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Probe card structure, assembling method thereof and replacing method thereof

A probe card and probe head technology, applied in the field of probe card structure, can solve the problems of carbon needle pin damage, poor contact, scratched probe card, etc.

Inactive Publication Date: 2016-03-02
HERMES EPITEK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Therefore, in the conventional technology, if the probe head needs to be replaced, the probe card needs to be turned over repeatedly, resulting in complicated assembly or replacement steps; in addition, in the process of turning over or taking out the probe card, it may cause The risk of scratching the gold point on the front of the probe card to cause poor contact, or the problem of carbon needle pin damage

Method used

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  • Probe card structure, assembling method thereof and replacing method thereof
  • Probe card structure, assembling method thereof and replacing method thereof
  • Probe card structure, assembling method thereof and replacing method thereof

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Embodiment Construction

[0064] see Figure 3A and Figure 3B , the probe card 1 according to an embodiment of the present invention includes a circuit board 10 and a probe head assembly 20 . The circuit board 10 has a first side 12 and a second side 14 opposite to the first side 12, the circuit board 10 has at least one first connecting portion 16; and the circuit board 10 has an accommodating hole 18, the accommodating hole 18 It runs through the first side 12 and the second side 14 of the circuit board 10 . Preferably, the first side 12 is a tester side for connecting a tester (not shown), and the second side 14 is a wafer side for corresponding to a wafer (not shown). The probe head assembly 20 is detachably connected to the circuit board 10, and is partially arranged in the accommodating hole 18, and the probe head assembly 20 includes a fixed portion 22 and a probe head 24, and the probe head 24 can be connected to the fixed portion 22 integral or detachable connections. Wherein, the configu...

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PUM

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Abstract

The present invention provides a probe card structure, an assembling method thereof and a replacing method thereof. The probe card structure comprises a circuit board and a probe head assembly. The circuit board includes a first side and a second side opposite the first side. The circuit board also has at least one first connecting part and a containing hole penetrating the first side and the second side of the circuit board. The probe assembly, which is partially disposed in the containing hole, further comprises a fixing part and a probe head. The fixing part includes at least one second connecting part corresponding to the at least one first connecting part. The fixing part is detachably connected with the circuit board through the connection of the second connecting part and the first connecting part. The probe head is integrally formed with or detachably connected with the fixing part.

Description

technical field [0001] The present invention relates to a probe card structure, in particular to a probe card structure of a probe head assembly that can be assembled or replaced without flipping a circuit board and related assembly and replacement methods. Background technique [0002] The probe card is an important testing tool in the wafer testing of semiconductor integrated circuits. By contacting the probe of the probe card with the specific pad or electrical contact of the wafer, the electrical properties of the circuit on the wafer can be measured, and then judged. The defective products are screened out according to the quality of the wafers. Traditional wafer inspection devices such as figure 1 As shown, the probe card 100A includes a circuit board 110A and a probe head 120A. The circuit board 110A has a tester side (TesterSide) 112A and a wafer side 114A (WaferSide). The probe head 120A is mounted on and electrically connected to The wafer side 114A, and the prob...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/073
CPCG01R1/07314G01R3/00H05K1/184H05K3/225H05K3/30H05K2201/10409H05K2201/1059G01R1/07342
Inventor 王子建徐文元邱圣勋
Owner HERMES EPITEK
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