Chip transfer method

A chip transfer and chip technology, applied in the manufacturing of semiconductor devices, electrical components, semiconductor/solid-state devices, etc., can solve the problems of low efficiency and time-consuming, and achieve the effect of less time-consuming and high efficiency

Active Publication Date: 2022-07-29
HCP TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the prior art, after the LED chip is manufactured, the chip on the wafer is generally transferred to the blue film, and then transferred from the blue film to the target substrate. When transferring the chip from the blue film to the target substrate, the efficiency is low and the cost is low. much time

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Embodiment Construction

[0021] In order to describe the content, structural features, achieved objects and effects of the present invention in detail, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described implementation The examples are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0022] In the manufacturing process of the LED chip, the LED chip structure is first fabricated on a growth substrate (eg, a sapphire substrate), and then cut into multiple dice to obtain a wafer including multiple LED chips. In the process of using LED chips to make LED display modules and LED lamp b...

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Abstract

The invention discloses a chip transfer method, which comprises the following steps that: an elastic film is provided, the elastic film comprises a first surface and a second surface opposite to the first surface, and at least one chip is arranged on the first surface; pulling the elastic film in a direction away from the first surface; the elastic film is loosened, the to-be-transferred chip is ejected to the target position through the elastic restoring force of the elastic film, the time spent on chip transferring is short, and the efficiency is high.

Description

technical field [0001] The invention relates to the technical field of LED chip transfer, in particular to a chip transfer method. Background technique [0002] In the prior art, after the LED chip is fabricated, the chip on the wafer is generally transferred to the blue film, and then transferred from the blue film to the target substrate. When transferring the chip from the blue film to the target substrate, the efficiency is low and the cost is high. more time. SUMMARY OF THE INVENTION [0003] The object of the present invention is to provide a chip transfer method which can improve the chip transfer efficiency. [0004] To achieve the above purpose, the present invention provides a chip transfer method, comprising: [0005] providing an elastic film, the elastic film includes a first surface and a second surface opposite to the first surface, and at least one chip is arranged on the first surface; [0006] pulling the elastic membrane away from the first face; [...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): H01L33/00H01L21/683
CPCH01L33/0093H01L33/0095H01L21/6836H01L2221/68368Y02P70/50
Inventor付小朝庄文荣
OwnerHCP TECH CO LTD