping, thereby improving processing accuracy.
[0090] Please refer again Figure 6 The first guide positioning mechanism 250 has a first guide groove 251. The sheet material 800 includes a positioning member 830 connecting the backing plate 810 and the plurality of material plates 820. Specifically, the positioning member 830 can be set as a pin, which can be used for positioning on the one hand, and can connect the backing plate 810 and the plurality of material plates 820 together through the pin on the other hand. The positioning member 830 can be embedded in the first guide groove 251 and can move along the first guide groove 251 to guide the sheet material 800 through the first guide groove 251. When the first material moving mechanism 240 drives the sheet material 800 or the semi-finished product 850 to move, the positioning member 830 thereon can be embedded in the first guide groove 251 and move along the first guide groove 251, thereby achieving guidance.
[0091] The first guide positioning mechanism 250 includes a first clamping portion 252, the first clamping portion 252 is located in the first processing area 221, and the first clamping portion 252 is used to clamp the positioning member 830 to position the sheet material 800 in the first processing area 221. The first clamping portion 252 clamps the positioning member 830 to achieve accurate positioning of the sheet material 800. Specifically, the first clamping portion 252 can be set on the extension path of the first guide groove 251, so that when the first material moving mechanism 240 drives the sheet material 800 to move to the end position along the first guide groove 251, the positioning member 830 moves to the clamping area of the first clamping portion 252 accordingly, so as to be clamped and positioned by the first clamping portion 252.
[0092] Please refer again Figure 6 In some embodiments, the first workbench 220 is provided with a first avoidance groove 222, and the first clamping mechanism 260 is disposed in the first avoidance groove 222 and can move along the first avoidance groove 222 to approach and move away from the sheet material 800 positioned in the first processing area 221. When the sheet material 800 is positioned in the first processing area 221, the first clamping mechanism 260 can move along the first avoidance groove 222 and approach the sheet material 800, and clamp and fix the sheet material 800. After the sheet material 800 is processed into a semi-finished product 850, the first clamping mechanism 260 is lifted, moves along the first avoidance groove 222 and moves away from the semi-finished product 850 to release the semi-finished product 850.
[0093] Please refer again Figure 1In some embodiments, the second feeding device 400 includes a second frame 410, a temporary storage mechanism 420 and a second conveying mechanism 430. The second frame 410 is arranged on one side of the second molding device 500; the temporary storage mechanism 420 is arranged on the second frame 410, and the temporary storage mechanism 420 is used to carry the semi-finished product 850 and convey the semi-finished product 850 to the second molding device 500; the second conveying mechanism 430 is arranged on the second frame 410 and is located on the side of the temporary storage mechanism 420 away from the second molding device 500. The second conveying mechanism 430 is used to carry the semi-finished product 850 and convey the semi-finished product 850 to the temporary storage mechanism 420.
[0094] Among them, the temporary storage mechanism 420 and the second conveying mechanism 430 can both adopt conveying methods such as conveyor belts, chain conveyors, roller conveyors, etc., combined with the drive of a drive motor, to realize the movement of the semi-finished product 850.
[0095] By providing the temporary storage mechanism 420 and the second conveying mechanism 430 , the semi-finished products 850 can be supplied to the second molding device 500 in batches, thereby realizing batch processing, maintaining a good processing rhythm, and improving production efficiency.
[0096] In some embodiments, the second feeding device 400 further includes a second silo 440, which is used to accommodate the semi-finished product 850. The second silo 440 includes a plurality of second feeding mechanisms 441, each of which can carry at least one semi-finished product 850. The second silo 440 is used to move to one side of the second frame 410, and the second feeding mechanism 441 is used to supply the semi-finished product 850 to the second conveying mechanism 430. By setting up the second silo 440, on the one hand, the semi-finished product 850 can be accommodated for processing, and on the other hand, the semi-finished product 850 material can be continuously supplied to the second conveying mechanism 430 to ensure the continuity of automated production.
[0097] Please refer again Figure 1In some embodiments, the circuit board forming device further includes a transfer device 300, which is used to transfer the semi-finished product 850 on the first feeding device 100. The transfer device 300 can move to the first feeding device 100, receive the semi-finished product 850 from the first feeding device 100, and transfer the semi-finished product 850 to the second feeding device 400. The transfer device 300 includes a mobile trolley 310 and a third conveying mechanism 320. The mobile trolley 310 can be an AGV, which is used to move between the first feeding device 100 and the second feeding device 400. The third conveying mechanism 320 is arranged on the mobile trolley 310, and the third conveying mechanism 320 is used to receive the semi-finished product 850 on the first feeding device 100, and transfer the semi-finished product 850 to the second feeding device 400. By setting the transfer device 300, the material between the first feeding device 100 and the second feeding device 400 can be automatically transferred without manual transfer, thereby reducing labor costs and improving transfer efficiency.
[0098] Please also read Figure 1 , Figure 7 and Figure 8 In some embodiments, the second molding device 500 includes a second base 510, a second worktable 520, and a second processing axis 530. The second worktable 520 is disposed on the second base 510, and the second worktable 520 has a second processing area 521. The semi-finished product 850 can be carried on the second worktable 520 and located in the second processing area 521. The second processing axis 530 is disposed on the second base 510 and is located above the second worktable 520. The second processing axis 530 can move relative to the second worktable 520 to process the semi-finished product 850 in the second processing area 521 to separate the circuit board 822 from the material frame 821. By controlling the second processing axis 530 to move relative to the second worktable 520, the relative position of the second processing axis 530 and the second worktable 520 can be changed, so that the semi-finished product 850 carried on the second worktable 520 and located in the second processing area 521 can be processed. Specifically, the second molding device 500 can be configured as a milling machine or a drilling machine, and the second worktable 520 and / or the second processing axis 530 can be moved to achieve relative displacement between the two, thereby achieving processing operations.
[0099] See also Figure 7 In some embodiments, the second molding device 500 further includes a second material moving mechanism 540 , a second guiding and positioning mechanism 550 , and a second pressing mechanism 560 .
[0100] The second material moving mechanism 540 is disposed on the second workbench 520, and is used to move the semi-finished product 850 into the second processing area 521, and to move the processed semi-finished product 850 out of the second processing area 521. Specifically, the second material moving mechanism 540 can be a conveying form such as a conveyor belt, a chain plate conveyor, a roller conveyor, etc., and can be driven by a driving motor to realize the conveying of materials. There is no need for manual material placement, which reduces labor costs, improves the level of automation, and improves processing efficiency.
[0101] The second guide positioning mechanism 550 is provided on the second workbench 520, and is used to guide the semi-finished product 850 and position the semi-finished product 850 in the second processing area 521. By providing the second guide positioning mechanism 550, the semi-finished product 850 can be accurately positioned in the second processing area 521, thereby ensuring the processing accuracy.
[0102] The second clamping mechanism 560 is disposed on the second workbench 520, and is used to clamp and fix the semi-finished product 850 located in the second processing area 521 on the second workbench 520. Thus, the semi-finished product 850 is prevented from shaking during processing, and the surface of the semi-finished product 850 is prevented from warping, thereby improving the processing accuracy.
[0103] Please refer again Figure 7 In some embodiments, the second guide positioning mechanism 550 has a second guide groove 551, and the positioning member 830 of the semi-finished product 850 can be embedded in the second guide groove 551 and can move along the second guide groove 551 to guide the semi-finished product 850 through the second guide groove 551. When the second material moving mechanism 540 drives the semi-finished product 850 to move, the positioning member 830 thereon can be embedded in the second guide groove 551 and move along the second guide groove 551, thereby achieving guidance.
[0104] The second guide positioning mechanism 550 includes a second clamping portion 552, which is located in the second processing area 521. The second clamping portion 552 is used to clamp the positioning member 830 to position the semi-finished product 850 in the second processing area 521. The second clamping portion 552 clamps the positioning member 830 to achieve accurate positioning of the semi-finished product 850. Specifically, the second clamping portion 552 can be set on the extension path of the second guide groove 551, so that when the second material moving mechanism 540 drives the semi-finished product 850 to move to the end position along the second guide groove 551, the positioning member 830 moves to the clamping area of the second clamping portion 552 accordingly, so as to be clamped and positioned by the second clamping portion 552.
[0105] Please refer again Figure 7In some embodiments, the second workbench 520 is provided with a second avoidance groove 522, and the second clamping mechanism 560 is disposed in the second avoidance groove 522 and can move along the second avoidance groove 522 to approach and move away from the semi-finished product 850 located in the second processing area 521. When the semi-finished product 850 is located in the second processing area 521, the second clamping mechanism 560 can move along the second avoidance groove 522 and approach the semi-finished product 850, and clamp and fix the semi-finished product 850. After the semi-finished product 850 is processed, the second clamping mechanism 560 is lifted, moves along the second avoidance groove 522 and moves away from the semi-finished product 850 to release the semi-finished product 850.
[0106] In some embodiments, in the semi-finished product 850, the material frame 821 and the circuit board 822 of each layer of the material plate 820 are connected by at least one connecting portion 823, and the second molding device 500 removes the connecting portion 823 to separate the circuit board 822 from the material frame 821. The second processing axis 530 of the second molding device 500 can process the multiple connecting portions 823 around the circuit board 822 in sequence, until all the connecting portions 823 are milled off and the processing is completed. At this time, the finished circuit board 822 is separated from the material frame 821.
[0107] Please also read Figure 1 and Figure 8 In some embodiments, the circuit board forming device further includes a material unloading device 600 and a sorting device 700. The material unloading device 600 is disposed on one side of the second forming device 500 and is used to receive the processed semi-finished product 850. The sorting device 700 is disposed on one side of the material unloading device 600 and is used to sort out the circuit board 822 from the processed semi-finished product 850. The second forming device 500 processes the semi-finished product 850 to separate the circuit board 822 from the material frame 821. Then, the material can be unloaded through the material unloading device 600, and the processed semi-finished product 850 moves along the material unloading device 600 to the vicinity of the sorting device 700. The sorting device 700 on one side of the material unloading device 600 can sort out the finished circuit board 822 and the waste board (including the pad 810 and the material frame 821), and the finished circuit board 822 is placed on the tray 900 to realize the collection of the circuit board 822.
[0108] Specifically, the sorting device 700 may include a sorting platform and a sorting robot arm, and a spider arm robot may be selected to sort the finished circuit boards 822 .
[0109] The present application also provides a circuit board forming method, which is applicable to the circuit board forming device in the above embodiment. The circuit board forming method includes:
[0110] The first feeding device 100 transfers the sheet material 800 to the first forming device 200;
[0111] Processing the sheet material 800 into a semi-finished product 850 by the first forming device 200;
[0112] The first molding device 200 transfers the semi-finished product 850 to the first feeding device 100, and transfers the semi-finished product 850 on the first feeding device 100 through the transfer device 300;
[0113] The second feeding device 400 receives the semi-finished product 850 and transfers it to the second molding device 500;
[0114] The semi-finished product 850 is processed by the second molding device 500 .
[0115] The first molding device 200 and the second molding device 500 process the processing object twice, respectively, the first feeding device 100 and the second feeding device 400 feed the materials, and the transfer device 300 transfers the materials, which can reduce manual intervention and save labor costs. In addition, the automation level of the circuit board 822 processing is improved, the standby time of each device is reduced, the utilization rate of the device is improved, the continuity of production is improved, the production time cost is reduced, and the output and production capacity are increased.
[0116] Please also read Fig. 9 and Fig.10 As shown, it should be noted that the positioning piece 830 of the sheet 800 can be set as a positioning pin, the material with the connecting part 823 formed by the sheet 800 after one processing is the semi-finished product 850, the separated finished board is the semi-finished product 850 processed by the second molding device 500, the finished board is the circuit board 822, and the sheet waste is the pad 810 and the material frame 821.
[0117] In some embodiments, the first feeding device 100 transfers the sheet material 800 to the first forming device 200, including:
[0118] In the first feeding device 100 , the first material bin 130 is controlled to move to one side of the first frame 110 , and the first feeding mechanism 131 of the first material bin 130 supplies the sheet material 800 to the first conveying mechanism 120 ;
[0119] The first conveying mechanism 120 docks with the first material moving mechanism 240 of the first molding device 200 and conveys the sheet material 800 to the first material moving mechanism 240 .
[0120] In some embodiments, the sheet material 800 is processed into a semi-finished product 850 by the first forming device 200, including:
[0121] The first material moving mechanism 240 and the first guide positioning mechanism 250 move and position the sheet material 800 into the first processing area 221 of the first workbench 220; the sheet material 800 includes a backing plate 810 and a multi-layer sheet material 820 connected to the backing plate 810;
[0122] The first pressing mechanism 260 presses and fixes the sheet material 800 on the first workbench 220;
[0123] The sheet material 800 is processed by the first processing axis 230 , so that each layer of sheet material 820 forms a material frame 821 and a circuit board 822 , and the material frame 821 and the circuit board 822 are connected by at least one connecting portion.
[0124] In some embodiments, the second feeding device 400 receives the semi-finished product 850 and transfers it to the second molding device 500, including:
[0125] In the second feeding device 400 , the second material bin 440 is controlled to move to one side of the second frame 410 , and the second feeding mechanism 441 of the second material bin 440 supplies the semi-finished product 850 to the second conveying mechanism 430 ;
[0126] The second conveying mechanism 430 conveys the semi-finished products 850 to the temporary storage mechanism 420 and receives the next batch of semi-finished products 850 from the second feeding mechanism 441;
[0127] The temporary storage mechanism 420 transfers the semi-finished product 850 to the second molding device 500 .
[0128] In some embodiments, processing the semi-finished product 850 by the second molding device 500 includes:
[0129] The second material moving mechanism 540 and the second guiding and positioning mechanism 550 move and position the semi-finished product 850 into the second processing area 521 of the second workbench 520;
[0130] The second pressing mechanism 560 presses and fixes the semi-finished product 850 on the second workbench 520;
[0131] The semi-finished product 850 is processed by the second processing axis 530 to remove the connection portion connecting the circuit board 822 and the material frame 821 , so that the circuit board 822 is separated from the material frame 821 .
[0132] In some embodiments, the circuit board forming method further includes:
[0133] The semi-finished product 850 processed by the second molding device 500 is transferred to the unloading device 600;
[0134] The circuit boards 822 are sorted out from the semi-finished products 850 by the sorting device 700 .
[0135] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.
[0136] The circuit board forming equipment provided in the embodiments of the present application is introduced in detail above, and the principles and implementation methods of the present application are explained by using specific examples. The description of the above embodiments is only used to help understand the technical solution and core idea of the present application; ordinary technicians in this field should understand that: they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.
Claims
1. A circuit board forming device, characterized in that: include: A first feeding device and a first forming device, wherein the first feeding device is arranged at one side of the first forming device and is used to convey the sheet material to the first forming device, the first forming device is used to process the sheet material into a semi-finished product, and the first forming device is also used to convey the semi-finished product to the first feeding device; A second feeding device and a second molding device, wherein the second feeding device is disposed at one side of the second molding device and is used to transfer the semi-finished product to the second molding device, and the second molding device is used to process the semi-finished product.
2. The circuit board forming equipment according to claim 1, characterized in that: The first feeding device comprises: A first frame, disposed on one side of the first forming device; The first conveying mechanism is arranged on the first frame, and is used for carrying the sheet material and conveying the sheet material to the first forming device. The first conveying mechanism is also used for receiving and carrying the semi-finished product.
3. The circuit board forming equipment according to claim 2, characterized in that: The first feeding device includes a plurality of the first conveying mechanisms, the plurality of the first conveying mechanisms are arranged along a height direction of the first frame, and each of the first conveying mechanisms can move along the height direction relative to the first frame.
4. The circuit board forming equipment according to claim 2, characterized in that: The first feeding device also includes: The first material bin includes a plurality of first feeding mechanisms, each of which is capable of carrying at least one sheet of material. The first material bin is used to move to one side of the first frame, and the first feeding mechanism is used to supply the sheet of material to the first conveying mechanism.
5. The circuit board forming equipment according to claim 1, characterized in that: The first forming device comprises: First Pedestal; A first workbench, disposed on the first base, the first workbench having a first processing area, the sheet material can be carried on the first workbench and located in the first processing area; A first processing axis is arranged on the first base and located above the first workbench. The first processing axis can move relative to the first workbench and is used for processing the sheet material in the first processing area into the semi-finished product.
6. The circuit board forming equipment according to claim 5, characterized in that: The first forming device also includes: A first material moving mechanism, disposed on the first workbench, for moving the sheet material into the first processing area and transferring the semi-finished product to the first material feeding device; A first guiding and positioning mechanism, disposed on the first workbench, for guiding the sheet material and positioning the sheet material within the first processing area; The first clamping mechanism is arranged on the first workbench and is used for clamping and fixing the sheet material positioned in the first processing area on the first workbench.
7. The circuit board forming equipment according to claim 6, characterized in that: The first guide and positioning mechanism has a first guide groove, and the sheet material includes a positioning member, which can be embedded in the first guide groove and can move along the first guide groove to guide the sheet material through the first guide groove; The first guiding and positioning mechanism includes a first clamping portion, the first clamping portion is located in the first processing area, and the first clamping portion is used to clamp the positioning member to position the sheet material in the first processing area.
8. The circuit board forming equipment according to claim 6, characterized in that: The first workbench is provided with a first avoidance groove, the first clamping mechanism is penetrated through the first avoidance groove, and can move along the first avoidance groove to approach and move away from the sheet material positioned in the first processing area.
9. The circuit board forming equipment according to claim 1, characterized in that: The second feeding device comprises: A second frame, disposed on one side of the second molding device; A temporary storage mechanism, disposed on the second frame, the temporary storage mechanism is used to carry the semi-finished product and transfer the semi-finished product to the second forming device; The second conveying mechanism is arranged on the second frame and is located on a side of the temporary storage mechanism away from the second forming device. The second conveying mechanism is used to carry the semi-finished product and convey the semi-finished product to the temporary storage mechanism.
10. The circuit board forming equipment according to claim 9, characterized in that: The second feeding device also includes: The second material bin includes a plurality of second feeding mechanisms, each of which is capable of carrying at least one piece of the semi-finished product. The second material bin is used to move to one side of the second frame, and the second feeding mechanism is used to supply the semi-finished product to the second conveying mechanism.
11. The circuit board forming equipment according to claim 1, characterized in that: The circuit board forming equipment further comprises a transfer device, which is used to transfer the semi-finished product to the second feeding device; The transfer device comprises: A mobile trolley, used for moving between the first feeding device and the second feeding device; The third conveying mechanism is arranged on the moving trolley, and is used for receiving the semi-finished product on the first feeding device and conveying the semi-finished product to the second feeding device.
12. The circuit board forming equipment according to claim 1, characterized in that: The second molding device comprises: Second Plinth; A second workbench, disposed on the second base, the second workbench having a second processing area, the semi-finished product can be carried on the second workbench and located in the second processing area; The second processing axis is arranged on the second base and located above the second workbench. The second processing axis can move relative to the second workbench and is used for processing the semi-finished product in the second processing area.
13. The circuit board forming equipment according to claim 12, characterized in that: The second molding device also includes: A second material moving mechanism, disposed on the second workbench, for moving the semi-finished product into the second processing area, and moving the processed semi-finished product out of the second processing area; A second guiding and positioning mechanism, disposed on the second workbench, for guiding the semi-finished product and positioning the semi-finished product in the second processing area; The second clamping mechanism is arranged on the second workbench and is used for clamping and fixing the semi-finished product positioned in the second processing area on the second workbench.
14. The circuit board forming equipment according to claim 13, characterized in that: The second guiding and positioning mechanism has a second guiding groove, and the positioning piece of the semi-finished product can be embedded in the second guiding groove and can move along the second guiding groove to guide the semi-finished product through the second guiding groove; The second guiding and positioning mechanism includes a second clamping portion, the second clamping portion is located in the second processing area, and the second clamping portion is used to clamp the positioning member to position the semi-finished product in the second processing area.
15. The circuit board forming equipment according to claim 13, characterized in that: The second workbench is provided with a second avoidance groove, and the second clamping mechanism is penetrated through the second avoidance groove and can move along the second avoidance groove to approach and move away from the semi-finished product positioned in the second processing area.
16. The circuit board forming equipment according to claim 1, characterized in that: The circuit board forming equipment also includes: A material unloading device, arranged at one side of the second forming device, for receiving the processed semi-finished product; The sorting device is arranged on one side of the unloading device, and is used to sort out the circuit boards from the processed semi-finished products.
17. The circuit board forming equipment according to claim 1, characterized in that: The sheet material includes a backing plate and a multi-layer sheet connected to the backing plate; The first forming device is used to process the sheet material into a semi-finished product, so as to process each layer of the sheet material into a connected material frame and circuit board; The second molding device is used for processing the semi-finished product to separate the circuit board from the material frame.
18. The circuit board forming equipment according to claim 17, characterized in that: In the semi-finished product, the material frame and the circuit board of each layer of the material board are connected by at least one connecting portion, and the second molding device removes the connecting portion to separate the circuit board from the material frame.