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Equipment for improving fixing capacity to mainboard of mobile phone

A motherboard and capacity technology, applied in the field of equipment to improve the ability to fix the motherboard of the mobile phone, can solve the problems that the motherboard of the mobile phone cannot be stably fixed, the height of the clamp cannot be adjusted, and the motherboard of the mobile phone is broken, so as to avoid breaking, facilitate flexible use, and avoid soreness Effect

Pending Publication Date: 2018-04-10
重庆笨瓜科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, after the production of the main board of the mobile phone, a series of tests must be carried out to determine whether the product is qualified. When testing the main board of the mobile phone, the main board of the mobile phone needs to be clamped. However, due to the thinness of the main board of the mobile phone, it is easy to break the main board of the mobile phone when the clamping force is too large, and the main board of the mobile phone cannot be stably fixed when the clamping force is too small. The height cannot be adjusted, and the operator will cause neck pain if used for a long time

Method used

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  • Equipment for improving fixing capacity to mainboard of mobile phone
  • Equipment for improving fixing capacity to mainboard of mobile phone
  • Equipment for improving fixing capacity to mainboard of mobile phone

Examples

Experimental program
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Embodiment

[0030] Such as Figure 1 to Figure 6As shown, the device for improving the fixing ability of the mobile phone motherboard in the present invention includes a base 2 and a base, the base 2 is a rectangular structure, the top of the base 1 is provided with a groove 9 and a fixing block 11, and the fixing block 11 is located in the groove 9 The outer side of the groove 9 is located at the central position of the base 2, and two connecting rods 4 are arranged in the groove 9, and the two ends of the connecting rod 4 are respectively connected with the inner wall of the groove 9, and there is also a A movable block 6 is provided, the axis of the movable block 6 is on the same straight line as the axis of the fixed block 11, and the two connecting rods 4 are inserted on the movable block 6, and the movable block 6 can move along the connecting rod 4 on the connecting rod 4. 4 moves in the axial direction, and the connecting rod 4 is equipped with an elastic element 3, the elastic el...

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Abstract

The invention discloses equipment for improving the fixing capacity to a mainboard of a mobile phone. The equipment comprises a base, and a groove and a fixed block are arranged at the top of the base. A movable block is arranged in the groove and can move in the groove towards the fixed block, and a first opening is formed in the side wall, towards the fixed block, of the movable block. First pressing rods are further arranged at the top of the movable block, and first pressing plates are further arranged at the tail ends, located in the first opening, of the first pressing rods. A second opening is formed in the side wall, towards the movable block, of the fixed block, and second pressing rods are further arranged at the top of the fixed block. Second pressing plates are arranged at thetail ends, located in the second opening, of the second pressing rods, and a supporting barrel is arranged at the top of a basic seat. The supporting barrel can rotate on the basic seat, and a vertical rod is arranged on the supporting barrel. The vertical rod is vertically inserted into the supporting barrel, and the vertical rod can move in the supporting barrel in the vertical direction. The top of the vertical rod is connected with the bottom of the base, a plurality of through holes are evenly formed in the vertical rod, and a locating rod is further arranged on the supporting barrel.

Description

technical field [0001] The invention relates to a processing tool for a main board of a mobile phone, in particular to a device for improving the ability to fix the main board of a mobile phone. Background technique [0002] The circuit on the current mobile phone motherboard can be divided into four sections: RF section, logic section, power supply section, and interface section. The radio frequency is responsible for sending and receiving signals for communication with the outside world, including antenna and controller frequency synthesis and power amplifiers for modulation and demodulation. The logic part is composed of CPU and software memory, etc., which is to handle some conventional operations, including controlling the work of various parts of the whole machine. The power supply part consists of a power supply IC and a power supply tube, which distribute the battery to each component to ensure normal operation. The interface part is to operate and communicate with...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B25B11/00
CPCB25B11/00
Inventor 丁澎
Owner 重庆笨瓜科技有限公司
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