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lighting device

A technology for lighting devices and packaging substrates, which is applied to lighting devices, fixed lighting devices, components of lighting devices, etc., can solve the problems of high production costs, and achieve the effect of low production costs and small volume

Inactive Publication Date: 2019-02-15
SUBTRON TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is to say, it is necessary to set the waterproof plug W to achieve the effect of completely waterproofing and sealing the light emitting diode 20, so the production cost of the existing lighting device is also relatively high.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0067] Figure 2A It is a schematic diagram of an illuminating device according to an embodiment of the present invention. Figure 2B shown as Figure 2A The schematic top view of the light-transmitting cover, the cover plate, the packaging carrier, the first sealing ring and the second sealing ring. Please also refer to Figure 2A and Figure 2B , in this embodiment, the illuminating device 100a includes a thermally conductive substrate 110, an encapsulation loading plate 120a, at least one light emitting element 130 ( Figure 2A only schematically show three), at least one welding wire 140 ( Figure 2A Only one is schematically shown), a transparent cover 150 , a first sealing ring 160 and a second sealing ring 170 .

[0068] In detail, the heat conduction substrate 110 has an upper surface 112 . The package carrier 120 a is disposed on the upper surface 112 of the thermally conductive substrate 110 and has an opening 121 , wherein the opening 121 exposes part of the upp...

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PUM

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Abstract

The invention discloses an illuminating device, which includes a thermal conduction substrate, a packaging carrier, at least one light-emitting element, at least one welding wire, a light-transmitting cover, a first sealing ring and a second sealing ring. The thermally conductive substrate has an upper surface. The packaging carrier is disposed on the upper surface and has an opening, and the opening exposes part of the upper surface. The light-emitting element is arranged on the upper surface exposed by the opening, and is electrically connected with the package carrier through the welding wire. The light-transmitting cover is disposed above the heat-conducting substrate. The light-emitting element and the encapsulation carrier are located between the light-transmitting cover and the heat-conducting substrate. The first sealing ring is disposed between the light-transmitting cover and the package carrier. The second sealing ring is disposed between the package carrier and the heat conduction substrate. The thermal conduction substrate, the light-transmitting cover, the first sealing ring, the second sealing ring and the packaging carrier plate seal the light-emitting element.

Description

technical field [0001] The present invention relates to a lighting device, and in particular to a lighting device with waterproof function. Background technique [0002] figure 1 It is a schematic diagram of a conventional lighting device. Please refer to figure 1 , in the existing lighting device 10, the light emitting diode 20 is disposed on the packaging substrate 30 by wire bonding, and is electrically connected to an external circuit (not shown) through the wire 40 disposed on the packaging substrate 30, to drive the LED 20 to emit light. Wherein, the packaging carrier 30 is arranged on the temperature chamber 50 , and the temperature chamber 50 is arranged on the heat dissipation fins 60 to increase the heat dissipation effect. The light-transmitting cover portion 72 of the light-transmitting cover 70 is located above the LED 20 , and the position of the light-transmitting cover 70 is fixed by the first metal cover 80 and the second metal cover 90 . Further, the f...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21S8/00F21V31/00F21V29/70F21Y115/10
CPCF21V19/0035F21V27/02F21V31/005F21V29/70F21V29/763F21V29/85F21Y2115/10H01L2224/48091H01L2924/00014
Inventor 曾子章沈子士
Owner SUBTRON TECH