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Pore-filling slurry for high-temperature co-fired ceramic

A high-temperature co-fired ceramic and slurry technology, applied in the field of hole-filling slurry, can solve the problems of slurry diffusion, reduced hole-filling quality, and increased slurry viscosity, so as to improve the preparation process, improve conduction performance, and improve The effect of stability

Active Publication Date: 2021-11-09
XINNA ELECTRONICS HENGDIAN GROUP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Extrusion method is used to fill holes, the pressure is high, after multiple times of hole filling, the viscosity of the slurry increases, the difficulty of hole filling increases, the quality of hole filling decreases, and the phenomenon of slurry diffusion around the filled through holes is serious

Method used

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  • Pore-filling slurry for high-temperature co-fired ceramic
  • Pore-filling slurry for high-temperature co-fired ceramic
  • Pore-filling slurry for high-temperature co-fired ceramic

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] Organic medium formula: 40 parts of terpineol, 50 parts of butyl carbitol acetate, 5 parts of dibutyl phthalate, and 5 parts of ethyl cellulose;

[0062] Mix terpineol, butyl carbitol acetate, and dibutyl phthalate in an oil bath at 90°C in proportion, then add a certain proportion of ethyl cellulose, continue heating and stirring for 6 hours, and cool to room temperature get an organic medium;

[0063] Add 87 parts of tungsten powder (0.2-0.8 μm 5%, 1-2 μm 80%, 2-5 μm 15%), 6 parts of inorganic phase substances (alumina 96%, magnesium oxide 2.5%, calcium carbonate 1%, Silicon oxide 0.5%) and 7 parts of organic medium, ball milled at 45 Hz frequency in a planetary ball mill for 24 hours, then rolled 5 times with a three-roller mill at a distance of 15 μm, and dispersed to a fineness below 12 microns. Use the above slurry to fill 1736 small holes of φ0.2mm on the flaky ceramic material belt with a length of 110mm X110mm and a thickness of 0.254mm, and fill it once under...

Embodiment 2

[0065] Organic medium formula: 50 parts of terpineol, 40 parts of butyl carbitol acetate, 4 parts of dibutyl phthalate, 6 parts of ethyl cellulose;

[0066] Mix terpineol, butyl carbitol acetate, and dibutyl phthalate in an oil bath at 90°C in proportion, then add a certain proportion of ethyl cellulose, continue heating and stirring for 6 hours, and cool to room temperature get an organic medium;

[0067] 85 parts of tungsten powder (0.2-0.8 μm 10%, 1-2 μm 85%, 2-5 μm 5%) 6 parts of inorganic phase substances (alumina 94%, magnesium oxide 3.5%, calcium carbonate 1%, Silicon oxide 1.5%) and 9 parts of organic medium, ball milled under 40 Hz frequency of planetary ball mill for 24 hours, then rolled 4 times with a three-roller mill with a distance of 20 μm, and dispersed to a fineness below 12 microns. Use the above slurry to fill the small holes of φ0.2mm on the ceramic belt with a thickness of 0.254mm, and fill it once under a pressure of 120N, and the small holes are even a...

Embodiment 3

[0069] Organic medium formula: 42 parts of butyl carbitol, 42 parts of butyl carbitol acetate, 8 parts of butyl benzyl phthalate, 8 parts of polyvinyl butyral;

[0070] Mix butyl carbitol, butyl carbitol acetate, and butyl benzyl phthalate in an oil bath at 90°C in proportion, then add a certain proportion of polyvinyl butyral, and continue heating and stirring for 6 hours , cooled to room temperature to obtain an organic medium;

[0071] Add 81 parts of tungsten powder (0.2-0.8 μm 10%, 1-2 μm 70%, 2-5 μm 20%) 8 parts of inorganic phase substances (alumina 96%, silicon oxide 4%) and 11 parts of organic medium in proportion to the planetary ball mill, After 24 hours of ball milling in a planetary ball mill at a frequency of 40 Hz, the slurry is discharged, rolled 6 times with a three-roll mill at a distance of 30 μm, and dispersed until the fineness is below 12 μm. Use the above slurry to fill the small holes of φ0.2mm on the ceramic belt with a thickness of 0.254mm, and fill ...

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Abstract

The invention discloses a pore-filling slurry for high-temperature co-fired ceramics. The pore-filling slurry is composed of powder and an organic medium, the powder is composed of tungsten powder and inorganic phase powder, and the tungsten powder is composed of tungsten powder with different particle size ranges according to the following mass ratio: 0-10% of tungsten powder with particle size of 0.2-0.8 [mu]m; 70-90% of tungsten powder with a particle size of 1-2 [mu]m; and 0-20% of tungsten powder with a particle size of 2-5 [mu]m, wherein 0 is infinitely close to 0 but not 0, that is, the tungsten powder is formed by combining three kinds of tungsten powder with different particle sizes. The invention further provides a method for preparing the pore-filling slurry through premixing of the planetary ball mill and rolling of the three-roller grinder. The pore-filling slurry provided by the invention can be used for filling pores at one time under the low pressure of 120 N, small pores are full, the resistance value after sintering is within the range of 5-10 m omega/square, the air tightness is less than 10<-9> Pa.m<3>/S, the surface and the back face are flat, the height difference between a pore-filling part and ceramic is less than +/-15 [mu]m, and the pore-filling part is matched with the ceramic material strip, so that the problem that the shrinkage proportions of the pore-filling slurry and the ceramic material strip are inconsistent during ceramic-metal co-firing is solved.

Description

technical field [0001] The invention relates to a hole-filling slurry for high-temperature co-fired ceramic metallization. Background technique [0002] The SMD ceramic package base is a three-dimensional interconnected structure formed by stacking ceramic green sheets printed with conductive patterns and punched with electrical conduction holes in a certain order and processed by atmosphere protection sintering process. Common via hole filling methods are printing hole filling and extrusion hole filling. Extrusion method is used to fill holes, and the pressure is high. After multiple times of hole filling, the viscosity of the slurry increases, the difficulty of hole filling increases, the quality of hole filling decreases, and the phenomenon of slurry diffusion around the filled through holes is serious. Printing hole filling, the slurry properties are relatively stable, and the loss of slurry is small, but it is easy to have the phenomenon that the small holes are not fu...

Claims

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Application Information

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IPC IPC(8): C04B35/63C22C27/04B22F9/04
CPCC04B35/6303C22C27/04B22F9/04B22F2009/043
Inventor 张栎方张巍胡蝶马俊峰朱顺存
Owner XINNA ELECTRONICS HENGDIAN GROUP