Adhesion head and semiconductor manufacturing apparatus using same

A technology for manufacturing devices and semiconductors, which is applied in the field of semiconductor manufacturing devices, can solve problems such as inability to identify, and achieve the effect of improving bonding and mounting accuracy

Active Publication Date: 2017-07-14
AMKOR TECH JAPAN INC
View PDF9 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In such a die mounting apparatus, when the bonding unit is in contact with the semiconductor device, the bonding portion directly in contact with the semiconductor device is deformed according to the shape of the surface of the semiconductor device, so the adhesion between the bonding portion and the semiconductor device is good, However, for example, when the bonding portion is formed of an opaque elastic material such as rubber, after the semiconductor device is held by the bonding unit, it is impossible to modify the shape of the semiconductor device or the characteristic pattern provided on the surface for the purpose of position correction. problem of identification

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Adhesion head and semiconductor manufacturing apparatus using same
  • Adhesion head and semiconductor manufacturing apparatus using same
  • Adhesion head and semiconductor manufacturing apparatus using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0040] Hereinafter, a semiconductor manufacturing apparatus according to the present invention will be described with reference to the drawings. However, the semiconductor manufacturing apparatus of the present invention can be implemented in a plurality of different embodiments, and should not be construed as being limited to the description of the embodiments shown below. In addition, in the drawings referred to in this embodiment, the same symbols are attached to the same parts or parts having the same functions, and repeated description thereof will be omitted. In addition, in the following description, when some elements of a film or region are located "on" other elements, they are not limited to the case of being "directly above" the other elements, but also include those in which other elements are present in between. Condition.

[0041] refer to Figure 1 to Figure 5 , a semiconductor manufacturing apparatus according to one embodiment of the present invention will b...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a semiconductor manufacturing apparatus that improves the loading precision of a semiconductor device relative to a covering side of a to-be-loaded body and improves the adhesion performance between the covering side of the to-be-loaded body and the semiconductor device, and also provides an adhesion head used for the same. The invention provides an adhesion head which comprises an elastic member in a part where the adhesion head contacts a semiconductor device and an alignment mark recognition area capable of detecting an optically readable marker provided on a surface to be contacted to the semiconductor device. Additionally, a semiconductor manufacturing apparatus in which the adhesion head is applied is provided.

Description

technical field [0001] The present invention relates to a bonding head for absorbing a semiconductor device and a semiconductor manufacturing device using the same, and more particularly to a bonding head for realizing high-precision die attach of a semiconductor device and a semiconductor manufacturing device using the same. Background technique [0002] In a chip mounter that takes out a semiconductor device from a diced wafer and mounts it on a mounted object such as a lead frame or a substrate, usually when taking out the supplied semiconductor device individually, or when placing the semiconductor device on the The intermediate stage set up during the handover process of the pressurized bonding unit (hereinafter referred to as the bonding unit) of the mounted body recognizes the shape of the semiconductor device or the characteristic pattern set on the surface layer, and after correcting the position of the semiconductor device, the A semiconductor device is die-mounted...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & AuthorityApplications(China)
IPC IPC(8): H01L21/683H01L21/67
CPCH01L21/67011H01L21/67144H01L21/683H01L21/6838H01L2224/75702H01L2224/75824H01L2224/75312H01L2224/75316H01L2224/83132H01L24/27H01L24/29H01L24/32H01L24/83H01L2224/27436H01L2224/2919H01L2224/32225H01L2224/32245H01L2224/75822H01L2224/8313H01L2224/83191H01L2224/7532H01L2224/8317H01L2224/8318H01L24/75H01L2224/75745H01L2224/75753H01L2924/00014H01L2924/0715H01L2924/0635H01L2924/06H01L2924/013H01L2924/00012H01L21/52H01L21/78H01L23/544H01L21/185H01L21/67282H01L22/12H01L21/67132H01L21/681
Inventor甲斐稔
OwnerAMKOR TECH JAPAN INC