Polishing pad for wafer polishing apparatus

A technique for polishing devices and polishing pads, which is applied in the field of polishing pads and can solve problems such as increased edge roll-off

Inactive Publication Date: 2020-03-13
LG SILTRON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the exposed area not in contact with the polishing pad increases in the edge area of ​​the wafer, so that there is a problem of increased edge roll-off.

Method used

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  • Polishing pad for wafer polishing apparatus
  • Polishing pad for wafer polishing apparatus
  • Polishing pad for wafer polishing apparatus

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Embodiment Construction

[0026] Hereinafter, the present invention is described in detail with reference to exemplary embodiments, and is explained in detail with reference to the accompanying drawings to help understanding of the present invention.

[0027] However, the embodiment according to one embodiment of the present invention may be changed into various other forms, and the scope of the present invention should not be construed as being limited to the embodiment described below. The embodiments of the present invention are used to more fully explain the present invention to those skilled in the art.

[0028] In addition, relational terms such as "first" and "second", "upper" and "lower", etc. do not necessarily require or imply any physical or logical relationship or order between their entities or elements, and may be used only to refer to one entity or An element is distinguished from another entity or element.

[0029] figure 1 is a diagram showing a first polishing pad of the polishing ...

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Abstract

A polishing pad for a wafer polishing apparatus according to an embodiment includes: a first NAP layer having an upper surface in direct contact with a wafer; a second NAP layer disposed under the first NAP layer to support the first NAP layer; and a polyethylene terephthalate film (PET film) layer disposed under the second NAP layer to be attached to a surface plate.

Description

[0001] Cross References to Related Applications [0002] This application claims priority based on 35 U.S.C. §119 from Korean Patent Application No. 10-2018-0106324 filed in Korea on September 6, 2018, the entire contents of which are incorporated herein by reference as if set forth in full below. technical field [0003] The present invention relates to a polishing pad of a wafer polishing device, and more particularly to a polishing pad capable of reducing compressibility and increasing hardness. Background technique [0004] Generally, in the polishing pad of the wafer polishing device, as the service time of the polishing pad increases, the thickness of the polishing pad decreases, and the pressure exerted by the polishing head on the wafer remains constant, so the wafer is in the first half of the polishing pad thickness than the polishing pad. It is polished when the thickness is thinner during use. Therefore, an exposed area not in contact with the polishing pad inc...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): B24D13/14
CPCB24D13/14B24B37/22B24B37/245B24B37/24B24D3/34
Inventor李承源
OwnerLG SILTRON