Preparation method of composite diamond fretsaw
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- CHANGSHA DIAT NEW MATERIAL SCI & TECH
- Publication Date
- 2011-12-07
- Estimated Expiration
- Not applicable · inactive patent
Smart Images
Figure 1
Abstract
Description
technical field
[0001] The invention relates to a method for preparing a diamond wire saw, in particular to a method for preparing a composite diamond wire saw by using mixed electroplating of raw diamond and broken diamond after surface metallization treatment. The invention belongs to the technical field of surface deposition metal and surface electrochemical plating. Background technique
[0002] Sapphire is a typical hard and brittle material with high hardness (Mohs hardness up to 9.2), high brittleness, high wear resistance, high corrosion resistance, high oxidation resistance, high resistivity, high temperature resistance, non-magnetic conductivity, etc. performance. LED (Light Emitting Diode) has been used in display screens, street lighting, etc. due to its excellent properties such as high brightness, low operating voltage, low power consumption, miniaturization, long life, impact resistance and stable performance, and is considered to have a wide range of applica...