Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Device for supplying processing fluid and device for processing substrate having the same

A technology for processing fluids and processing substrates, which is used in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., and can solve problems such as drooping of processing fluid knives to achieve uniform supply and prevent damage.

Active Publication Date: 2009-05-27
SEMES CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as the length of the treatment fluid knife increases, sagging of the treatment fluid knife may occur

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Device for supplying processing fluid and device for processing substrate having the same
  • Device for supplying processing fluid and device for processing substrate having the same
  • Device for supplying processing fluid and device for processing substrate having the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0042] The present invention will be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown. This invention may, however, be embodied in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity.

[0043] It will be understood that when an element or layer is referred to as being "on" or "connected to" another element or layer, the element or layer can be directly on or directly connected to the other element or layer. Another element or layer may be connected or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on" or "dir...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

In an apparatus for supplying processing fluid and apparatus for processing substrate including the same, a fluid processing cutter extending in direction parallel to the surface of the substrate, and a seaming nozzle is provided for processing the fluid. A rod extends through the cutter in extending direction of the cutter, and a tension is applied to the rod in the extending direction of the cutter to prevent descent of the cutter. Therefore, damage to the substrate caused by descent of the cutter can be reduced or prevented, and the processing fluid can be further evenly applied onto the substrate.

Description

technical field [0001] Exemplary embodiments generally relate to an apparatus for supplying a processing fluid and an apparatus for processing a substrate having the apparatus. In more detail, exemplary embodiments relate to an apparatus for supplying a processing fluid onto a flat plate type substrate such as a glass substrate and an apparatus for processing a substrate having the same. Background technique [0002] In the manufacture of a flat panel display device such as a liquid crystal display device, a flat panel type substrate such as a glass substrate may generally be used, and various processes may be performed to form a circuit pattern on the glass substrate. For example, deposition processing for forming a layer on a glass substrate, etching processing for forming a desired pattern from the layer, cleaning processing for removing impurities from the glass substrate, drying the glass substrate drying treatment, etc. [0003] The substrate processing apparatus may...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00
CPCH01L21/67034H01L21/67051H01L21/6708
Inventor 李正洙朴奇洪
Owner SEMES CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com