Gettering layer forming device, gettering layer forming method, and computer storage medium
A vertical direction and substrate technology, which is applied in the field of gettering layer formation devices, can solve problems such as chip cracking, chipping, and chip flexural strength weakening
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no. 1 Embodiment approach ＞
[0081] Next, a first embodiment of the gettering layer forming unit 100 will be described. Such as image 3 and Figure 4 As shown, the gettering layer forming unit 100 has a polishing film 120 , a soft part 121 , a base 122 , a spindle 123 , a drive part 124 , and a water supply part 125 .
[0082] The polishing film 120 and the soft part 121 are provided so as to be supported on the base 122 . A drive unit 124 is provided on the base 122 via a spindle 123 . Drive unit 124 incorporates, for example, a motor (not shown), and moves polishing film 120 , soft portion 121 , and base 122 in the vertical direction and rotates polishing film 120 , soft portion 121 , and base 122 .
[0083]The polishing film 120 contains abrasive grains, and can be brought into contact with the wafer W to polish the wafer W. In addition, the polishing film 120 is thin and flexible. Furthermore, the polishing film 120 is provided in such a size as to be in contact with the entire back surface of t...
no. 2 Embodiment approach ＞
[0098] Next, a second embodiment of the gettering layer forming unit 100 will be described. The gettering layer forming unit 100 of the second embodiment is as follows Figure 7 As shown, instead of the flexible part 121 of the first embodiment, there is a flexible part 200 filled with a fluid inside. Various fluids, such as water, oil, and air, are used as the fluid filled into the soft part 200 . In addition, other configurations of the gettering layer forming unit 100 of the second embodiment are the same as those of the gettering layer forming unit 100 of the first embodiment.
[0099] in such as Figure 8 In a state where the polishing film 120 is not in contact with the wafer W as shown in (a), the polishing film 120 and the soft portion 200 are flat.
[0100] On the other hand, if Figure 8 If the polishing film 120 contacts the wafer W as shown in (b), since the polishing film 120 and the soft portion 200 have flexibility, the lower surface of the polishing film 12...
no. 3 Embodiment approach ＞
[0110]Next, a third embodiment of the gettering layer forming unit 100 will be described. The gettering layer forming unit 100 of the third embodiment is as follows Figure 10 As shown, a polishing film 300 having a concave-convex shape on the surface is used instead of the polishing film 120 of the first and second embodiments. In addition, other configurations of the gettering layer forming unit 100 of the third embodiment are the same as those of the gettering layer forming unit 100 of the first embodiment.
[0111] The polishing film 300 has a film 301 and a plurality of protrusions 302 formed on the surface of the film 301 . The protrusions 302 contain abrasive grains. In addition, the protruding portion 302 has a tapered shape whose width decreases from above to below in a side view. The height of the protrusion 302 is not particularly limited, and is, for example, 40 μm to 50 μm.
[0112] In this case, when the polishing film 300 comes into contact with the wafer W ...
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