Wafer positioning device and method

A technology of positioning device and positioning method, which is applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of wafer transfer efficiency and poor consistency, so as to improve versatility, ensure accuracy and efficiency, and improve consistency. Effect

Active Publication Date: 2021-06-22
CETC BEIJING ELECTRONICS EQUIP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of this application is to provide a wafer positioning device and method, s

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  • Wafer positioning device and method
  • Wafer positioning device and method
  • Wafer positioning device and method

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Embodiment Construction

[0043] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

[0044] The terms "first", "second" and the like in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific sequence or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances such that the embodiments of the application can be practiced in sequences other than those illustrated or described herein. In addition, "and / or" in the specification an...

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Abstract

The invention discloses a wafer positioning device and method, and relates to the technical field of semiconductor equipment, and the wafer positioning device comprises a positioning table which is used for bearing a target wafer; a plurality of first supporting components, wherein a positioning component is arranged on the first end face of each first supporting component; a driving mechanism which is connected with the multiple first supporting components; a control mechanism which is electrically connected with the driving mechanism and controls the driving mechanism to operate under the condition that the size information of the target wafer is received, wherein the driving mechanism drives the first supporting components to rotate, the positioning components move to a target position, and a space surrounded by the plurality of positioning components at the target position is matched with the size of the target wafer. According to the scheme of the invention, the consistency of the positions of the wafers for mounting is ensured, and the universality of the wafer positioning device is improved.

Description

technical field [0001] The present application relates to the technical field of semiconductor equipment, in particular to a wafer positioning device and method. Background technique [0002] In the process of semiconductor processing, the transfer process of the wafer is as follows: first, the transfer manipulator transfers the wafer from the tray to the workbench; secondly, the staff positions the wafer on the workbench by positioning with the naked eye ; Again, the loading manipulator transfers the wafer on the workbench to the assembly station. In this way, the wafer transfer efficiency of the one is low, and the wafer position consistency of the two is poor, which affects the precision and efficiency of the semiconductor process. Contents of the invention [0003] The purpose of the present application is to provide a wafer positioning device and method, so as to solve the problems of poor wafer transfer efficiency and consistency in the prior art. [0004] In order...

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Application Information

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IPC IPC(8): H01L21/68
CPCH01L21/68
Inventor 郭俊伟刘国敬王海明
Owner CETC BEIJING ELECTRONICS EQUIP
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