Flexible substrate packaging structure and filling method thereof

A flexible substrate and packaging structure technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems affecting packaging and carrying, reducing the volume of the package, pollution, etc., and achieve the effect of avoiding pollution and preventing leakage

Active Publication Date: 2013-11-20
NAT CENT FOR ADVANCED PACKAGING
View PDF4 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the development of microelectronic technology, the complexity and diversification of microelectronic processing functions make the integration density of electronic components in the substrate of microelectronics more and more large, which will inevitably increase the volume of microelectronic packages and affect the microelectronic substrate. Packaging and carrying, a flexible electronic technology has been developed in the prior art. The microelectronic substrate adopts a flexible substrate. The flexible substrate not only has the insulation characteristics of the traditional rigid substrate, but also has the characteristics that the rigid substrate does not have, such as flexibility. It makes the substrate itself foldable, greatly reduces the volume of the package, and ensures the packaging and carrying of the microelectronic substrate. See figure 1 , in the existing packages that use flexible materials to form a three-dimensional stacked structure by bending, since the seam 1 of the flexible substrate after bending is not closed, the potting material often leaks from the gap during internal potting. Contaminate other areas of the substrate, especially the test pad, UBM, etc., and affect the subsequent ball planting and testing process

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Flexible substrate packaging structure and filling method thereof
  • Flexible substrate packaging structure and filling method thereof
  • Flexible substrate packaging structure and filling method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] See figure 2 as shown,

[0035] A flexible substrate packaging structure, which includes a flexible substrate 1, a central chip 2, a first chip 3 and a second chip 4 are arranged on the flexible substrate 1, and the central chip 2 corresponds to the bending of the two ends of the flexible substrate 1 on the central chip 2 A mold plastic layer 5 is provided at the position, and a sheet rubber layer 6 is arranged on the central chip 2 and the mold plastic layer 5. The first chip 3 and the second chip 4 are formed by bending the flexible substrate 1 on both sides of the mold plastic layer 5, and the first chip 3 and the second chip 4 are molded on the sheet glue layer 6 on the two sides of the mold plastic layer 5, the central chip 2, and the length of the central chip 2 is equal to the total length of the first chip 3, the second chip 4 and the mold plastic layer 5.

[0036] In the present invention, the mold plastic layer 5 not only plays a role of sealing the seams...

Embodiment 2

[0044] See Figure 9 , Figure 10 :

[0045] Since the molding of a single substrate may be difficult and the yield is not high, it is considered that the bending and potting of multiple structures can be completed at one time through the method of strip imposition. The present invention provides a flexible substrate packaging strip structure 8. It includes a plurality of substrate packaging structures 9, the flexible substrate 1 in the substrate packaging structure is an integral structure; the two sides of the flexible substrate packaging strip structure are respectively provided with potting ports 11.

[0046] A potting method for encapsulating a strip structure with a flexible substrate, the process steps are as follows:

[0047] See Figure 4 : (1), multiple central chips 2 , first chips 3 and second chips 4 are correspondingly two-dimensionally packaged on the flexible substrate 1 ;

[0048] See Figure 5 : (2) Molding is performed on the upper surface of the centra...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a flexible substrate packaging structure, which can effectively prevent leakage of filling materials, prevent the leaked filling materials from polluting other areas of a substrate and guarantee the normal operation of subsequent ball grid array reworking and testing processes. The flexible substrate packaging structure comprises a flexible substrate. A central chip, a first chip and a second chip are arranged on the flexible substrate. The flexible substrate packaging structure is characterized in that a mold plastic layer is arranged at a bent position of the central chip corresponding to two ends of the flexible substrate on the central chip. Adhesive film layers are arranged on the central chip and the mold plastic layer. The first chip and the second chip are molded on two sides of the mold plastic layer by bending the flexible substrate. The first chip and the second chip are molded on the adhesive film layers on the central chip on the two sides of the mold plastic layer. The invention additionally provides a filling method for the flexible substrate packaging structure.

Description

technical field [0001] The invention relates to the technical field of substrate packaging in the microelectronics industry, in particular to a flexible substrate packaging structure and a sealing and potting method thereof. Background technique [0002] With the development of microelectronic technology, the complexity and diversification of microelectronic processing functions make the integration density of electronic components in the substrate of microelectronics more and more large, which will inevitably increase the volume of microelectronic packages and affect the microelectronic substrate. Packaging and carrying, a flexible electronic technology has been developed in the prior art. The microelectronic substrate adopts a flexible substrate. The flexible substrate not only has the insulation characteristics of the traditional rigid substrate, but also has the characteristics that the rigid substrate does not have, such as flexibility. It makes the substrate itself fol...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & AuthorityApplications(China)
IPC IPC(8): H01L23/31H01L25/00H01L21/56H01L21/50
Inventor尹雯张博陆原
OwnerNAT CENT FOR ADVANCED PACKAGING