Circuit board forming processing device

A molding process, circuit board technology, applied in the direction of cleaning methods using tools, cleaning methods and utensils, chemical instruments and methods, etc., can solve the problem of dust stuck on the bristles, falling on the lower circuit board, damage to the surface of the circuit board, etc. problems, to achieve the effect of increasing the cleaning area, improving the dust removal effect, and improving the cleaning force

Inactive Publication Date: 2020-10-30
盛春井
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, this method often encounters some problems in the actual dust removal process. During vibration dust removal, since the circuit boards are usually in direct contact, the circuit boards will collide with each other or the circuit board and the sieve will collide with each other during vibration, thus affecting the circuit. At t

Method used

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Embodiment Construction

[0032] Embodiments of the present invention will be described below with reference to the drawings. In the process, in order to ensure the clarity and convenience of illustration, we may exaggerate the width of the lines or the size of the constituent elements in the diagram.

[0033] In addition, the following terms are defined based on the functions in the present invention, and may be different according to the user's or operator's intention or practice. Therefore, these terms are defined based on the entire content of this specification.

[0034] Such as Figure 1 to Figure 6 As shown, a circuit board forming and processing equipment includes a placing frame 1, a connecting plate 2, a clamping unit 3, a fixing plate 4, a cleaning unit 5, a linkage plate 6 and a cylinder 7, and the middle part of the placing frame 1 is installed with Connecting plate 2, clamping unit 3 is evenly arranged on connecting plate 2, fixed plate 4 is installed on the lower end of placing frame 1...

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PUM

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Abstract

The invention relates to a circuit board forming processing device. The circuit board forming processing device comprises a placing frame (1), a connecting plate (2), a clamping unit (3), a fixing plate (4), sweeping units (5), a linkage plate (6) and air cylinders (7), wherein the middle of the placing frame (1) is provided with the connecting plate (2), the connecting plate (2) is uniformly provided with the clamping units (3), the lower end of the placing frame (1) is provided with the fixing plate (4), the fixing plate (4) is uniformly provided with the sweeping units (5) from left to right, the linkage plate (6) is connected between the sweeping units (5), and the air cylinders (7) are connected between the linkage plate (6) and the placing frame (1). The circuit board forming processing device solves the problem that when the vibration and dust removal are performed, because circuit boards make direct contact with each other, and during vibration, the circuit boards can collide with each other or the circuit boards and a sieve collide with each other during vibration, the damage to the surfaces of the circuit boards is caused; and the circuit board forming processing device solves the problem that because the circuit boards are overlapped together, dust falls through vibration of an upper layer, metal particles fall onto the lower-layer circuit boards, and the dust and the metal particles are frequently clamped between bristles, the bristles can be cleaned regularly.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a circuit board forming and processing equipment. Background technique [0002] The circuit board is an indispensable accessory in modern electronic equipment. All electronic equipment, whether it is large-scale machinery or personal computers, communication base stations or mobile phones, household appliances or electronic toys, will use circuit boards. Especially when processing circuit boards For small circuit boards, a large amount of dust and metal particles will be generated during the stamping process. The traditional method is to put the circuit board in a sieve to remove dust by vibration, and at the same time clean the vibrating circuit board with a rotating brush. [0003] However, this method often encounters some problems in the actual dust removal process. During vibration dust removal, since the circuit boards are usually in direct contact, the cir...

Claims

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Application Information

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IPC IPC(8): B08B1/04B08B5/04B08B13/00
CPCB08B1/002B08B1/04B08B5/04B08B13/00
Inventor 盛春井
Owner 盛春井
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