A bonding device applicable to bonding in tiny spaces and its application method

Abstract

The invention discloses a glue joining device capable of carrying out glue joining in a tiny space and an application method thereof. A glue solution enters the glue joining device through a glue solution groove pipe and flows into a glue solution filling cavity through a glue solution injection connector assembly and an air sealing gasket; air in the glue solution filling cavity is sucked out of a vacuum pump pipe through an air filtering gasket. The application method comprises the steps that after a standard pipe fitting and a connector are preassembled up to standard, the air filtering gasket and the air sealing gasket penetrate through the two sides of the connector respectively, and a vacuum suction connector assembly and the glue solution injection connector assembly are installed at the two sides respectively; the vacuum suction connector assembly is connected to the vacuum pump pipe, the glue solution injection connector assembly is connected to the glue solution groove pipe, a vacuum pump is started, a glue solution hydrometer is observed until the hydrometer does not change, and then glue solution injection is finished. By means of the mode, the problem that the glue joining quality cannot be controlled in the tiny space can be solved, the glue joining device is light in structure, easy to operate and high in glue joining efficiency, and meanwhile all the structural assemblies of the technique device can be standardized.

Description

technical field [0001] The invention relates to the field of mechanical equipment, in particular to a bonding device which can be used for bonding in a small space and a method for using the same. Background technique [0002] Gluing is a common connection method, which mainly has the advantages of not being restricted by the geometric shape of parts, small stress concentration at the glued joint, light weight of the glued structure, and good sealing at the glued joint. , machinery, bridges, electric power, aviation, aerospace and other fields are widely used. With the rapid development of bonding applications, the truss structure with composite materials, metals and other materials as the main force transmission carrier has great potential in the application of large aircraft keels and satellite antenna supports. Big advantage. Because the thickness of the glue layer has a great influence on the mechanical properties of the glue (generally required to be between 0.05-1mm),...

AI Technical Summary

Problems solved by technology

[0004] The main technical problem to be solved by the present invention is to provide a bonding device and its application method which can effectively solve the problem of uncontrollable and unreliable bonding quality in small spaces, which can be used for bonding in small spaces

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