Substrate transfer device

A technology for transferring devices and substrates, used in transportation and packaging, semiconductor devices, electrical components, etc., can solve problems such as vacuum pump failures, and achieve the effect of increasing the movement margin

Active Publication Date: 2019-05-31
ULVAC KOREA
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Also, the particles are introduced into the vacuum pump used to create a vacuum inside the chamber, resulting in failure of the vacuum pump

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate transfer device
  • Substrate transfer device
  • Substrate transfer device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0040] Hereinafter, exemplary embodiments will be described in more detail with reference to the accompanying drawings. However, this invention may take different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0041] figure 1 is a front view of the substrate transfer apparatus according to the first exemplary embodiment, and figure 2 is a side view illustrating the substrate transfer apparatus according to the first exemplary embodiment. That is, viewed from the direction of the mounting substrate, figure 1 is the front view, and figure 2 is a side view. again, image 3 is a side view illustrating the magnetic transfer unit of the substrate transfer apparatus according to the first exemplary embodiment, and Figure 4 is a schematic diagram illustrating a magnetic...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The present invention presents a substrate transfer apparatus comprising: a tray on which a substrate is loaded; a magnetic transfer unit provided at a lower side of the tray, magnetically levitating the tray, and transferring the tray by magnetic force; a guide unit for guiding the transfer of the tray by not making contact with the tray; and an interval maintenance means provided at at least one region between the magnetic transfer unit and the guide unit.

Description

technical field [0001] The present invention relates to a substrate transfer device, and more particularly to a substrate transfer device that transfers a tray mounted with a substrate via a contactless method. Background technique [0002] Generally speaking, flat panel display device (Flat Panel Display device, referred to as: FPD) (such as liquid crystal display device (Liquid Crystal Display device, referred to as: LCD), plasma display panel device (PlasmaDisplay Panel device, referred to as: PDP), field emission Field Emission Display device (FED for short) and Electroluminescence Display device (ELD for short) are manufactured by performing multiple processes on a substrate. That is, on the substrate, a deposition process, a photolithography process, and an etching process are repeated multiple times, and cleaning, attaching, and cutting processes are additionally performed to manufacture a flat panel display device. [0003] Such manufacturing processes of flat panel...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/673H01L21/677H01L21/68
CPCH01L21/673H01L21/677H01L21/68H01L2221/67H01L2221/683
Inventor 金正健金善吉金南训金锺大高元一苏秉镐孙承京李起泰李尚浩千敏镐韩应龙
Owner ULVAC KOREA
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap