Air-cooled radiator and IGBT (insulated gate bipolar transistor) radiating assembly
By introducing a phase change radiator assembly into the IGBT unit radiator, the phase change coolant is used to quickly conduct heat, which solves the problem of low heat dissipation efficiency of traditional air-cooled radiators under high power density, and achieves a more efficient heat dissipation effect.
Patent Information
- Application Number
- CN202420914765.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-28
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2034-04-28
AI Technical Summary
Traditional air-cooled radiators have problems of local temperature saturation and low heat dissipation efficiency in heat dissipation of high power density IGBT units, and the method of increasing the heat dissipation area or spacing is limited.
A phase change radiator assembly is adopted, embedded on the substrate, and a phase change coolant is provided inside it. Through the design of the evaporation end and the condenser end, heat is transmitted from the IGBT unit to other areas of the substrate radiator assembly.
It effectively reduces the temperature gradient of the entire base radiator assembly, improves the heat dissipation efficiency of the IGBT unit, improves the power density, and achieves efficient air-cooled heat dissipation.
Smart Images
Figure CN222637284U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat dissipation of power electronic equipment, in particular to an air-cooled radiator and an IGBT heat dissipation component. Background Art
[0002] The continuous development of the power electronics industry has put forward higher requirements on the heat dissipation design of IGBT units, the core components of power units. The heat dissipation efficiency of IGBT units is directly related to the overall performance and power density of the product, which is particularly evident in the application of power electronics products and electric vehicle control units. With the growing pursuit of power density, the importance of IGBT unit heat dissipation design is self-evident.
[0003] In this context, traditional IGBT unit air-cooled heat sinks face some challenges, which are mainly manifested in the following aspects:
[0004] 1. Traditional air-cooled heat sinks improve heat dissipation by increasing the density of heat dissipation teeth and expanding the overall area of the heat sink. However, for high-power-density IGBT units, when the local heat capacity of the copper substrate chip reaches saturation, it is difficult to effectively reduce the local temperature simply by increasing the heat dissipation area.
[0005] 2. In order to reduce thermal coupling and lower the temperature, the traditional design method will try to increase the spacing between IGBT units. However, this method has limited effect on reducing the local temperature of the IGBT unit, and will also increase the product volume, thereby reducing the power density.
[0006] 3. Traditional air-cooled heat sinks mainly rely on the thermal conductivity of the material to transfer the heat generated by the IGBT unit to the heat sink fins and exchange heat through air convection. The heat dissipation performance of this method is limited by the thermal conductivity of the material itself. Once the local temperature of the IGBT unit reaches saturation, it is difficult to further reduce the temperature gradient.
[0007] Therefore, in order to adapt to the pursuit of high power density and high performance of power electronic products, it is particularly urgent to develop a new type of high-efficiency air-cooled radiator suitable for IGBT units. Utility Model Content
[0008] The technical problem to be solved by the utility model is to provide a high-efficiency air-cooled radiator and an IGBT heat dissipation component.
[0009] In order to solve the above technical problems, the technical solution provided by the utility model is:
[0010] An air-cooled radiator, comprising:
[0011] A base heat sink assembly, comprising a substrate for mounting a heat source;
[0012] At least one phase change heat sink assembly, embedded on the substrate, with a phase change coolant provided inside; the phase change heat sink assembly includes an evaporation end and a condensation end, and the evaporation end is disposed below the heat source.
[0013] Further, the outer surface of the phase change heat sink assembly is arranged flush with the outer surface of the base heat sink assembly.
[0014] Further, the phase change heat sink assembly further includes a turning section, which is disposed between the evaporation end and the condensation end, and the turning section is arranged such that both ends are respectively connected to the evaporation end and the condensation end, so that the evaporation end and the condensation end are not on the same straight line.
[0015] Further, the evaporation end and the condensation end are arranged parallel or perpendicular to each other.
[0016] Further, the phase change heat sink assembly includes a heat pipe and / or a vapor chamber.
[0017] Further, the phase change heat sink assembly includes a first sub-heat sink, a second sub-heat sink and a third sub-heat sink. The first sub-heat sink and the second sub-heat sink are arranged side by side on one half surface of the substrate, and the third sub-heat sink is arranged on the other half surface of the substrate.
[0018] Further, the base heat sink assembly includes a substrate and fins, and the fins are fixedly installed on the other side of the substrate away from the phase change heat sink assembly.
[0019] An IGBT heat dissipation assembly, comprising the above-mentioned air-cooled heat sink and an IGBT unit assembly, and the IGBT unit assembly is fixedly arranged on the phase change heat sink assembly.
[0020] Further, the IGBT unit assembly includes a first IGBT unit, a second IGBT unit and a third IGBT unit, and the first IGBT unit, the second IGBT unit and the third IGBT unit respectively correspond to the first sub-heat sink, the second sub-heat sink and the third sub-heat sink.
[0021] Further, the first IGBT unit, the second IGBT unit and the third IGBT unit are arranged in a "pin" shape.
[0022] Advantages of the present utility model:
[0023] The present application transfers the heat of the IGBT unit assembly to other low-heat areas of the base heat sink assembly through a phase change heat sink assembly, which not only reduces the temperature gradient of the entire base heat sink assembly, but also fully utilizes the base heat sink assembly to dissipate heat for the IGBT unit assembly, greatly improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Figure 1 This is a schematic diagram of the three-dimensional structure of an air-cooled radiator of the utility model in one embodiment;
[0025] Figure 2 This is a schematic diagram of the three-dimensional structure of an IGBT heat dissipation component of the utility model in one embodiment;
[0026] Figure 3 It is the temperature distribution diagram of the traditional radiator in the prior art;
[0027] Figure 4 This is a temperature distribution diagram of an IGBT heat dissipation component of the utility model in one embodiment.
[0028] Reference numerals include:
[0029] 10—air-cooled radiator 100—base radiator assembly 110—substrate
[0030] 120—Fin 200—Phase change heat sink assembly 210—First sub-heat sink
[0031] 220—Second sub-radiator 230—Third sub-radiator 240—Evaporation end
[0032] 250—condensation end 260—turning section 10—air-cooled radiator
[0033] 20—IGBT unit assembly 21—first IGBT unit 22—second IGBT unit
[0034] 23—Third IGBT unit DETAILED DESCRIPTION
[0035] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.
[0036] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.
[0037] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.
[0038] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0039] The core of traditional air-cooled radiators is to transfer the heat from the heat source to the radiator fins through metal materials, and then exchange heat with the air to dissipate the heat. Therefore, the heat dissipation performance mainly depends on the heat transfer capacity of the metal material of the air-cooled radiator. Usually, traditional air-cooled radiators are made of aluminum, and when their heat transfer capacity is saturated, they cannot quickly transfer more heat, so the heat dissipation capacity is limited.
[0040] Please refer to Figure 1 , is a preferred embodiment of the utility model, the air-cooled heat sink 10 comprises: a base heat sink assembly 100, comprising a substrate 110 for mounting a heat source; at least one phase-change heat sink assembly 200, embedded on the substrate 110, and having a phase-change coolant inside; the phase-change heat sink assembly 200 comprises an evaporation end 240 and a condensation end 250, and the evaporation end 240 is arranged below the heat source. The utility model adds the phase-change heat sink assembly 200 at the heat source. Since the phase-change heat sink assembly 200 contains the phase-change coolant inside, the heat can be quickly and specifically conducted from the heat source such as the IGBT unit to various parts of the base heat sink assembly 100. This scheme makes full use of the heat conduction principle of the phase-change heat sink assembly 200 and the rapid heat transfer properties of the phase-change medium, and quickly transfers the heat of the heat source to the outside of the heat source through the phase-change heat sink assembly 200. Its thermal conductivity exceeds that of any known metal, greatly improving the heat dissipation capacity of the traditional air-cooled heat sink. In one embodiment of the present application, the heat source is the IGBT unit assembly 20 . Of course, in other embodiments, the heat source may also be other structures that generate heat and need to be dissipated.
[0041] like Figure 1As shown, the air-cooled heat sink 10 mainly includes a base heat sink assembly 100 and a phase change heat sink assembly 200. The following is a further detailed introduction to each of the above components.
[0042] In one embodiment of the present application, the base heat sink assembly 100 includes a substrate 110 and fins 120. The substrate 110 is a metal plate with good thermal conductivity, such as an aluminum plate or a copper plate. A plurality of fins 120 are fixedly mounted on half of the surface of the substrate 110 so as to quickly transfer the heat on the substrate 110 to the air for air cooling and heat dissipation.
[0043] The other half of the substrate 110 (i.e., the other side away from the fins 120) is embedded with a phase change heat sink assembly 200, and the outer surface of the phase change heat sink assembly 200 is arranged to be flush with the outer surface of the base heat sink assembly 100. When the heat source is covered on the phase change heat sink assembly 200, it can be in close contact with the phase change heat sink assembly 200 and the substrate 110 at the same time.
[0044] In one embodiment of the present application, Figure 1 As shown, the phase change heat sink assembly 200 includes an evaporation end 240 and a condensation end 250. Figure 2 As shown, the evaporation end 240 is arranged below the heat source, and the condensation end 250 extends to a position away from the heat source. In one embodiment of the present application, the phase change heat sink assembly 200 is entirely a heat pipe. In another embodiment of the present application, the phase change heat sink assembly 200 is entirely a temperature equalizer. In other embodiments of the present application, part of the phase change heat sink assembly 200 is a heat pipe, and the rest is a temperature equalizer.
[0045] When the evaporation end 240 of the heat pipe or the temperature-averaging plate is heated, the phase-change coolant in the capillary tube vaporizes rapidly, and the vapor flows to the other end under the power of heat diffusion, and condenses at the condensation end 250 to release heat, and the liquid then flows back to the evaporation end 240 along the porous material by capillary action, and the cycle continues until the temperature of the evaporation end 240 and the condensation end 250 of the heat pipe or the temperature-averaging plate are equal (at this time, the steam heat diffusion stops). The above cycle is carried out quickly, and the heat of the heat source can be continuously conducted away by the heat pipe or the temperature-averaging plate, so that the heat in the heat source heat concentration area is quickly taken out, which improves the heat dissipation capacity of the entire radiator, thereby realizing a high heat dissipation efficiency air-cooled radiator 10.
[0046] like Figure 1As shown, in another embodiment of the present application, the phase change heat sink assembly 200 includes a first sub-heat sink 210, a second sub-heat sink 220 and a third sub-heat sink 230. The first sub-heat sink 210 and the second sub-heat sink 220 are arranged side by side on one half of the substrate 110, and the third sub-heat sink 230 is arranged on the other half of the substrate 110.
[0047] like Figure 1 As shown, in another embodiment of the present application, the phase change radiator assembly 200 further includes a turning section 260. The turning section 260 is disposed between the evaporation end 240 and the condensation end 250, and the turning section 260 is configured so that both ends are connected to the evaporation end 240 and the condensation end 250, respectively, so that the evaporation end 240 and the condensation end 250 are not on the same straight line. Specifically, the turning section 260 enables the evaporation end 240 and the condensation end 250 to be disposed parallel to each other, even if the first sub-radiator 210 and the second sub-radiator 220 are roughly in a "Z" shape as a whole. The turning section 260 can also enable the evaporation end 240 and the condensation end 250 to be disposed perpendicularly to each other, even if the third sub-radiator 230 is roughly in an "L" shape as a whole, so as to avoid other heat sources or evenly conduct heat to the substrate 110.
[0048] like Figure 2 As shown, the present application also discloses an IGBT heat dissipation assembly, specifically including the above-mentioned air-cooled heat sink 10 and an IGBT unit assembly 20. The IGBT unit assembly 20 is fixedly arranged on the phase change heat sink assembly 200. The IGBT unit assembly 20 includes a first IGBT unit 21, a second IGBT unit 22 and a third IGBT unit 23. The first IGBT unit 21, the second IGBT unit 22 and the third IGBT unit 23 can form a three-level power module. The first IGBT unit 21, the second IGBT unit 22 and the third IGBT unit 23 are arranged in a "pin" shape, corresponding to the first sub-heat sink 210, the second sub-heat sink 220 and the third sub-heat sink 230 respectively. The first IGBT unit 21, the second IGBT unit 22 and the third IGBT unit 23 are tightly combined together to achieve the best power density of the IGBT heat dissipation assembly.
[0049] When the three-level IGBT units adopt the traditional air-cooled heat sink solution, due to the relatively high loss of the IGBT unit, after the heat dissipation saturation balance, the heat of the IGBT unit is difficult to quickly conduct to the fins of the heat sink. Therefore, the local temperature of the heat sink surface corresponding to the IGBT unit is very high, and its overall heat dissipation efficiency is relatively low. Through simulation calculation, the surface temperature distribution of the traditional heat sink can be obtained as follows: Figure 3The highest temperature at the IGBT unit on the heat sink surface reaches 123°C, far exceeding the specification requirements, but the temperature at other locations on the heat sink is relatively low, only around 25°C. This means that after the heat sink is thermally balanced, it is difficult to conduct the heat from the IGBT unit, so the temperature gradient of the heat sink is large and the heat dissipation efficiency is relatively low.
[0050] The present application arranges a phase change heat sink assembly 200 under the IGBT unit assembly 20, and quickly conducts the heat generated by the IGBT unit assembly 20 through the phase change heat sink assembly 200, thereby reducing the local heat of the IGBT unit assembly 20. Figure 4 As shown, the surface temperature of the substrate 110 is evenly distributed within the range of 104-114° C., thereby improving the capacity of the IGBT unit assembly 20, and also improving the capacity of the entire IGBT unit assembly 20, and improving the power density, thereby achieving high heat dissipation efficiency of the heat sink.
[0051] The present application transfers the heat of the IGBT unit assembly 20 to other low-heat areas of the base heat sink assembly 100 through the phase change heat sink assembly 200, which not only reduces the temperature gradient of the entire base heat sink assembly 100, but also fully utilizes the base heat sink assembly 100 to dissipate heat for the IGBT unit assembly 20, greatly improving the heat dissipation efficiency.
[0052] The above contents are only preferred embodiments of the present invention. For ordinary technicians in this field, many changes can be made in the specific implementation methods and application scopes based on the ideas of the present invention. As long as these changes do not deviate from the concept of the present invention, they all belong to the protection scope of the present invention.
Claims
1. An air-cooled radiator, characterized in that: Comprising: A base radiator assembly (100), including a substrate (110) for mounting a heat source; At least one phase change radiator assembly (200), embedded on the substrate (110), with a phase change coolant provided inside; the phase change radiator assembly (200) includes an evaporation end (240) and a condensation end (250), and the evaporation end (240) is disposed below the heat source.
2. The air-cooled radiator according to claim 1, characterized in that: The outer surface of the phase change radiator assembly (200) is arranged flush with the outer surface of the base radiator assembly (100).
3. The air-cooled heat sink according to claim 1, characterized in that: The phase change radiator assembly (200) further includes a turning section (260), which is disposed between the evaporation end (240) and the condensation end (250), and the turning section (260) is arranged such that both ends are respectively connected to the evaporation end (240) and the condensation end (250), so that the evaporation end (240) and the condensation end (250) are not on the same straight line.
4. The air-cooled radiator according to claim 3, characterized in that: The evaporation end (240) and the condensation end (250) are arranged parallel or perpendicular to each other.
5. The air-cooled heat sink according to claim 4, characterized in that: The phase change radiator assembly (200) includes a heat pipe and / or a vapor chamber.
6. The air-cooled radiator according to any one of claims 1 to 5, characterized in that: The phase change radiator assembly (200) includes a first sub-radiator (210), a second sub-radiator (220), and a third sub-radiator (230). The first sub-radiator (210) and the second sub-radiator (220) are arranged side by side on one half-plane of the substrate (110), and the third sub-radiator (230) is arranged on the other half-plane of the substrate (110).
7. The air-cooled heat sink according to claim 6, characterized in that: The base radiator assembly (100) includes a substrate (110) and fins (120), and the fins (120) are fixedly installed on the other side of the substrate (110) away from the phase change radiator assembly (200).
8. An IGBT heat dissipation component, characterized in that: Including the air-cooled radiator (10) and the IGBT unit assembly (20) according to claim 6 or 7, and the IGBT unit assembly (20) is fixedly arranged on the phase change radiator assembly (200).
9. The IGBT heat dissipation assembly according to claim 8, characterized in that: The IGBT unit assembly (20) includes a first IGBT unit (21), a second IGBT unit (22), and a third IGBT unit (23), and the first IGBT unit (21), the second IGBT unit (22), and the third IGBT unit (23) respectively correspond to the first sub-radiator (210), the second sub-radiator (220), and the third sub-radiator (230).
10. The IGBT heat dissipation assembly according to claim 9, characterized in that: The first IGBT unit (21), the second IGBT unit (22), and the third IGBT unit (23) are arranged in a "pin" shape.