Split type heat conductor and electronic device with heat dissipation structure

A technology for electronic devices and heat dissipation structures, which is applied in the direction of modification through conduction heat transfer, cooling/ventilation/heating transformation, etc., to achieve high-efficiency shell heat dissipation, overcome assembly errors, avoid dust problems and fan life problems.

Active Publication Date: 2020-10-16
胡俊喜
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] At present, due to the lack of flexible and efficient heat conduction heat spreaders, heat sinks are basically used to directly dissipate heat from electronic components

Method used

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  • Split type heat conductor and electronic device with heat dissipation structure
  • Split type heat conductor and electronic device with heat dissipation structure
  • Split type heat conductor and electronic device with heat dissipation structure

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Embodiment Construction

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0033] see Figure 1~4 , in an embodiment of the present invention, a split heat conductor includes a heat collection device 1 and a heat release device 2, the heat collection device 1 includes a heat collection base 3 and a V-shaped metal sheet-4, and the heat collection base 3 is used for It is tightly connected with the electronic components that need to be dissipated. The front side of the heat collection base 3 is welded and fixed with several V-shaped me...

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Abstract

The invention discloses a split type heat conduction device, which comprises a heat collection device and a heat release device, wherein the heat collection device comprises a heat collection base anda plurality of first V-shaped metal sheets fixedly connected with the heat collection base, the heat release device comprises a heat release base and a plurality of second V-shaped metal sheets fixedly connected with the heat release base, the heat collection base is used for making close contact with an electronic component and absorbing heat emitted by the electronic component, the first V-shaped metal sheet is used for conducting heat from the heat collection base to the second V-shaped metal sheet, the second V-shaped metal sheet is used for conducting heat absorbed from the first V-shaped metal sheet to the heat release base, and the heat release base is used for making close contact with an equipment shell and conducting heat to the equipment shell. The device provided by the invention is simple in structure and convenient to disassemble, tight contact between the split bodies is realized through elasticity, the assembly error is effectively overcome, and efficient heat conduction between the electronic component and the shell is realized.

Description

technical field [0001] The invention relates to the field of heat dissipation design of electronic equipment, in particular to a split heat conductor and an electronic device with a heat dissipation structure. Background technique [0002] Electronic components generate heat due to the flow of current, causing the temperature to rise and become a heat source. If the temperature rise is too high, it needs to be controlled so as not to cause the electronic components to fail to work properly. In order to control the temperature, either a heat sink is designed to quickly dissipate the heat from the heat source into the air, or a heat spreader is designed to conduct the heat from the heat source to the housing for heat dissipation. [0003] In order to facilitate disassembly and maintenance, the circuit board and the housing where the electronic components are located need to be easily separated. Therefore, the heat spreader is used to connect the electronic components and the ...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): H05K7/20
CPCH05K7/2039
Inventor胡俊喜
Owner胡俊喜