Split type heat conductor and electronic device with heat dissipation structure
A technology for electronic devices and heat dissipation structures, which is applied in the direction of modification through conduction heat transfer, cooling/ventilation/heating transformation, etc., to achieve high-efficiency shell heat dissipation, overcome assembly errors, avoid dust problems and fan life problems.
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[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0033] see Figure 1~4 , in an embodiment of the present invention, a split heat conductor includes a heat collection device 1 and a heat release device 2, the heat collection device 1 includes a heat collection base 3 and a V-shaped metal sheet-4, and the heat collection base 3 is used for It is tightly connected with the electronic components that need to be dissipated. The front side of the heat collection base 3 is welded and fixed with several V-shaped me...
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