Controlled depth etching hole technology of circuit board and circuit board
A circuit board and deep etching technology, which is applied in the direction of printed circuit, printed circuit manufacturing, electrical components, etc., can solve the problems of no function, low pass rate of circuit board, difficult to accurately control back drilling, etc., to improve the pass rate , Ensure high-speed signal transmission performance, improve the effect of etching controllability
Active Publication Date: 2022-04-29
HUIZHOU TECHUANG ELECTRONIC TECH CO LTD
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Problems solved by technology
[0002] Back-drilling is a special process in controlled depth drilling. The back-drilling process is to drill out the through-hole section on the circuit board that does not play any connection or transmission function. Drilling and back drilling have the effect of reducing the length of useless copper pillars in electroplating vias, effectively increasing the transmission speed of signals, and avoiding the problem of "distortion" caused by reflection, scattering, and delay of high-speed signal transmission. However, the back-drilling process is difficult to accurately control the depth of the back-drilled hole. There are often through-hole sections that are not drilled out on the circuit board that do not play any connection or transmission function, and through-hole sections that have connection or transmission functions are often drilled off. problems, resulting in a low yield of circuit boards in the production of circuit boards with high-speed signal transmission functions
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[0038] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.
[0039] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of ill...
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The present application provides a deep etching hole control process of a circuit board and the circuit board. The above-mentioned deep etching process of circuit board comprises the following steps: obtaining the pre-finished circuit board after the circuit is made; obtaining the back-drilling depth a of the pre-finished circuit board; obtaining the auxiliary gel plug with a height a; using The auxiliary gel plug is used to block the pre-finished circuit board; the pre-finished circuit board after the plugging process is filled with resin and baked to obtain a circuit board with holes to be etched; The circuit board with holes is subjected to a dry film treatment; the circuit board to be etched after the dry film treatment is subjected to an etching operation to obtain a circuit board with controlled depth etching holes. The above controlled deep etching process of the circuit board can improve the qualification rate of the circuit board with the function of high-speed signal transmission.
Description
technical field [0001] The invention relates to the technical field of circuit boards, in particular to a process for controlling deep etching holes of circuit boards and the circuit board. Background technique [0002] Back-drilling is a special process in controlled depth drilling. The back-drilling process is to drill out the through-hole section on the circuit board that does not play any connection or transmission function. Drilling and back drilling have the effect of reducing the length of useless copper pillars in electroplating vias, effectively increasing the transmission speed of signals, and avoiding the problem of "distortion" caused by reflection, scattering, and delay of high-speed signal transmission. However, the back-drilling process is difficult to accurately control the depth of the back-drilled hole. There are often through-hole sections that are not drilled out on the circuit board that do not play any connection or transmission function, and through-ho...
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IPC IPC(8): H05K3/00
CPCH05K3/0047H05K3/0094
Inventor 许校彬邓家响杨俊沈永龙罗智元
Owner HUIZHOU TECHUANG ELECTRONIC TECH CO LTD