Glue joining device capable of carrying out glue joining in tiny space and application method thereof

A small space, gluing technology, applied in the direction of rod connection, material gluing, connecting components, etc., can solve the problems of uncontrollable and unreliable gluing quality in small spaces, and achieve high gluing efficiency, light structure and easy operation. simple effect

Active Publication Date: 2015-07-01
NEW UNITED GROUP
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0004] The main technical problem to be solved by the present invention is to provide a bonding device and its application method which can

Method used

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  • Glue joining device capable of carrying out glue joining in tiny space and application method thereof
  • Glue joining device capable of carrying out glue joining in tiny space and application method thereof
  • Glue joining device capable of carrying out glue joining in tiny space and application method thereof

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Embodiment Construction

[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0035] Embodiments of the invention include:

[0036] A bonding device that can be used for bonding in small spaces, including: a joint 1 for connecting standard pipe fittings 2, such as figure 1 As shown, in the embodiment of the present invention, the carbon fiber pipe is selected as the standard pipe fitting 2, and the joint 1 is a metal joint.

[0037] Such as figure 2 As shown, the interface 3 formed between the two ends of the joint 1 and the standard pipe fitting 2 is respectively equipped with a glue injec...

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Abstract

The invention discloses a glue joining device capable of carrying out glue joining in a tiny space and an application method thereof. A glue solution enters the glue joining device through a glue solution groove pipe and flows into a glue solution filling cavity through a glue solution injection connector assembly and an air sealing gasket; air in the glue solution filling cavity is sucked out of a vacuum pump pipe through an air filtering gasket. The application method comprises the steps that after a standard pipe fitting and a connector are preassembled up to standard, the air filtering gasket and the air sealing gasket penetrate through the two sides of the connector respectively, and a vacuum suction connector assembly and the glue solution injection connector assembly are installed at the two sides respectively; the vacuum suction connector assembly is connected to the vacuum pump pipe, the glue solution injection connector assembly is connected to the glue solution groove pipe, a vacuum pump is started, a glue solution hydrometer is observed until the hydrometer does not change, and then glue solution injection is finished. By means of the mode, the problem that the glue joining quality cannot be controlled in the tiny space can be solved, the glue joining device is light in structure, easy to operate and high in glue joining efficiency, and meanwhile all the structural assemblies of the technique device can be standardized.

Description

technical field [0001] The invention relates to the field of mechanical equipment, in particular to a bonding device which can be used for bonding in a small space and a method for using the same. Background technique [0002] Gluing is a common connection method, which mainly has the advantages of not being restricted by the geometric shape of parts, small stress concentration at the glued joint, light weight of the glued structure, and good sealing at the glued joint. , machinery, bridges, electric power, aviation, aerospace and other fields are widely used. With the rapid development of bonding applications, the truss structure with composite materials, metals and other materials as the main force transmission carrier has great potential in the application of large aircraft keels and satellite antenna supports. Big advantage. Because the thickness of the glue layer has a great influence on the mechanical properties of the glue (generally required to be between 0.05-1mm),...

Claims

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Application Information

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IPC IPC(8): F16B7/00F16B11/00
CPCF16B11/008
Inventor 熊念胡宝帅车雪冯涛高大亮安琪
Owner NEW UNITED GROUP
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