Shell and preparation method thereof
A shell and substrate technology, applied in the field of shell and its preparation, can solve the problem of not being able to present a three-dimensional effect, etc., and achieve the effect of avoiding pattern fading or film layer shedding and high pattern precision.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Publication Date
- 2015-12-02
- Estimated Expiration
- Not applicable · inactive patent
Smart Images
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Abstract
Description
technical field
[0001] The invention relates to the field of casings, in particular to a casing and a preparation method thereof. Background technique
[0002] A smart phone usually includes two parts: a shell and an electronic component. The shell is the supporting frame of the entire mobile phone, and at the same time, the electronic component is positioned and fixed. With the popularization and development of smart phones, in addition to the performance requirements such as good wear resistance and high hardness, the housing also requires a beautiful appearance.
[0003] At present, the front of the housing of a smart phone is almost completely covered by a rectangular screen. In order to meet the demand for a beautiful appearance of the housing, smart phone manufacturers have begun to design the rear of the housing (ie, the back cover of the mobile phone). The current mobile phone back cover is usually screen-printed with ink on transparent materials to present differen...
Examples
Embodiment Construction
[0070] In order to make the object, technical solution and advantages of the present invention clearer, the implementation manner of the present invention will be further described in detail below in conjunction with the accompanying drawings.
[0071] figure 1 is a structural schematic diagram of a housing provided by an embodiment of the present invention, the housing is suitable for electronic equipment, see figure 1 , the shell consists of:
[0072] The transparent substrate 100 and the micro-nano structure layer 101 covered on the transparent substrate 100, the micro-nano structure layer 101 is arranged on the side of the transparent substrate 100 close to the electronic components in the electronic device, the micro-nano structure layer 101 includes micro-nano scale grooves and Micro-nano pattern composed of bosses.
[0073] In an embodiment of the present invention, the housing includes a transparent substrate and a micro-nano structure layer covering the transparent ...