Integrated curing device for chip packaging

A technology for curing equipment and chip packaging, which is used in the manufacture of semiconductor/solid-state devices, devices for coating liquids on surfaces, electrical components, etc. problems, to achieve the effect of ease of use, improved functionality, and improved flexibility

Inactive Publication Date: 2020-10-13
陈星
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problem that the traditional integrated curing equipment for chip packaging does not have an auxiliary discharge structure, so that the user cannot flexibly adjust the material delivery angle of the curing equipment according to the use requirements, which reduces the flexibility of its use. Secondly, the traditional chip packaging An integrated curing device does not have an auxiliary storage structure, which reduces the functionality of the curing device itself, and provides an integrated curing device for chip packaging

Method used

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  • Integrated curing device for chip packaging
  • Integrated curing device for chip packaging
  • Integrated curing device for chip packaging

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Embodiment Construction

[0020] The technical solutions of the present invention will be clearly and completely described below in conjunction with embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0021] Such as Figure 1-3 As shown, an integrated curing device for chip packaging includes a box base 2 and a fixed bottom plate 3. A sealing cover 7 is fixedly installed on the outer surface of the upper end of the fixed bottom plate 3, and an existing LED light emitter is installed in the sealing cover 7, The LED illuminator is used to generate ultraviolet light, and the chip is irradiated with the ultraviolet light, so that the chip coated with the curing agent is packaged and cured, and the upper outer surf...

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Abstract

The invention discloses an integrated curing device for chip packaging. The device comprises a box base and a fixed bottom plate, a sealing cover is fixedly mounted on the outer surface of the upper end of the fixed bottom plate; a fixed clamping frame is fixedly mounted on one side, close to the sealing cover, of the outer surface of the upper end of the fixed bottom plate; a rotating plate is movably mounted at the lower part of the fixed clamping frame; the middle of the inner side of the rotating plate is movably sleeved with a threaded rod, the rotating plate is movably connected with thefixed clamping frame through the threaded rod, a movable clamping groove is formed in the inner side of the upper end of the fixed clamping frame in a penetrating mode, a push-pull ring is fixedly installed on the outer surface of the top end of the threaded rod, and a side rotating supporting plate is movably installed on the outer surface of one side of the fixed bottom plate. The integrated curing device for chip packaging is provided with an auxiliary discharging structure, the flexibility of the integrated curing device during use is improved, a user can flexibly adjust the output angleof materials, and the materials can be conveniently stored and operated.

Description

Technical field [0001] The invention belongs to the technical field of curing equipment and equipment, in particular to an integrated curing equipment for chip packaging. Background technique [0002] The curing machine is actually a device that provides a light source. It cannot "curate" anything by itself. When "epoxy resin" is commonly used as a binder, a "curing agent" needs to be added to promote its curing to achieve a bonding effect. "Curing resin" needs to be irradiated with ultraviolet light and can be cured quickly after absorbing ultraviolet energy. [0003] The reference document CN204107809U discloses a curing machine, especially a curing machine used for coating or coating layer curing and leveling, a compact and safe curing machine, which consists of a driving device, a transmission system, a rotating actuator and The tailstock is composed of the driving device and the transmission system, the first-stage transmission shaft is in transmission connection with the out...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67B05D3/06
CPCB05D3/067H01L21/67126
Inventor 陈星
Owner 陈星
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