Glue sealing device for semiconductor diode

A sealing device and diode technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as poor gluing uniformity, increased defective rate, sealing failure, etc., to achieve uniform heating and device structure Reasonable and practical, ensuring the effect of drying effect
CN112216618AActive Publication Date: 2021-01-12抚州华成半导体科技股份有限公司
6 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
抚州华成半导体科技股份有限公司
Publication Date
2021-01-12

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
Patent Text Reader

Abstract

The invention discloses a glue sealing device for a semiconductor diode, which belongs to the field of semiconductor manufacturing and comprises a base, two electric push rods are fixedly connected tothe top of the base, and a glue sealing groove body is fixedly connected to the top of the base. Lantern rings slidably connected with the two electric push rods are arranged on the outer sides of the two electric push rods in a sleeving mode, integrally-formed heating plates are fixedly connected to the front faces and the back faces of the two lantern rings, integrally-formed I-shaped frames are fixedly connected to the tops of the two electric push rods, and the tops of the two electric push rods are fixedly connected to the bottom ends of the two electric push rods; the top of the base isfixedly connected to the bottom of the glue sealing groove body, the outer sides of the two electric push rods are slidably connected to the inner sides of the two lantern rings correspondingly, andthe front faces and the back faces of the two lantern rings are fixedly connected to the opposite sides of the two heating plates correspondingly, so that the device has the advantages that lead bending is avoided, gluing is uniform, and drying is rapid and uniform.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention relates to the field of semiconductor manufacturing, more specifically, to a sealing device for semiconductor diodes. Background technique

[0002] The lead wire of the diode needs to be sealed with glue so that it can be prepared into a complete diode. In the existing glue sealing process, it is often through the repeated contact of the lead wire between the multiple seal teeth on the seal rack. , so that the glue on the sealing teeth can be glued to the leads.

[0003] However, in the above-mentioned sealing device, the lead wire may be deformed and bent under the friction of the rubber teeth, resulting in the failure of the sealing, and the uniformity of the gluing of this device is poor and difficult to control, and it cannot be quickly and evenly glued after sealing. Drying of the glue solution leads to an increase in the rate of defective products, so we propose a sealing device for semiconductor diodes to solve the above problems ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More