Multilayer chip ceramic dielectric capacitor

Abstract

The utility model relates to the technical field of capacitors, and discloses a multilayer chip ceramic dielectric capacitor which comprises a capacitor body and pins, the lower end of the capacitor body is provided with a heat conduction bottom plate, and the heat conduction bottom plate is fixedly connected with the capacitor body; the second heat conduction fins are arranged at the lower end of the heat conduction bottom plate, and the second heat conduction fins are fixedly connected with the heat conduction bottom plate; the number of the supporting bottom columns is four, the four supporting bottom columns are arranged at the four corners of the lower end of the heat conduction bottom plate correspondingly, and the supporting bottom columns are fixedly connected with the heat conduction bottom plate. According to the utility model, the heat-conducting bottom plate is added at the bottom of the capacitor to cooperate with the heat-conducting fins, and the heat dissipation efficiency of the bottom of the capacitor is improved by combining the support of the support bottom columns.

Description

Technical Field

[0001] The utility model relates to the technical field of capacitors, in particular to a multi-layer chip type ceramic dielectric capacitor. Background Art

[0002] Multilayer ceramic capacitor (MLCC) is an electronic component, whose structure includes ceramic dielectric, metal inner electrode and metal outer electrode. This capacitor is made of ceramic dielectric diaphragms with printed electrodes (inner electrodes) stacked in a staggered manner, sintered at high temperature once to form a ceramic chip, and then sealed with a metal layer (outer electrode) at both ends of the chip to form a monolithic structure. MLCC has the characteristics of small size, large specific capacitance, long life, high reliability, and suitable for surface mounting.

[0003] During the use of multilayer ceramic capacitors, it is necessary to control their temperature to prevent them from reaching the upper limit of the maximum operating temperature. There is an area between the multilayer ceramic capacitors and the circuit board where air is difficult to flow, which leads to heat accumulation and causes the multilayer ceramic capacitors to dissipate heat slowly, affecting their working performance. For this reason, a multilayer ceramic capacitor is proposed. Utility Model Content

[0004] 1. Technical issues to be resolved

[0005] In view of the deficiencies of the prior art, the utility model provides a multilayer chip ceramic capacitor to solve the problems raised in the above background technology.

[0006] (II) Technical solution

[0007] To achieve the above purpose, the utility model provides the following technical solution: a multilayer chip ceramic capacitor, comprising:

[0008] A capacitor body and pins, wherein a heat-conducting bottom plate is provided at the lower end of the capacitor body, and the heat-conducting bottom plate is fixedly connected to the capacitor body;

[0009] The second heat-conducting fin is arranged at the lower end of the heat-conducting bottom plate, and the second heat-conducting fin is fixedly connected to the heat-conducting bottom plate;

[0010] There are four supporting bottom columns, which are respectively arranged at the four corners of the lower end of the heat-conducting bottom plate, and the supporting bottom columns are fixedly connected to the heat-conducting bottom plate.

[0011] Preferably, the pins are arranged on the left and right sides of the lower end of the capacitor body, and the pins are fixedly connected to the capacitor body.

[0012] Preferably, a heat-conducting top plate is provided on one side of the upper end of the capacitor body, and the heat-conducting top plate is fixedly connected to the capacitor body, and a plurality of equidistantly distributed first heat-conducting fins are provided on the upper end of the heat-conducting top plate, and the first heat-conducting fins are used to increase the contact area between heat and air.

[0013] Preferably, a plurality of first heat-conducting tubes evenly distributed in a rectangular array are arranged inside the first heat-conducting fins, and the first heat-conducting fins are fixedly connected to the first heat-conducting tubes, and the first heat-conducting tubes are fixedly connected to the heat-conducting top plate, and the first heat-conducting tubes are used to transfer the heat of the heat-conducting top plate to the first heat-conducting fins.

[0014] Preferably, a heat dissipation fan is arranged on the left side of the outside of the first heat-conducting fin, and the heat dissipation fan is fixedly connected to the heat-conducting top plate via a bracket, and the heat dissipation fan is used to dissipate heat from the first heat-conducting fin.

[0015] Preferably, second heat-conducting pipes are provided on both left and right sides of the exterior of the capacitor body, and upper and lower ends of the second heat-conducting pipes are fixedly connected to the heat-conducting top plate and the heat-conducting bottom plate, respectively.

[0016] (III) Beneficial effects

[0017] Compared with the prior art, the utility model provides a multilayer chip ceramic capacitor, which has the following beneficial effects:

[0018] 1. When the capacitor body is installed on the upper end of the circuit board, the utility model separates the capacitor body from the circuit board through the supporting bottom column. At the same time, the heat generated by the capacitor body is conducted to the second thermal fins through the thermal conductive bottom plate. The contact area between heat and air is increased through the second thermal conductive fins, thereby improving the heat dissipation efficiency of the bottom of the capacitor and solving the problems raised in the background technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is the overall structural front view of the utility model;

[0020] Figure 2 This is a cross-sectional view of the heat dissipation structure of the utility model;

[0021] Figure 3 It is a three-dimensional diagram of the overall bottom structure of the utility model.

[0022] In the figure: 1. capacitor body; 2. heat-conducting bottom plate; 3. heat-conducting top plate; 4. first heat-conducting fin; 5. first heat-conducting pipe; 6. cooling fan; 7. second heat-conducting pipe; 8. second heat-conducting fin; 9. pins; 10. supporting bottom column. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] The utility model provides a technical solution, a multilayer chip ceramic capacitor, please refer to Figure 1 , Figure 2 and Figure 3 ,include:

[0025] A capacitor body 1 and pins 9, a heat-conducting bottom plate 2 is provided at the lower end of the capacitor body 1, and the heat-conducting bottom plate 2 is fixedly connected to the capacitor body 1;

[0026] The second heat-conducting fin 8 is disposed at the lower end of the heat-conducting bottom plate 2, and the second heat-conducting fin 8 is fixedly connected to the heat-conducting bottom plate 2;

[0027] Four supporting bottom columns 10 are provided. The four supporting bottom columns 10 are respectively provided at the four corners of the lower end of the heat-conducting bottom plate 2 . The supporting bottom columns 10 are fixedly connected to the heat-conducting bottom plate 2 .

[0028] When in use, when the capacitor body 1 is mounted on the upper end of the circuit board, the capacitor body 1 is separated from the circuit board by the support base 10. At the same time, the heat generated by the capacitor body 1 is conducted to the second thermal fins 8 through the thermal base 2. The second thermal fins 8 increase the contact area between the heat and the air, thereby improving the heat dissipation efficiency at the bottom of the capacitor. It should be noted that in order to save space and highlight the innovative elements of this patent, this solution is based on the existing multi-layer ceramic capacitors and improves the related structures of non-multi-layer ceramic capacitors, such as the capacitor body 1, thermal fins, thermal pipes, pins 9 and other conventional equipment, which will not be repeated in this patent.

[0029] See also Figure 1 , Figure 2 and Figure 3 The pins 9 are arranged on the left and right sides of the lower end of the capacitor body 1 , and the pins 9 are fixedly connected to the capacitor body 1 .

[0030] See also Figure 1 , Figure 2 and Figure 3 A heat-conducting top plate 3 is arranged on one side of the upper end of the capacitor body 1, and the heat-conducting top plate 3 is fixedly connected to the capacitor body 1, and a plurality of equidistantly distributed first heat-conducting fins 4 are arranged on the upper end of the heat-conducting top plate 3, and the first heat-conducting fins 4 are used to increase the contact area between heat and air.

[0031] See also Figure 1 and Figure 2 A plurality of first heat-conducting tubes 5 evenly distributed in a rectangular array are arranged inside the first heat-conducting fins 4, and the first heat-conducting fins 4 are fixedly connected to the first heat-conducting tubes 5, and the first heat-conducting tubes 5 are fixedly connected to the heat-conducting top plate 3, and the first heat-conducting tubes 5 are used to transfer the heat of the heat-conducting top plate 3 to the first heat-conducting fins 4.

[0032] See also Figure 1 and Figure 3 A cooling fan 6 is arranged on the left side of the outside of the first heat-conducting fin 4 , and the cooling fan 6 is fixedly connected to the heat-conducting top plate 3 through a bracket, and the cooling fan 6 is used to dissipate heat for the first heat-conducting fin 4 .

[0033] See also Figure 1 , Figure 2 and Figure 3 Second heat-conducting pipes 7 are arranged on both left and right sides of the capacitor body 1, and upper and lower ends of the second heat-conducting pipes 7 are fixedly connected to the heat-conducting top plate 3 and the heat-conducting bottom plate 2 respectively.

[0034] In this solution, when the capacitor body 1 is installed on the upper end of the circuit board, the capacitor body 1 is separated from the circuit board by the supporting bottom column 10. At the same time, the heat generated by the capacitor body 1 is conducted to the second thermal fins 8 through the thermal bottom plate 2. The contact area between heat and air is increased by the second thermal fins 8, thereby improving the heat dissipation efficiency of the bottom of the capacitor. The heat of the capacitor body 1 is transferred to the first thermal fins 4 through the thermal top plate 3 and the first thermal pipe 5. The cooling fan 6 is started to generate airflow, and the airflow dissipates heat to the first thermal fins 4, thereby making the heat dissipation of the capacitor more efficient.

[0035] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0036] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A multilayer ceramic capacitor, characterized in that: include: A capacitor body (1) and pins (9), wherein a heat-conducting base plate (2) is provided at the lower end of the capacitor body (1), and the heat-conducting base plate (2) is fixedly connected to the capacitor body (1); A second heat-conducting fin (8) is arranged at the lower end of the heat-conducting base plate (2), and the second heat-conducting fin (8) is fixedly connected to the heat-conducting base plate (2); Four supporting bottom columns (10) are provided. The four supporting bottom columns (10) are respectively arranged at the four corners of the lower end of the heat-conducting bottom plate (2). The supporting bottom columns (10) are fixedly connected to the heat-conducting bottom plate (2).

2. The multilayer ceramic capacitor according to claim 1, characterized in that: The pins (9) are arranged on the left and right sides of the lower end of the capacitor body (1), and the pins (9) are fixedly connected to the capacitor body (1).

3. The multilayer ceramic capacitor according to claim 1, characterized in that: A heat-conducting top plate (3) is provided on one side of the upper end of the capacitor body (1), and the heat-conducting top plate (3) is fixedly connected to the capacitor body (1), and a plurality of first heat-conducting fins (4) distributed at equal intervals are provided on the upper end of the heat-conducting top plate (3).

4. The multilayer ceramic capacitor according to claim 3, characterized in that: A plurality of first heat-conducting tubes (5) evenly distributed in a rectangular array are arranged inside the first heat-conducting fins (4), the first heat-conducting fins (4) are fixedly connected to the first heat-conducting tubes (5), and the first heat-conducting tubes (5) are fixedly connected to the heat-conducting top plate (3).

5. The multilayer ceramic capacitor according to claim 4, characterized in that: A heat dissipation fan (6) is arranged on the left side of the outside of the first heat-conducting fin (4), and the heat dissipation fan (6) is fixedly connected to the heat-conducting top plate (3) via a bracket.

6. The multilayer ceramic capacitor according to claim 3, characterized in that: Second heat-conducting pipes (7) are provided on both left and right sides of the exterior of the capacitor body (1), and upper and lower ends of the second heat-conducting pipes (7) are respectively fixedly connected to the heat-conducting top plate (3) and the heat-conducting bottom plate (2).

Images