Device for supplying processing fluid and device for processing substrate having the same

A technology for processing fluids and substrates, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc. It can solve the problem of fluid knife drooping and achieve uniform supply and prevent damage

Active Publication Date: 2010-09-22
SEMES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as the length of the treatment fluid knife increases, sagging of the treatment fluid knife may occur

Method used

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  • Device for supplying processing fluid and device for processing substrate having the same
  • Device for supplying processing fluid and device for processing substrate having the same
  • Device for supplying processing fluid and device for processing substrate having the same

Examples

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Embodiment Construction

[0043] The present invention will be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown. This invention may, however, be embodied in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity.

[0044] It will be understood that when an element or layer is referred to as being "on" or "connected to" another element or layer, the element or layer can be directly on or directly connected to the other element or layer. Another element or layer may be connected or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on" or "dir...

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PUM

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Abstract

In an apparatus for supplying processing fluid and apparatus for processing substrate including the same, a fluid processing cutter extending in direction parallel to the surface of the substrate, and a seaming nozzle is provided for processing the fluid. A rod extends through the cutter in extending direction of the cutter, and a tension is applied to the rod in the extending direction of the cutter to prevent descent of the cutter. Therefore, damage to the substrate caused by descent of the cutter can be reduced or prevented, and the processing fluid can be further evenly applied onto the substrate.

Description

technical field [0001] Exemplary embodiments generally relate to an apparatus for supplying a processing fluid and an apparatus for processing a substrate having the apparatus. In more detail, exemplary embodiments relate to an apparatus for supplying a processing fluid onto a flat plate type substrate such as a glass substrate and an apparatus for processing a substrate having the same. Background technique [0002] In the manufacture of a flat panel display device such as a liquid crystal display device, a flat panel type substrate such as a glass substrate may generally be used, and various processes may be performed to form a circuit pattern on the glass substrate. For example, deposition processing for forming a layer on a glass substrate, etching processing for forming a desired pattern from the layer, cleaning processing for removing impurities from the glass substrate, drying the glass substrate drying treatment, etc. [0003] The substrate processing apparatus may...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00
CPCH01L21/67034H01L21/67051H01L21/6708
Inventor 李正洙朴奇洪
Owner SEMES CO LTD
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