Liquid cooling cabinet

Abstract

The utility model relates to the technical field of server cooling, in particular to a liquid cooling cabinet which comprises a cabinet body and a heat dissipation device, a containing cavity used for containing cooling liquid is formed in the cabinet body, the containing cavity is used for installing a server and enabling the server to be immersed in the cooling liquid, and the heat dissipation device is arranged outside the cabinet body. The heat dissipation device is used for accelerating heat dissipation of the outer side wall of the cabinet body. The liquid cooling cabinet can be suitable for a small data center or some edge computing power platforms, such as computing power platforms lower than 1.8 KW, a complex and huge power circulation system does not need to be adopted to circulate and dissipate heat of cooling liquid in the liquid cooling cabinet, the equipment investment cost is greatly reduced, and the working efficiency is improved. Compared with a common small-sized air-cooled cabinet, the cabinet of the utility model can accommodate more servers under the condition of the same volume, the heat dissipation performance of the cabinet of the utility model is good, and the energy consumption generated when the cabinet of the utility model is used for heat dissipation is low or almost no energy consumption is generated.

Description

Technical Field

[0001] The utility model belongs to the technical field of server cooling and specifically relates to a liquid cooling cabinet. Background Art

[0002] The traditional air-cooling heat dissipation method gradually reaches its ceiling when facing a cabinet with high power density. Therefore, liquid cooling technology has emerged as a new heat dissipation method. Liquid cooling technology uses the high thermal conductivity and high heat capacity of liquid to replace air as a heat dissipation medium, and exchanges heat with heat-generating components through liquid to take away heat, thereby achieving effective cooling of the server. The technical principles of liquid cooling cabinets mainly include liquid supply system, liquid circulation system, control system and monitoring system. The liquid supply system is responsible for providing cooling liquid, which is generally a mixture of deionized water and ethylene glycol. The liquid circulation system uses pumps, pipes and heat exchangers to bring the heat absorbed by the liquid from the server cabinet back to the cooling system for cooling. The control system and monitoring system are responsible for controlling parameters such as liquid temperature and flow, and real-time monitoring of the operating status of the liquid cooling system.

[0003] For liquid cooling cabinets in large data centers, the cooling objects of the liquid cooling cabinets can be dozens to dozens of servers, which inevitably requires a large power circulation system to pump the coolant in the liquid cooling cabinet out to fully dissipate the heat and then pump it back into the liquid cooling cabinet; furthermore, liquid cooling cabinets with power circulation can more effectively promote the circulation of cooling liquid due to their powerful power circulation system, thereby achieving a more efficient heat dissipation effect. However, the disadvantages of liquid cooling cabinets in large data centers are: due to the need to be equipped with a complex power circulation system and a large cooling capacity, the manufacturing cost and maintenance cost of liquid cooling cabinets with power circulation are relatively high; the operation of the power circulation system requires a certain amount of energy, which may increase the overall energy consumption and cost of the data center; therefore, the liquid cooling cabinet form of large data centers is not very suitable for cooling objects that can be less than ten liquid cooling cabinets.

[0004] For small cooling cabinets that accommodate less than ten servers, an air cooling system is generally used to cool the servers. Under the same cabinet volume, the number of servers accommodated will be less than that of a liquid cooling cabinet. This type of cabinet has poor heat dissipation performance and generates high energy consumption for heat dissipation. Utility Model Content

[0005] In view of the deficiencies in the prior art, the utility model provides a liquid-cooling cabinet, which includes a cabinet body and a heat dissipation device. A accommodating cavity for accommodating cooling liquid is provided in the cabinet body, and the accommodating cavity is used to install a server and immerse the server in the cooling liquid. The heat dissipation device is arranged outside the cabinet body, and is used to accelerate the heat dissipation of the outer wall of the cabinet body.

[0006] The utility model can be applied to small data centers or some edge computing platforms, such as computing platforms with a power lower than 1.8KW. There is no need to use a complex and large power circulation system to circulate and dissipate the coolant in the liquid-cooled cabinet, which greatly reduces the equipment investment cost. Compared with ordinary small air-cooled cabinets, the cabinet can accommodate more servers under the same volume. The cabinet of the utility model has good heat dissipation performance and the energy consumption generated by the cabinet of the utility model during heat dissipation is low or almost no energy consumption.

[0007] Preferably, a placement opening is provided on the top of the cabinet body, the placement opening is communicated with the accommodating cavity, the placement opening is used to install the server into the placement opening, a sealing cover is also provided on the cabinet body, the sealing cover is sealed on the placement opening, and a supporting part is provided at the bottom of the cabinet body, the supporting part is used to support the cabinet body.

[0008] Preferably, the heat dissipation device is a heat dissipation fan or a heat dissipation fin, and the heat dissipation fan or the heat dissipation fin is arranged on the outer side wall of the cabinet body.

[0009] Preferably, the heat dissipation device includes a cooling fan, an air deflector and cooling fins, the air deflector is arranged on the outer wall of the cabinet body, the upper and lower ends of the air deflector are respectively provided with an air outlet and an air inlet, the cooling fan is arranged at the air outlet, the cooling fins are connected to the outer wall of the cabinet body, and the cooling fins are arranged inside the air deflector.

[0010] Preferably, the liquid cooling cabinet further includes a temperature sensor and a controller, wherein the temperature sensor is disposed in the accommodating cavity, the controller is connected to the cooling fan signal, and the controller is connected to the cooling fan for controlling the opening and closing of the cooling fan.

[0011] Preferably, the inner side wall of the accommodating cavity is also provided with heat dissipation fins, and the heat dissipation fins of the inner side wall of the accommodating cavity are arranged corresponding to the heat dissipation device.

[0012] Preferably, a placement opening is provided at the top of the accommodating cavity, a server component is pluggably provided in the accommodating cavity, a support plate is provided at one end of the accommodating cavity close to the bottom wall, the support plate supports the server component, and the server component is spaced apart from the bottom wall of the accommodating cavity.

[0013] Preferably, the top of the server component is lower than the placement opening, and a liquid outlet hole and a liquid inlet hole are conveniently opened at the upper and lower ends of the server component, and the liquid inlet hole and the liquid outlet hole are respectively connected to the accommodating cavity and the inner cavity of the server component; the inner cavity of the server component is provided with electronic devices, and the heat dissipation device dissipates the heat of the cooling liquid in the accommodating cavity and then the cooling liquid enters the inner cavity of the server component through the liquid inlet hole.

[0014] Preferably, a server shell is arranged outside the server component, and a plurality of flow guide baffles are arranged at intervals inside the server shell, and the flow guide baffles extend to the top wall and the bottom wall of the server shell in the up-down direction, and the flow guide baffles divide the server shell into a plurality of fluid channels, and the liquid outlet and the liquid inlet are arranged on the top wall and the bottom wall of the server shell, and the liquid outlet and the liquid inlet are connected with the fluid channels; a central processing unit and / or a memory stick are arranged in a part of the fluid channels, and the opening rate of the fluid channel corresponding to the server shell is greater than the opening rate of other fluid channels corresponding to the server shell.

[0015] Preferably, a reflux channel is formed between the side wall of the server component and the side wall of the accommodating cavity, and a cooling fin is provided in the reflux channel corresponding to the heat dissipation device. The reflux channel is connected with the liquid outlet hole, and a circulation through hole is also provided on the support plate, and the circulation through hole is connected with the reflux channel. The circulation through hole returns the cooling liquid to the gap between the server component and the bottom wall of the accommodating cavity. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and other purposes, features and advantages of the present invention will become clearer through a more specific description of the preferred embodiments of the present invention shown in the accompanying drawings. The same reference numerals indicate the same parts in all the accompanying drawings, and the accompanying drawings are not deliberately scaled to the actual size, but the focus is on illustrating the main purpose of the present invention.

[0017] Figure 1 A schematic diagram of the structure of a liquid cooling cabinet provided in an embodiment;

[0018] Figure 2 for Figure 1 Sectional view;

[0019] Figure 3 This is a structural diagram of the liquid cooling cabinet from another perspective.

[0020] Figure symbols: cabinet body 100, accommodating cavity 101, placement opening 102, support plate 103, circulation through hole 104, support part 105, reflux channel 106, server component 110, server shell 111, liquid inlet hole 112, liquid outlet hole 113, central processing unit 114, memory bar 115, fluid channel 116, heat dissipation device 120, cooling fan 121, air guide cover 122, air outlet 123, air inlet 124, cooling fins 125. DETAILED DESCRIPTION

[0021] In order to facilitate the understanding of the present invention, a more comprehensive description of the present invention will be given below with reference to the relevant drawings.

[0022] It should be noted that when an element is considered to be "connected" to another element, it may be directly connected to another element and integrated therewith, or there may be an intermediate element at the same time. The terms "installed", "one end", "the other end" and similar expressions used herein are for illustrative purposes only.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art. The terms used in the specification herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0024] The utility model provides a liquid cooling cabinet, which includes a cabinet body 100 and a heat dissipation device 120. A receiving cavity 101 for receiving cooling liquid is arranged in the cabinet body 100, and the receiving cavity 101 is used to install a server and immerse the server in the cooling liquid. The heat dissipation device 120 is arranged outside the cabinet body 100, and is used to accelerate the heat dissipation of the outer wall of the cabinet body 100.

[0025] The utility model can be applied to small data centers or some edge computing platforms, such as computing platforms with a power lower than 1.8KW. There is no need to use a complex and large power circulation system to circulate and dissipate the coolant in the liquid-cooled cabinet, which greatly reduces the equipment investment cost. Compared with ordinary small air-cooled cabinets, the cabinet can accommodate more servers under the same volume. The cabinet of the utility model has good heat dissipation performance and the energy consumption generated by the cabinet of the utility model during heat dissipation is low or almost no energy consumption.

[0026] In a preferred embodiment, a placement opening 102 is provided on the top of the cabinet body 100, and the placement opening 102 is connected to the accommodating cavity 101. The placement opening 102 is used to install the server into the placement opening 102. A sealing cover is also provided on the cabinet body 100, and the sealing cover is sealed on the placement opening 102. A supporting portion 105 is provided at the bottom of the cabinet body 100, and the supporting portion 105 is used to support the cabinet body 100.

[0027] The placement opening 102 is provided to facilitate the installation and debugging of the server and the addition or replacement of the coolant. The sealing cover (not shown) is provided to prevent the coolant in the cabinet from volatilizing and being contaminated. The sealing cover adopts the existing technology and is not further limited here. The support part 105 is the outer bottom wall of the cabinet body 100, which is used to support the entire liquid cooling cabinet. In other embodiments, the support part 105 can adopt a universal wheel with a locking function, and the universal wheel is arranged on the outer bottom wall of the cabinet body 100. The placement opening 102 and the support part 105 are arranged up and down, so that the coolant is easily heated to form up and down convection.

[0028] In a preferred embodiment, the heat dissipation device 120 is a heat dissipation fan or a heat dissipation fin, and the heat dissipation fan or the heat dissipation fin is disposed on the outer side wall of the cabinet body 100 .

[0029] The heat dissipation device 120 is arranged on the outer wall of the cabinet body 100, so that the accommodating cavity 101 can remain sealed when the heat dissipation device 120 dissipates heat to prevent the coolant therein from volatilizing and being contaminated by external dust. The cooling fan can accelerate the flow of air around the liquid-cooled cabinet, thereby accelerating the heat dissipation of the liquid-cooled cabinet. At this time, the cooling fan cooperates with the internal coolant to dissipate heat to achieve lower power consumption; on the other hand, passive heat dissipation can also be adopted. The heat dissipation fins are arranged on the outer wall of the cabinet body 100, and the heat dissipation fins increase the overall heat dissipation area to increase the heat dissipation efficiency.

[0030] In a preferred embodiment, the heat dissipation device 120 includes a cooling fan, an air duct 122 and cooling fins. The air duct 122 is arranged on the outer wall of the cabinet body 100. The upper and lower ends of the air duct 122 are respectively provided with an air outlet and an air inlet. The cooling fan is arranged at the air outlet. The cooling fins are connected to the outer wall of the cabinet body 100, and the cooling fins are arranged inside the air duct 122.

[0031] The air guide 122 is set to make the cold air more concentrated when passing through the heat sink fins. When the heat sink fan is not turned on, the air outlet and air inlet design at the upper and lower ends of the air guide 122 are easy to form a chimney effect, thereby enhancing air convection. The heat sink fan, the air guide 122 and the heat sink fins cooperate to improve the heat dissipation efficiency.

[0032] In a preferred embodiment, the liquid cooling cabinet further includes a temperature sensor and a controller. The temperature sensor is disposed in the accommodating cavity 101. The controller is connected to the cooling fan signal. The controller is connected to the cooling fan to control the opening and closing of the cooling fan.

[0033] The temperature sensor is used to detect the temperature of the coolant in the accommodating cavity 101. When the temperature of the coolant is low, passive heat dissipation such as cooling fins can be used. If the temperature of the coolant rises further, the cooling fan is turned on to enhance air convection to reduce the temperature of the coolant. Of course, the controller can also control the speed of the cooling fan according to the temperature of the coolant detected by the temperature sensor.

[0034] In a preferred embodiment, the inner wall of the accommodating cavity 101 is also provided with heat dissipation fins, and the heat dissipation fins of the inner wall of the accommodating cavity 101 are provided corresponding to the heat dissipation device 120 .

[0035] The inner wall of the accommodating cavity 101 is also provided with heat dissipation fins, which can effectively conduct the heat of the accommodating cavity 101 to the corresponding heat dissipation device 120, accelerate the conduction of internal heat to the outside, and further improve the heat dissipation efficiency. The heat dissipation fins are generally made of aluminum.

[0036] In a preferred embodiment, a placement opening 102 is provided at the top of the accommodating cavity 101, a server component is pluggable and installed in the accommodating cavity 101, a support plate 103 is provided at one end of the accommodating cavity 101 near the bottom wall, the support plate 103 supports the server component, and the server component is spaced apart from the bottom wall of the accommodating cavity 101.

[0037] Figures 1 to 3 The embodiment shown is that four server components are installed in the housing cavity 101. The server components can be installed on the support plate 103 through the placement opening 102, which is convenient for installation and maintenance. The gap between the server components and the housing cavity 101 is used to reflux the cooling liquid, so that the cooling liquid that has been dissipated by the heat dissipation device 120 can re-enter the server.

[0038] In a preferred embodiment, the top of the server component is lower than the placement opening 102, and a liquid outlet hole 113 and a liquid inlet hole 112 are respectively provided at the upper and lower ends of the server component. The liquid inlet hole 112 is used to connect the bottom of the accommodating cavity 101 and the inner cavity of the server component, and the liquid outlet hole 113 is used to connect the top of the accommodating cavity 101 and the inner cavity of the server component; the inner cavity of the server component is provided with electronic devices, and the heat dissipation device 120 dissipates the heat of the cooling liquid in the accommodating cavity 101 and then enters the inner cavity of the server component through the liquid inlet hole 112.

[0039] When the electronic devices in the inner cavity of the server component are working, the temperature of the coolant increases, the density decreases and it flows upward, and enters the accommodating cavity 101 through the liquid outlet hole 113 at the upper end. After the heat dissipation device 120 dissipates the heat of the coolant in the accommodating cavity 101, the coolant enters the inner cavity of the server component through the liquid inlet hole 112. Through the above, heat convection heat dissipation can be fully utilized, and heat convection is accelerated through the external heat dissipation device 120 to improve the heat dissipation efficiency.

[0040] In a preferred embodiment, a server shell is provided outside the server assembly, and a plurality of guide baffles 116 are arranged at intervals inside the server shell. The guide baffles 116 extend to the top and bottom walls of the server shell in the up and down directions. The guide baffles 116 divide the server shell into a plurality of fluid channels. Liquid outlets 113 and liquid inlet holes 112 are arranged on the top and bottom walls of the server shell, and the liquid outlet holes 113 and liquid inlet holes 112 are connected to the fluid channels. A central processing unit 114 and / or a memory stick 115 are arranged in a part of the fluid channels, and the opening rate of the server shell corresponding to the fluid channel is greater than the opening rate of the server shell corresponding to other fluid channels.

[0041] Figure 2 and Figure 3What is shown is an embodiment of four fluid channels formed by dividing three flow guide baffles 116. Among them, the two middle fluid channels are both provided with a central processing unit 114 and a memory stick 115. The top wall and the bottom wall of the server shell on the two middle fluid channels are respectively provided with a liquid outlet 113 and a liquid inlet 112, and the opening rate is higher than that on the left and right outermost fluid channels, so that the two middle fluid channels can be allocated with more coolant flow. Different power electronic devices lead to different flow rates in the circulation channels, which improves the utilization of the cooling capacity of the coolant. Placing a high-power central processing unit 114 and a memory stick 115 in a fluid channel with a higher opening rate can further provide a heat dissipation effect.

[0042] In a preferred embodiment, a reflux channel 106 is formed between the side wall of the server component and the side wall of the accommodating cavity 101. A heat dissipation fin is provided in the reflux channel 106 at a position corresponding to the heat dissipation device 120. The reflux channel 106 is connected to the liquid outlet 113. A circulation through hole 104 is also provided on the support plate 103. The circulation through hole 104 is connected to the reflux channel 106. The circulation through hole 104 returns the cooling liquid to the gap between the server component and the bottom wall of the accommodating cavity 101.

[0043] When the server assembly is in use, the coolant immersed in the accommodating cavity 101 heats the coolant in the server shell as the electronic components in the server assembly work. Due to the different opening rates of the fluid channels, the flow speeds of the coolant in each fluid channel are different. The coolant flows upward due to the decrease in heating density and flows out of the accommodating cavity 101 through the liquid outlet 113. At this time, the coolant in the accommodating cavity 101 at the upper end can be cooled by natural heat dissipation or active heat dissipation and flow down. Of course, the coolant can also flow back to the reflux channel 106. The heat dissipation fins in the reflux channel 106 act as heat conductors and quickly conduct heat to the corresponding outer heat dissipation device 120. After being quickly cooled, the coolant enters the gap between the server assembly and the bottom wall of the accommodating cavity 101 through the circulation through hole 104, and finally enters the inner cavity of the server assembly through the liquid inlet hole 112.

[0044] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0045] In the description of this specification, the description with reference to the terms "preferred embodiment", "further embodiment", "other embodiments" or "specific example" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

[0046] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A liquid cooling cabinet, characterized in that: The liquid-cooling cabinet includes a cabinet body and a heat dissipation device. A containing cavity for containing cooling liquid is arranged in the cabinet body. The containing cavity is used to install the server and immerse the server in the cooling liquid. The heat dissipation device is arranged outside the cabinet body and is used to accelerate the heat dissipation of the outer wall of the cabinet body.

2. The liquid cooling cabinet according to claim 1, characterized in that: A placement opening is provided on the top of the cabinet body, and the placement opening is communicated with the accommodating cavity. The placement opening is used to install the server into the placement opening. A sealing cover is also provided on the cabinet body, and the sealing cover is sealed on the placement opening. A supporting part is provided at the bottom of the cabinet body, and the supporting part is used to support the cabinet body.

3. The liquid cooling cabinet according to claim 1, characterized in that: The heat dissipation device is a heat dissipation fan or a heat dissipation fin, and the heat dissipation fan or the heat dissipation fin is arranged on the outer side wall of the cabinet body.

4. The liquid cooling cabinet according to claim 1, characterized in that: The heat dissipation device includes a cooling fan, an air deflector and cooling fins. The air deflector is arranged on the outer side wall of the cabinet body. The upper end and the lower end of the air deflector are respectively provided with an air outlet and an air inlet. The cooling fan is arranged at the air outlet. The cooling fins are connected to the outer side wall of the cabinet body, and the cooling fins are arranged in the air deflector.

5. The liquid cooling cabinet according to claim 4, characterized in that: The liquid cooling cabinet also includes a temperature sensor and a controller. The temperature sensor is arranged in the accommodating cavity. The controller is connected to the cooling fan signal. The controller is connected to the cooling fan and is used to control the cooling fan to be turned on and off.

6. The liquid cooling cabinet according to claim 4, characterized in that: The inner side wall of the accommodating cavity is also provided with heat dissipation fins, and the heat dissipation fins of the inner side wall of the accommodating cavity are arranged corresponding to the heat dissipation device.

7. The liquid cooling cabinet according to claim 1, characterized in that: A placement opening is provided at the top of the accommodating cavity, a server component is pluggably provided in the accommodating cavity, a support plate is provided at one end of the accommodating cavity close to the bottom wall, the support plate supports the server component, and the server component is spaced apart from the bottom wall of the accommodating cavity.

8. The liquid cooling cabinet according to claim 7, characterized in that: The top of the server component is lower than the placement opening, and a liquid outlet hole and a liquid inlet hole are conveniently opened at the upper and lower ends of the server component, and the liquid inlet hole and the liquid outlet hole are respectively connected with the accommodating cavity and the inner cavity of the server component; the inner cavity of the server component is provided with electronic devices, and the heat dissipation device dissipates the cooling liquid in the accommodating cavity and then enters the inner cavity of the server component through the liquid inlet hole.

9. The liquid cooling cabinet according to claim 8, characterized in that: A server shell is arranged outside the server component, and a plurality of flow guide baffles are arranged at intervals inside the server shell, and the flow guide baffles extend to the top wall and the bottom wall of the server shell in the up-down direction, and the flow guide baffles divide the server shell into a plurality of fluid channels, and the liquid outlet and the liquid inlet are arranged on the top wall and the bottom wall of the server shell, and the liquid outlet and the liquid inlet are connected with the fluid channels; a central processing unit and / or a memory stick are arranged in a part of the fluid channels, and the opening rate of the fluid channel corresponding to the server shell is greater than the opening rate of other fluid channels corresponding to the server shell.

10. The liquid cooling cabinet according to claim 9, characterized in that: A reflux channel is formed between the side wall of the server component and the side wall of the accommodating cavity. A heat dissipation fin is arranged in the reflux channel corresponding to the heat dissipation device. The reflux channel is connected with the liquid outlet. A circulation through hole is also arranged on the support plate. The circulation through hole is connected with the reflux channel. The circulation through hole returns the cooling liquid to the gap between the server component and the bottom wall of the accommodating cavity.

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