Mildewproof agent for wrapping paper

A technology of anti-fungal agent and wrapping paper, applied in the direction of paper, etc., can solve problems such as work effect and lack of production cost.

Inactive Publication Date: 2011-05-04
石美平
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Existing antifungal agents for food wrapping paper

Method used

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  • Mildewproof agent for wrapping paper
  • Mildewproof agent for wrapping paper
  • Mildewproof agent for wrapping paper

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] An antifungal agent for wrapping paper, which is composed of the following components by weight percentage:

[0014]

Embodiment 2

[0016] An antifungal agent for wrapping paper, which is composed of the following components by weight percentage:

[0017]

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PUM

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Abstract

The invention discloses a mildewproof agent for wrapping paper. The mildewproof agent is prepared from sodium malate, butyl paraben, sorbic acid, ethyl cellulose and ethanol. The mildewproof agent has the advantages of reasonable formula, good use effect and low production cost.

Description

Technical field: [0001] The invention relates to an antifungal agent for food wrapping paper. Background technique: [0002] The existing antifungal agents for food wrapping paper have deficiencies in working effect, production cost and the like. Invention content: [0003] The object of the present invention is to provide an antifungal agent for wrapping paper with reasonable formula and good application effect. [0004] Technical solution of the present invention is: [0005] An antifungal agent for wrapping paper is characterized in that it is composed of the following ingredients in percentage by weight: [0006] [0007] The antifungal agent for wrapping paper is composed of the following components by weight percentage: [0008] [0009] [0010] The invention has reasonable formula, good use effect and low production cost. [0011] The present invention will be further described below in conjunction with embodiment. detailed description: [0012] Exa...

Claims

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Application Information

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IPC IPC(8): D21H21/36
Inventor 石美平
Owner 石美平
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