A method and device for self-adapting flow rate adjustment of liquid-cooled cold plate of electronic equipment

Abstract

The invention discloses a flow self-adaptive adjustment device for a liquid-cooled cold plate of electronic equipment, which relates to the technical field of electronic equipment cooling, and specifically includes a liquid-cooled cold plate, a thermal expansion part and a flow channel. The top of the flow channel is provided with a liquid inlet on the upper surface of the liquid-cooled cold plate, the inner bottom of the liquid inlet is provided with a throttling part, the thermal expansion part is installed in the liquid-cooled cold plate, and the middle of the side of the liquid inlet passes through the second The bypass branch communicates with the thermal expansion component, the side of the flow channel communicates with the thermal expansion component through the first bypass branch, and a temperature sensing chamber is provided inside the liquid cooling plate, and the temperature sensing chamber communicates with the thermal expansion component through the channel. When applied in large-scale liquid cooling systems, there is no need to add additional components such as electric regulating valves and temperature sensors, and only thermal expansion components are added to the existing conventional cold plate structure, so that the cross-sectional area of ​​the flow channel of the liquid-cooled cold plate can vary with the temperature of the electronic device. Adaptive changes to improve the stability and safety of phase change cooling systems.

Description

technical field [0001] The invention relates to the technical field of electronic equipment cooling, in particular to a flow adaptive adjustment method and device for a liquid-cooled cold plate of electronic equipment. Background technique [0002] With the development of electronic technology and the continuous improvement of application requirements, the integration and power density of electronic devices have increased significantly. In many applications, the heat dissipation capacity of electronic devices has become one of the bottlenecks restricting their performance. At present, the more common cooling method is mainly forced air cooling, because of its low heat dissipation efficiency, it is difficult to meet the increasingly stringent heat dissipation requirements of electronic equipment. Liquid cooling technology, especially phase change cooling technology, has been rapidly developed and applied in recent years due to its advantages of high heat dissipation efficienc...

AI Technical Summary

Problems solved by technology

[0006] Aiming at the problems existing in the prior art, the object of the present invention is to provide a method and device for self-adaptive adjustment of the flow rate of the liquid-cooled cold plate of electronic equipment, which realizes the self-adaptive adjustment of the flow rate of the cold plate with the temperature through the thermal expansion component, and satisfies the requirements of large-scale liquid cooling systems. In the cooling system, the demand for dynamic adjustment of the flow when the heat load of the local branch changes, especially in the phase change cooling system, solves the problem of heat transfer deterioration caused by the fluctuation of the flow distribution of the branch, ensures effective cooling of the electronic equipment in each branch, and improves Cooling system stability and safety

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