Semiconductor polishing solution cooling device

Abstract

The utility model discloses a semiconductor polishing liquid cooling device which comprises a liquid supply barrel body, the barrel wall of the barrel body is of a double-layer structure composed of an inner wall and an outer wall, a liquid storage cavity opposite to the inner side and a circulating cooling cavity opposite to the outer side are formed, and an expansion unit is additionally arranged in the liquid storage cavity. The expansion unit comprises a supporting rod movably connected to the bottom of the barrel body, an annular pipe is arranged at the top of the supporting rod and supported on the supporting rod through a connecting rod, the bottom of the annular rod is circumferentially communicated with a plurality of expansion sleeves drooping downwards, and the bottoms of the expansion sleeves are connected with or close to the bottom of the liquid storage cavity. The mode that the expansion unit is additionally arranged in the liquid storage cavity is adopted, the real-time cold contact area of the polishing liquid is changed by flexibly adjusting the wall attaching height of the polishing liquid in the circumferential direction of the barrel, the polishing liquid can be attached to the circumferential inner wall of the barrel as large as possible no matter how large the capacity of the polishing liquid in the barrel is, and cooling of the polishing liquid is fully achieved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor material polishing technology, specifically a semiconductor polishing slurry cooling device. Background Technology

[0002] During the polishing process, the friction between the workpiece and the polishing pad, as well as the micro-cutting action of the abrasive grains in the polishing slurry, generate a significant amount of heat, causing the polishing slurry temperature to rise. Therefore, if the polishing slurry is not cooled during its circulation, the chemical action in the chemical-mechanical polishing process will be accelerated, leading to an imbalance between chemical and mechanical removal, which will affect the surface finish. Existing polishing slurry cooling tanks have unsatisfactory cooling effects, resulting in reduced cooling efficiency. In particular, during the circulation of the polishing slurry, the slurry level in the cooling tank drops, preventing the relatively upper inner wall of the cooling tank from contacting the polishing slurry, resulting in insufficient cooling.

[0003] This case arose in order to resolve the aforementioned issues. Utility Model Content

[0004] (a) Technical problems to be solved

[0005] To address the shortcomings of existing technologies, this invention provides a semiconductor polishing slurry cooling device, which solves the problems mentioned in the background section.

[0006] (II) Technical Solution

[0007] To achieve the above objectives, this utility model provides the following technical solution: a semiconductor polishing slurry cooling device, comprising a liquid supply tank. The tank wall is a double-layer structure consisting of an inner wall and an outer wall, forming a liquid storage chamber on the inner side and a circulating cooling chamber on the outer side. An expansion unit is added to the liquid storage chamber. The expansion unit includes a support rod movably connected to the bottom of the tank. An annular tube is provided at the top of the support rod. The annular tube is supported on the support rod by a connecting rod. Multiple downward-hanging expansion sleeves are circumferentially connected to the bottom of the annular tube. The bottom of the expansion sleeves is in contact with or close to the bottom of the liquid storage chamber. By changing the volume of the expansion sleeves immersed in the polishing slurry in the liquid storage chamber, the liquid level of the polishing slurry adhering to the inner wall of the circulating cooling chamber is changed.

[0008] Preferably, the support rod is movably connected to the bottom of the barrel by means of a plug-in or threaded connection.

[0009] Preferably, the top of the annular tube is connected to an external output unit via a long tube, wherein the output unit is an air pump, and the annular tube uses air intake to drive the expansion sleeve below to expand.

[0010] Preferably, the top of the annular pipe is connected to an external output unit via a long pipe, wherein the output unit is a water pump, so that the annular pipe expands by taking in water.

[0011] Preferably, the expansion sleeve consists of multiple cavities that change size axially in an alternating manner, i.e., a cycle of large and small or small and large sizes, while circumferentially adjacent cavities also have a size misalignment at the same height.

[0012] (III) Beneficial Effects

[0013] After adopting the above technical solution, the present invention has the following advantages compared with the prior art: The present invention provides a semiconductor polishing slurry cooling device by adding an expansion unit in the liquid storage chamber. By flexibly adjusting the height of the polishing slurry adhering to the wall in the circumferential direction of the tank, the real-time cold contact area can be changed, so that no matter how much polishing slurry is in the tank, it can adhere to the inner circumferential wall of the tank as much as possible, so as to fully realize the cooling of the polishing slurry. Attached Figure Description

[0014] Figure 1 This is a partial cross-sectional schematic diagram of the present invention;

[0015] Figure 2 This is a schematic diagram of the expansion unit in this utility model;

[0016] Figure 3 This is a schematic diagram of the improved expansion unit in this utility model.

[0017] In the diagram: 1. Barrel body; 2. Liquid storage chamber; 3. Circulating cooling chamber; 4. Water inlet pipe connector; 5. Water outlet pipe connector; 6. Liquid inlet hole; 7. Long pipe; 8. Support rod; 9. Connecting rod; 10. Annular pipe; 11. Expansion sleeve; 12. Cavity. Detailed Implementation

[0018] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments.

[0019] like Figure 1 As shown: A semiconductor polishing slurry cooling device includes a slurry tank 1. The tank 1 has a double-layer structure consisting of an inner wall and an outer wall, forming a liquid storage chamber 2 on the inner side and a circulating cooling chamber 3 on the outer side. The tank 1 has an inlet hole 6 above the liquid storage chamber 2, which is connected to a polishing slurry pipe connector. One or more outlet holes are provided in the circulating cooling chamber 3.

[0020] The lower side of the outer wall of the circulating cooling chamber 3 is provided with a water inlet pipe connector 4 and a water outlet pipe connector 5. The water inlet pipe connector 4 is connected to the liquid outlet of the external water pump through a pipe, the liquid inlet of the water pump is connected to the water outlet of the water cooling box through a pipe, and the water outlet pipe connector 5 is connected to the water inlet of the water cooling box through a pipe.

[0021] Because the polishing fluid temperature rises, it needs to be cooled during the circulation of the polishing fluid. That is, as the polishing fluid flows out of the storage chamber 2, it adheres to the inner wall of the circulating cooling chamber 3 to exchange heat with the cooling water in the circulating cooling chamber 3.

[0022] However, during use, the polishing fluid level in the storage chamber 2 drops. Therefore, this solution changes the real-time cold contact area by flexibly adjusting the contact height between the polishing fluid and the inner wall of the circulating cooling chamber 3, so that regardless of the amount of polishing fluid in the tank, it can fit the circumferential inner wall of the tank as much as possible.

[0023] Specifically, an expansion unit is added to the storage chamber 2. By flexibly changing the volume of polishing liquid submerged in the storage chamber 2, the liquid level of the polishing liquid can be altered. See appendix. Figure 2 As shown, the expansion unit includes a support rod 8 that is movably connected (such as by plug-in or threaded connection) to the bottom of the barrel 1. The top of the support rod 8 is provided with an annular tube 10. The annular tube 10 is supported on the support rod 8 by a connecting rod 9. The bottom of the annular tube is circumferentially connected to a plurality of downwardly hanging expansion sleeves 11. The bottom of the expansion sleeves 11 is connected to or close to the bottom of the liquid storage chamber 2.

[0024] In use, the expansion sleeve 11 resembles a long balloon, expanding radially from the bottom upwards along the axial direction. The expansion sleeve 11 can be made of a material such as silicone, which has low hardness and high temperature resistance.

[0025] The top of the annular pipe 10 is connected to an external output unit via a long pipe 7. The output unit can be an air pump, in which air is introduced into the annular pipe 10 to inflate the expansion sleeve 11 below. Alternatively, the output unit can be a water pump, in which water is introduced into the annular pipe 10 to inflate the expansion sleeve 11 below.

[0026] Considering that the interval between two adjacent expansion sleeves 11 is equal, making it easy for the expansion sleeves 11 to come into contact with each other after expansion, further improvements are made, as detailed below.

[0027] See appendix Figure 3 As shown, the expansion sleeve 11 is replaced with multiple cavities 12 whose size changes axially in an alternating manner, i.e., in a cycle of large and small or small and large sizes. At the same time, the circumferentially adjacent cavities 12 also have a size misalignment difference at the same height (refer to the solid cavity 12 at the position of the dotted line), so that two adjacent cavities 12 have multiple storage spaces after expansion.

[0028] The above-described embodiments are provided for illustrative purposes. Based on the above description, those skilled in the art can make various changes and modifications without departing from the inventive concept. The technical scope of this utility model is not limited to the contents of the specification; its protection scope must be determined according to the claims.

Claims

1. A semiconductor polishing slurry cooling device, comprising a tank for supplying the slurry, wherein the tank wall is a double-layer structure consisting of an inner wall and an outer wall, forming a liquid storage chamber on the inner side and a circulating cooling chamber on the outer side, characterized in that: The expansion unit is additionally arranged in the liquid storage cavity, the expansion unit comprises a supporting rod movably connected to the bottom of the barrel, the top of the supporting rod is provided with an annular pipe, the annular pipe is supported on the supporting rod through a connecting rod, and the bottom of the annular pipe is circumferentially communicated with a plurality of downwardly hanging expansion sleeves, the bottom of the expansion sleeve is connected to or adjacent to the bottom of the liquid storage cavity, the volume of the expansion sleeve immersed in the polishing liquid in the liquid storage cavity is changed, so that the liquid level of the polishing liquid adhering to the inner wall of the circulating cooling cavity is changed.

2. The semiconductor polishing fluid cooling device according to claim 1, wherein: The supporting rod is movably connected to the bottom of the barrel in a plug-in or threaded connection mode.

3. The semiconductor polishing fluid cooling device of claim 1, wherein: The top of the annular pipe is connected to an external output unit through a long pipe, the output unit is a gas pump, and the annular pipe drives the expansion of the expansion sleeve below in a gas inlet mode.

4. The semiconductor polishing fluid cooling device of claim 1, wherein: The top of the annular pipe is connected to an external output unit through a long pipe, the output unit is a water pump, and the annular pipe drives the expansion of the expansion sleeve below in a water inlet mode.

5. The semiconductor polishing fluid cooling device of claim 1, wherein: The expansion sleeve is a plurality of cavities with axially staggered size changes, that is, the size is cyclically changed in a large-small or small-large mode, and the size of the cavities adjacent in the circumferential direction also has a size offset difference at the same height.

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