This utility model relates to a drive mechanism for a ejector pin in an
etching equipment, comprising an electrostatic chuck, a lifting
assembly, a connecting
assembly, a lifting ring, a linear guide rail, and a motor. The upper end of the electrostatic chuck is used to connect to the substrate, and the lower end of the electrostatic chuck is provided with the lifting
assembly, which is mounted on the lifting ring. Multiple sets of lifting assemblies are provided, each set including an ejector pin. The ejector pin is movably inserted into the electrostatic chuck and the substrate. Connecting assemblies are symmetrically arranged on both sides of the lifting ring, one of which is connected to the output end of the motor, and the other is slidably mounted on the linear guide rail. By employing multiple sets of lifting assemblies, each including an ejector pin, and through the cooperation of the connecting assembly with the motor and linear guide rail, smooth lifting and lowering of the ejector pin is achieved, effectively preventing
wafer tilting and improving the stability and reliability of
wafer removal, especially suitable for lifting and lowering large-sized wafers.