Liquid crystal display panel and electronic equipment

Abstract

The present application provides a liquid crystal display panel and an electronic device. The liquid crystal display panel includes a first substrate assembly, a liquid crystal layer, a second substrate assembly and a connecting assembly; the first substrate assembly is one of a color film substrate and an array substrate, the first substrate assembly includes a first carrier substrate and a first heating layer, and the first heating layer is arranged on the first carrier substrate; the liquid crystal layer is arranged on one side of the first substrate assembly; the second substrate assembly is the other of the color film substrate and the array substrate, the second substrate assembly is arranged on the side of the liquid crystal layer away from the first substrate assembly, the second substrate assembly includes a second carrier substrate and a second heating layer, the second heating layer is arranged on the second carrier substrate, and the second heating layer cooperates with the first heating layer to heat the liquid crystal layer; the connecting assembly includes one or a plurality of connectors arranged at intervals, and the connectors electrically connect the first heating layer and the second heating layer. When the liquid crystal display panel is displayed in a relatively low temperature environment, the display effect is still good.

Description

Technical Field

[0001] The present application relates to the field of display, and in particular to a liquid crystal display panel and an electronic device. Background Art

[0002] With the development of technology, electronic devices including liquid crystal display panels are increasingly widely used. However, when the liquid crystal display panels in the related art are used at a relatively low temperature, they are prone to display poorly or even fail to work. Summary of the invention

[0003] In a first aspect, an embodiment of the present application provides a liquid crystal display panel, the liquid crystal display panel comprising:

[0004] A first substrate assembly is one of a color filter substrate and an array substrate, wherein the first substrate assembly comprises a first carrier substrate and a first heating layer, wherein the first heating layer is disposed on the first carrier substrate;

[0005] A liquid crystal layer, disposed on one side of the first substrate assembly;

[0006] a second substrate assembly, which is the other of the color filter substrate and the array substrate, the second substrate assembly being disposed on a side of the liquid crystal layer away from the first substrate assembly, the second substrate assembly comprising a second carrier substrate and a second heating layer, the second heating layer being disposed on the second carrier substrate, and the second heating layer cooperates with the first heating layer to heat the liquid crystal layer; and

[0007] A connecting component, wherein the connecting component includes one or a plurality of connecting members arranged at intervals, and the connecting members electrically connect the first heating layer and the second heating layer.

[0008] In a second aspect, an embodiment of the present application provides an electronic device, wherein the electronic device includes the liquid crystal display panel as described in the first aspect.

[0009] In summary, in summary, the first substrate assembly of the liquid crystal display panel provided in the embodiment of the present application includes a first carrier substrate and a first heating layer, and the first heating layer is arranged on the first carrier substrate. In addition, the second substrate assembly of the liquid crystal display panel provided in the embodiment of the present application includes a second carrier substrate and a second heating layer, and the second heating layer is arranged on the second carrier substrate. The first heating layer can generate heat when energized, and the second heating layer can generate heat when energized. Therefore, the first heating layer cooperates with the second heating layer to heat other components in the liquid crystal display panel (such as the liquid crystal layer, the thin film transistor array layer located on the array substrate, etc.), so that the liquid crystal display panel can still work in a low temperature environment. In addition, the liquid crystal display panel provided in the embodiment of the present application also includes a connecting component, which includes one or a plurality of connecting parts arranged at intervals, and the connecting parts electrically connect the first heating layer and the second heating layer. Therefore, the current passed through the first heating layer can be transmitted to the second heating layer via the connecting parts, and correspondingly, the current passed through the second heating part can be transmitted to the first heating layer via the connecting parts, so that the first heating layer and the second heating layer can quickly heat the liquid crystal layer and the like in the liquid crystal display panel, and have a faster heating speed. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the implementation will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0011] Figure 1 A three-dimensional schematic diagram of a liquid crystal display panel provided in one embodiment of the present application;

[0012] Figure 2 In one embodiment of the present application Figure 1 A schematic cross-sectional view of the liquid crystal display panel along line II shown in FIG.

[0013] Figure 3 for Figure 2 An enlarged schematic diagram of a cross-sectional view of a liquid crystal display panel shown in FIG.

[0014] Figure 4 In another embodiment of the present application Figure 1 A schematic cross-sectional view of the liquid crystal display panel along line II shown in FIG.

[0015] Figure 5 for Figure 2 A schematic diagram showing detailed identification of some components in a cross section of a liquid crystal display panel shown in FIG.

[0016] Figure 6 for Figure 2 A schematic diagram of detailed identification of other parts of the cross section of the liquid crystal display panel shown in FIG.

[0017] Figure 7 for Figure 2 A schematic diagram of the detailed identification of the liquid crystal display panel shown;

[0018] Figure 8 A top view of a liquid crystal display panel provided in one embodiment of the present application;

[0019] Fig. 9 A top view of a liquid crystal display panel provided in another embodiment of the present application;

[0020] Fig.10 For this application Fig. 9 A top view of a provided liquid crystal display panel;

[0021] Fig.11 A top view of a liquid crystal display panel provided in yet another embodiment of the present application;

[0022] Fig.12 for Fig.11 A detailed schematic diagram of a portion of the structure of a liquid crystal display panel is provided;

[0023] Fig.13 A flow chart of a method for preparing a liquid crystal display panel provided in one embodiment of the present application;

[0024] Fig.14 is a flow chart of a method for preparing an array substrate in one embodiment;

[0025] Fig.15 for Fig.14 The structural schematic diagram corresponding to each step in the figure;

[0026] Fig.16 is a flow chart of a method for preparing a color film substrate in one embodiment;

[0027] Fig.17 for Fig.16 The structural schematic diagram corresponding to each step in the figure;

[0028] Fig.18 A schematic diagram of an electronic device provided in one embodiment of the present application;

[0029] Fig.19 for Fig.18 A circuit block diagram of the electronic device shown in FIG.

[0030] Description of main component numbers:

[0031] Electronic device 1, liquid crystal display panel 10, housing 30, temperature sensor 40, controller 50, heating circuit 70;

[0032] A first substrate assembly 110, a first carrier substrate 111, a first surface 111a, a second surface 111b, and a through hole 111c;

[0033] The first heating layer 112, the receiving groove 112d, the strip groove 1121, and the thin film transistor array layer 113;

[0034] Liquid crystal layer 120 , second substrate assembly 130 , second carrier substrate 131 , third surface 131 a , fourth surface 131 b , second heating layer 132 , color resist layer 133 , common electrode layer 134 ;

[0035] Connecting assembly 140, connecting member 141, first connecting group 140a, second connecting group 140b, third connecting group 140c, fourth connecting group 140d, first sub-connecting group 1411, second sub-connecting group 1412, third sub-connecting group 1413, fourth sub-connecting group 1414;

[0036] A first side 10a, a second side 10b, a third side 10c, a fourth side 10d, a first vertex P1, a second vertex P2, a third vertex P3, and a fourth vertex P4. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0038] The terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally includes steps or units that are not listed, or optionally includes other steps or units inherent to these processes, methods, products or devices.

[0039] Reference to "embodiment" or "implementation" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiment or implementation may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0040] A liquid crystal display panel 10 provided in one embodiment of the present application is introduced in detail.

[0041] Please also read Figure 1 , Figure 2 and Figure 3 , Figure 1 A three-dimensional schematic diagram of a liquid crystal display panel provided in one embodiment of the present application; Figure 2 In one embodiment of the present application Figure 1 A schematic cross-sectional view of the liquid crystal display panel along line II shown in FIG. Figure 3 for Figure 2 The enlarged schematic diagram of the cross-sectional view of the liquid crystal display panel shown in FIG. The liquid crystal display panel 10 includes a first substrate assembly 110, a liquid crystal layer 120, a second substrate assembly 130 and a connecting assembly 140. The first substrate assembly 110 is one of a color filter substrate and an array substrate. The first substrate assembly 110 includes a first carrier substrate 111 and a first heating layer 112. The first heating layer 112 is disposed on the first carrier substrate 111. The liquid crystal layer 120 is disposed on one side of the first substrate assembly 110. The second substrate assembly 130 is the other of the color filter substrate and the array substrate. The second substrate assembly 130 is disposed on the side of the liquid crystal layer 120 away from the first substrate assembly 110. The second substrate assembly 130 includes a second carrier substrate 131 and a second heating layer 132. The second heating layer 132 is disposed on the second carrier substrate 131, and the second heating layer 132 cooperates with the first heating layer 112 to heat the liquid crystal layer 120. The connection assembly 140 includes one or a plurality of connection members 141 disposed at intervals, and the connection members 141 electrically connect the first heating layer 112 and the second heating layer 132 .

[0042] In this embodiment, the first substrate assembly 110 is an array substrate and the second substrate assembly 130 is a color filter substrate. It can be understood that in other embodiments, the first substrate assembly 110 is a color filter substrate and the second substrate assembly 130 is an array substrate.

[0043] The first carrier substrate 111 is a transparent substrate. For example, the first carrier substrate 111 may be, but is not limited to, glass. The first carrier substrate 111 includes a first surface 111a and a second surface 111b disposed opposite to each other, and the second surface 111b is closer to the liquid crystal layer 120 than the first surface 111a. In other words, in the perspective of the figure, the first surface 111a is the upper surface (also called the outer surface) of the carrier substrate, and the second surface 111b is the lower surface (also called the inner surface) of the first carrier substrate 111. It can be understood that in other embodiments, as the liquid crystal display panel 10 is placed in different postures, the positions of the first surface 111a and the second surface 111b also change. The first heating layer 112 is disposed on the first carrier substrate 111, including: the first heating layer 112 is disposed on the first surface 111a of the first carrier substrate 111, or the first heating layer 112 is disposed on the second surface 111b of the first carrier substrate 111, or the first heating layer 112 is embedded in the first carrier substrate 111. The present application does not limit the position where the first heating layer 112 is disposed on the first supporting substrate 111 .

[0044] The first heating layer 112 may be, but is not limited to, a transparent metal oxide, such as indium tin oxide (ITO). The first heating layer 112 may be formed by, but is not limited to, sputtering. When the first heating layer 112 is powered on, it may generate heat for heating other components in the liquid crystal display panel 10 (such as the liquid crystal layer 120, the thin film transistor array layer 113 on the array substrate, etc.). In this way, the liquid crystal display panel 10 can also work in a low temperature environment.

[0045] The second carrier substrate 131 is a transparent substrate. For example, the second carrier substrate 131 may be, but is not limited to, glass. The second carrier substrate 131 includes a third surface 131a and a fourth surface 131b that are disposed opposite to each other, and the fourth surface 131b is away from the liquid crystal layer 120 compared to the third surface 131a. In other words, from the perspective of the figure, the third surface 131a is the upper surface (also called the inner surface) of the carrier substrate, and the fourth surface 131b is the lower surface (also called the outer surface) of the second carrier substrate 131. It can be understood that in other embodiments, as the liquid crystal display panel 10 is placed in different postures, the positions of the third surface 131a and the fourth surface 131b also change. The second heating layer 132 is disposed on the second carrier substrate 131, including: the second heating layer 132 is disposed on the third surface 131a of the second carrier substrate 131, or the second heating layer 132 is disposed on the fourth surface 131b of the second carrier substrate 131, or the second heating layer 132 is embedded in the second carrier substrate 131. The present application does not limit the position where the second heating layer 132 is disposed on the second carrier substrate 131.

[0046] The second heating layer 132 may be, but is not limited to, a transparent metal oxide, such as indium tin oxide (ITO). The second heating layer 132 may be formed by, but is not limited to, sputtering. When the second heating layer 132 is powered on, it may generate heat for heating other components in the liquid crystal display panel 10 (such as the liquid crystal layer 120, the thin film transistor array layer 113 on the array substrate, etc.). In this way, the liquid crystal display panel 10 can also work in a low temperature environment.

[0047] The connector 141 may be, but is not limited to, a conductive metal connector or a conductive non-metal connector, etc., which is not limited in this application. In this embodiment, the connector 141 is a conductive metal connector, such as a conductive gold ball (Au Ball) or a conductive gold rod, which is not limited in this application.

[0048] One end of the connector 141 of the connecting assembly 140 is electrically connected to the first heating layer 112, and the other end of the connector 141 is connected to the second heating layer 132. In this way, the connector 141 can realize the electrical connection between the first heating layer 112 and the second heating layer 132. When the first heating layer 112 is energized, the first heating layer 112 generates heat. Since the second heating layer 132 is electrically connected to the first heating layer 112 through the connector 141, the current energized by the first heating layer 112 is also transmitted to the second heating layer 132, so that the second heating layer 132 generates heat. Correspondingly, when the second heating layer 132 is energized, the second heating layer 132 generates heat. Since the second heating layer 132 is electrically connected to the first heating layer 112 through the connector 141, the current energized by the second heating layer 132 is also transmitted to the first heating layer 112, so that the first heating layer 112 generates heat. It can be seen that the liquid crystal display panel 10 provided in the embodiment of the present application includes a connecting component 140, and the connecting member 141 of the connecting component 140 electrically connects the first heating layer 112 and the second heating layer 132, so that the first heating layer 112 and the second heating layer 132 can quickly heat the liquid crystal layer 120 in the liquid crystal display panel 10, and has a faster heating speed.

[0049] In summary, the first substrate assembly 110 of the liquid crystal display panel 10 provided in the embodiment of the present application includes a first carrier substrate 111 and a first heating layer 112, and the first heating layer 112 is disposed on the first carrier substrate 111. In addition, the second substrate assembly 130 of the liquid crystal display panel 10 provided in the embodiment of the present application includes a second carrier substrate 131 and a second heating layer 132, and the second heating layer 132 is disposed on the second carrier substrate 131. The first heating layer 112 can generate heat when powered on, and the second heating layer 132 can generate heat when powered on. Therefore, the first heating layer 112 cooperates with the second heating layer 132 to heat other components in the liquid crystal display panel 10 (such as the liquid crystal layer 120, the thin film transistor array layer 113 located on the array substrate, etc.), so that the liquid crystal display panel 10 can still work in a low temperature environment. In addition, the liquid crystal display panel 10 provided in the embodiment of the present application also includes a connecting component 140, and the connecting component 140 includes one or a plurality of connecting parts 141 arranged at intervals, and the connecting parts 141 are electrically connected to the first heating layer 112 and the second heating layer 132. Therefore, the current energized by the first heating layer 112 can be transmitted to the second heating layer 132 via the connecting part 141, and correspondingly, the current energized by the second heating part can be transmitted to the first heating layer 112 via the connecting part 141, so that the first heating layer 112 and the second heating layer 132 can quickly heat the liquid crystal layer 120 and the like in the liquid crystal display panel 10, and have a faster heating speed.

[0050] Please read further Figures 1 to 3 The first carrier substrate 111 includes a first surface 111a and a second surface 111b that are disposed opposite to each other. The second surface 111b is closer to the liquid crystal layer 120 than the first surface 111a. The first carrier substrate 111 has a through hole 111c that penetrates the first surface 111a and the second surface 111b. The first heating layer 112 is disposed on the first surface 111a and is disposed corresponding to the through hole 111c. The second carrier substrate 131 includes a third surface 131a and a fourth surface 131b that are disposed opposite to each other. The fourth surface 131b is away from the liquid crystal layer 120 compared to the third surface 131a, and the second heating layer 132 is disposed on the third surface 131a. The connecting member 141 is disposed through the through hole 111c, and one end is connected to the first heating layer 112.

[0051] In this embodiment, the first surface 111a is the outer surface of the first carrier substrate 111, and the second surface 111b is the inner surface of the first carrier substrate 111. The first heating layer 112 is disposed on the first surface 111a, that is, the first heating layer 112 is disposed on the outer surface of the first carrier substrate 111, so that the first heating layer 112 can be easily prepared on the first carrier substrate 111.

[0052] In one embodiment, the through hole 111c can be prepared by laser processing. In other words, the first supporting substrate 111 can be laser-drilled to form the through hole 111c. However, the present invention is not limited thereto.

[0053] In this embodiment, the third surface 131a is the inner surface of the second carrier substrate 131, and the third surface 131a is the outer surface of the second carrier substrate 131. The second heating layer 132 is disposed on the third surface 131a, that is, the second heating layer 132 is disposed on the inner surface of the second carrier substrate 131. Thus, the second heating layer 132 is disposed on the inner surface of the second carrier substrate 131, that is, the second heating layer 132 is disposed on the surface of the second carrier substrate 131 close to the liquid crystal layer 120. Therefore, the heat generated by the second heating layer 132 can quickly heat the liquid crystal layer 120, so that the liquid crystal layer 120 heats up faster.

[0054] The liquid crystal display panel 10 provided in the embodiment of the present application, the first supporting substrate 111 has a through hole 111c passing through the first surface 111a and the second surface 111b, the connecting member 141 is inserted into the through hole 111c, and one end of the connecting member 141 is connected to the first heating layer 112. On the one hand, the connection between one end of the connecting member 141 and the first heating layer 112 can be achieved, and on the other hand, the space in the stacking direction of the first supporting substrate 111 and the second supporting substrate 131 can be fully utilized without occupying the size of the liquid crystal display panel 10 in the direction perpendicular to the stacking direction, so that the size of the liquid crystal display panel 10 is relatively compact.

[0055] For further information, please refer to Figure 3 The surface of the first heating layer 112 facing the first supporting substrate 111 has a receiving groove 112d, the receiving groove 112d is connected to the through hole 111c, and the connecting member 141 is also received in the receiving groove 112d.

[0056] In one embodiment, the through hole 111c of the first carrier substrate 111 and the receiving groove 112d of the first heating layer 112 are prepared in the same process, so that the preparation process of the through hole 111c and the receiving groove 112d can be simplified, saving the cost of the liquid crystal display panel 10. It can be understood that in other embodiments, the through hole 111c of the first carrier substrate 111 and the receiving groove 112d of the first heating layer 112 can also be prepared in different processes. As long as the receiving groove 112d is connected to the through hole 111c.

[0057] When the surface of the first heating layer 112 facing the first carrier substrate 111 has a receiving groove 112d, one end of the connecting member 141 is disposed in the through hole 111c and in the receiving groove 112d, so that the connecting member 141 and the first heating layer 112 can have a better connection effect. Specifically, in one embodiment, the end surface of the connecting member 141 facing away from the second carrier substrate 131 abuts against the bottom wall of the receiving groove 112d defined by the first heating layer 112, and the peripheral side surface of the connecting member 141 facing away from the second carrier substrate 131 also abuts against the peripheral side wall of the receiving groove 112d defined by the first heating layer 112, so that the contact area between the one end of the connecting member 141 and the first heating layer 112 is larger, so that the connecting member 141 and the first heating layer 112 have better connection reliability and better connection effect.

[0058] See also Figure 4 , Figure 4 In another embodiment of the present application Figure 1 The cross-sectional schematic diagram of the liquid crystal display panel along the II line shown in . In the present embodiment, the first heating layer 112 does not have a receiving groove. In the present embodiment, the connecting member 141 is passed through the through hole 111c, and one end is connected to the first heating layer 112. Specifically, in the present embodiment, the end face of the one end of the connecting member 141 abuts against the surface of the first heating layer 112 close to the first supporting substrate 111. In this way, the connecting member 141 can also be electrically connected to the first heating layer 112. The present application does not limit whether the first heating layer 112 has a receiving groove 112d, as long as the connecting member 141 can be electrically connected to the first heating layer 112.

[0059] See also Figure 5 , Figure 5 for Figure 2Detailed identification diagram of some components in the cross section of the liquid crystal display panel shown in FIG. In this embodiment, the thickness D1 of the first carrier substrate 111 satisfies: 0.48 mm ≤ D1 ≤ 0.52 mm. The height H1 of the connecting member 141 satisfies: 503 mm ≤ H1 ≤ 505 mm, and the width W1 of the connecting member 141 satisfies: 3 mm ≤ W1 ≤ 5 mm.

[0060] For example, the thickness D of the first carrier substrate 111 may be, but is not limited to, 0.48 mm, 0.49 mm, 0.50 mm, 0.51 mm, or 0.52 mm. Generally, the thickness D of the first carrier substrate 111 is 0.50 mm. Due to the manufacturing tolerance of the first carrier substrate 111, the maximum thickness of the first carrier substrate 111 may fluctuate on the basis of 0.50 mm.

[0061] The height H1 of the connector 141 may be, but is not limited to, 503 mm, 503.5 mm, 504 mm, 504.5 mm, or 505 mm. When the height of the connector 141 is too small, it is possible that the connector 141 is poorly connected to the first heating layer 112, and it is also possible that the connector 141 is poorly connected to the second heating layer 132; when the height of the connector 141 is too large, the overall thickness of the liquid crystal display panel 10 is relatively large. In this embodiment, the height H1 of the connector 141 satisfies: 503 mm ≤ H1 ≤ 505 mm, which, on the one hand, allows the connector 141 to have better connection performance with the first heating layer 112, and also allows the connector 141 to have better connection performance with the second heating layer 132; on the other hand, it also allows the thickness of the liquid crystal display panel 10 to be relatively small, which is conducive to achieving the thinning of the liquid crystal display panel 10.

[0062] The width W1 of the connector 141 may be, but is not limited to, 3 mm, 3.5 mm, 4.0 mm, 4.5 mm, or 5.0 mm. When the width of the connector 141 is too small, it is possible that the connection with the first heating layer 112 is poor, and it is possible that the connection with the second heating layer 132 is poor; when the width of the connector 141 is too large, the area of ​​the non-display area of ​​the liquid crystal display panel 10 is large, so that the screen-to-body ratio of the liquid crystal display panel 10 is small. In this embodiment, the width W1 of the connector 141 satisfies: 3mm≤W1≤5mm, on the one hand, the connection effect between the connector 141 and the first heating layer 112 is better, and the connection effect between the connector 141 and the second heating layer 132 is better; on the other hand, the area of ​​the non-display area of ​​the liquid crystal display panel is smaller, so that the liquid crystal display panel 10 has a higher screen-to-body ratio.

[0063] See also Figure 6, Figure 6 for Figure 2 Detailed identification diagram of other parts of the cross section of the liquid crystal display panel shown in FIG. In this embodiment, the thickness D2 of the first heating layer 112 satisfies: 1500 angstroms ≤ D2 ≤ 3000 angstroms. The depth H2 of the receiving groove 112d satisfies: 200 angstroms ≤ H2 ≤ 300 angstroms.

[0064] The thickness D2 of the first heating layer 112 may be, but is not limited to, 1500 angstroms, or 1600 angstroms, or 1700 angstroms, or 1800 angstroms, or 1900 angstroms, or 2000 angstroms, or 2100 angstroms, or 2200 angstroms, or 2300 angstroms, or 2400 angstroms, or 2500 angstroms, or 2600 angstroms, or 2700 angstroms, or 2800 angstroms, or 2900 angstroms, or 3000 angstroms.

[0065] When the thickness D2 of the first heating layer 112 is small, due to the preparation tolerance of the first heating layer 112 and other reasons, some parts of the first heating layer 112 may have poor connection, resulting in poor heating effect. When the thickness D2 of the first heating layer 112 is large, the preparation time and material cost of the first heating layer 112 are high. The thickness D2 of the first heating layer 112 of the liquid crystal display panel 10 provided in the embodiment of the present application satisfies: 1500 angstroms ≤ D2 ≤ 3000 angstroms. On the one hand, the connection performance of each part of the first heating layer 112 is better, so that the first heating layer 112 has a better heating effect; on the other hand, the preparation time and material cost of the first heating layer 112 can be relatively small.

[0066] The depth H2 of the receiving groove 112d may be, but is not limited to, 200 angstroms, or 210 angstroms, or 220 angstroms, or 230 angstroms, or 240 angstroms, or 250 angstroms, or 260 angstroms, or 270 angstroms, or 280 angstroms, or 290 angstroms, or 300 angstroms.

[0067] When the depth of the receiving groove 112d is small, the contact area between the outer peripheral side surface of the connecting member 141 and the peripheral side wall of the first heating layer 112 defining the receiving groove 112d is small, so the connection performance between the connecting member 141 and the first heating layer 112 may be poor. When the depth of the receiving groove 112d is large, it is possible to penetrate the first heating layer 112, so that the connection effect of each part of the first heating layer 112 is poor, thereby affecting the heating effect of the first heating layer 112. In the liquid crystal display panel 10 provided in the embodiment of the present application, the thickness D2 of the first heating layer 112 satisfies: 1500 angstroms ≤ D2 ≤ 3000 angstroms; and the depth H2 of the receiving groove 112d satisfies: 200 angstroms ≤ H2 ≤ 300 angstroms; on the one hand, the connecting member 141 and the first heating layer 112 have better connection performance; on the other hand, the connection performance of each part of the first heating layer 112 is good, thereby making the first heating layer 112 have better heating effect.

[0068] See also Figure 7 , Figure 7 for Figure 2 Detailed identification diagram of the liquid crystal display panel shown. In this embodiment, the first substrate assembly 110 further includes a thin film transistor array layer 113. The thin film transistor array layer 113 is disposed on the second surface 111b, and the thin film transistor array layer 113 is spaced apart from the connecting assembly 140. The second substrate assembly 130 further includes a color resist layer 133 and a common electrode layer 134. The color resist layer 133 is disposed on the side of the second heating layer 132 away from the second carrier substrate 131. The common electrode layer 134 is disposed on the surface of the color resist layer 133 away from the second carrier substrate 131, and the common electrode layer 134 is spaced apart from the connecting assembly 140.

[0069] The thin film transistor array layer 113 is a functional film layer that realizes the functions of the array substrate. For example, the thin film transistor array includes scan lines, data lines, pixel electrodes, and a plurality of thin film transistors distributed in an array.

[0070] As can be seen from the above description, the first heating layer 112 is disposed on the first surface 111a of the first carrier substrate 111, and the thin film transistor array layer 113 is disposed on the second surface 111b of the first carrier substrate 111. In other words, the thin film transistor array layer 113 and the first heating layer 112 are disposed on two opposite surfaces of the first carrier substrate 111. Therefore, the first heating layer 112 is far away from the thin film transistor array layer 113, which can reduce the interference of the first heating layer 112 to the scanning lines, data lines, pixel electrodes, and thin film transistors in the thin film transistor array layer 113 when the first heating layer 112 needs to be heated and powered on, and can further improve the display performance of the liquid crystal display panel 10.

[0071] The material of the common electrode layer 134 may be, but is not limited to, indium tin oxide (ITO). The common electrode layer 134 cooperates with the pixel electrode in the array layer of the thin film transistor to control the steering of the liquid crystal molecules in the liquid crystal layer 120 .

[0072] As can be seen from the above description, the second heating layer 132 is disposed on the second surface 111b of the second carrier substrate 131. Further, in this embodiment, the color resist layer 133 is disposed on the side of the second heating layer 132 away from the second carrier substrate 131, and the common electrode layer 134 is disposed on the surface of the color resist layer 133 away from the second carrier substrate 131. Therefore, the second heating layer 132 and the common electrode layer 134 are respectively disposed on the opposite sides of the color resist layer 133. The arrangement of the second heating layer 132, the common electrode layer 134 and the color resist layer 133 can also make the relative distance between the second heating layer 132 and the common electrode layer 134 relatively far, which can reduce the interference of the second heating layer 132 on the common electrode layer 134 when it needs to be heated and powered on, and can further improve the display performance of the liquid crystal display panel 10.

[0073] In combination with the liquid crystal display panel 10 described in the above embodiments, various embodiments of the connection component 140 in the liquid crystal display panel 10 are described below. The following description of various embodiments of the connection component 140 in the liquid crystal display panel 10 is illustrated by taking the first heating layer 112 including the receiving groove 112d as an example. It can be understood that various embodiments of the connection component 140 in the liquid crystal display panel 10 can also be combined with the embodiment in which the first heating layer 112 does not include the receiving groove 112d.

[0074] Please also read Figure 2 , Figure 8 , Figure 8A top view of a liquid crystal display panel provided in one embodiment of the present application. In this embodiment, the liquid crystal display panel 10 includes a first side 10a and a second side 10b disposed opposite to each other. The connection assembly 140 includes a first connection group 140a and a second connection group 140b. The first connection group 140a includes a plurality of connection members 141, and the first connection group 140a is disposed corresponding to the first side 10a. The second connection group 140b includes a plurality of connection members 141, and the second connection group 140b is disposed corresponding to the second side 10b.

[0075] In this embodiment, the first side 10a is the left side of the liquid crystal display panel 10, and the second side 10b is the right side of the liquid crystal display panel 10. It can be understood that in other embodiments, as the placement posture of the liquid crystal display panel 10 is different, the positions of the first side 10a and the second side 10b also change.

[0076] In this embodiment, the first connection group 140a is set corresponding to the first edge 10a, and the second connection group 140b is set corresponding to the second edge 10b. The connecting member 141 of the first connection group 140a connects the first heating layer 112 and the second heating layer 132, and the connecting member 141 of the second connection group 140b connects the first heating layer 112 and the second heating layer 132, so that the connection performance between the first heating layer 112 and the second heating layer 132 is better, so that the first heating layer 112 and the second heating layer 132 can quickly heat the liquid crystal layer 120 in the liquid crystal display panel 10, and have a faster heating speed, so that the liquid crystal display panel 10 still has a good display effect when displaying in a low temperature environment.

[0077] Please also read Figure 2 and Fig. 9 , Fig. 9 A top view of a liquid crystal display panel provided in another embodiment of the present application. In this embodiment, in this embodiment, the liquid crystal display panel 10 includes a first side 10a and a second side 10b that are arranged opposite to each other. The connecting component 140 includes a first connecting group 140a and a second connecting group 140b. The first connecting group 140a includes a plurality of connecting members 141, and the first connecting group 140a is arranged corresponding to the first side 10a. The second connecting group 140b includes a plurality of connecting members 141, and the second connecting group 140b is arranged corresponding to the second side 10b.

[0078] In addition, the liquid crystal display panel 10 further includes a third side 10c and a fourth side 10d which are arranged opposite to each other. The third side 10c is connected to the first side 10a and the second side 10b by bending, respectively, and the fourth side 10d is connected to the first side 10a and the second side 10b by bending. The connecting assembly 140 further includes a third connecting group 140c and a fourth connecting group 140d. The third connecting group 140c includes a plurality of connecting members 141, and the third connecting group 140c is arranged corresponding to the third side 10c. The fourth connecting group 140d includes a plurality of connecting members 141, and the fourth connecting group 140d is arranged corresponding to the fourth side 10d.

[0079] In this embodiment, the first side 10a is the left side of the liquid crystal display panel 10, the second side 10b is the right side of the liquid crystal display panel 10, the third side 10c is the top side of the liquid crystal display panel 10, and the fourth side 10d is the bottom side of the liquid crystal display panel 10. It can be understood that in other embodiments, as the placement posture of the liquid crystal display panel 10 is different, the positions of the first side 10a, the second side 10b, the third side 10c and the fourth side 10d also change.

[0080] In this embodiment, the first connection group 140a is arranged corresponding to the first edge 10a, the second connection group 140b is arranged corresponding to the second edge 10b, the third connection group 140c is arranged corresponding to the third edge 10c, and the fourth connection group 140d is arranged corresponding to the fourth edge 10d. The connection piece 141 of the first connection group 140a connects the first heating layer 112 and the second heating layer 132, the connection piece 141 of the second connection group 140b connects the first heating layer 112 and the second heating layer 132, and the connection piece 141 of the third connection group 140c is connected to the first heating layer 112 and the second heating layer 132. The connector 141 connects the first heating layer 112 and the second heating layer 132, and the connector 141 of the fourth connection group 140d connects the first heating layer 112 and the second heating layer 132, so that the connection performance between the first heating layer 112 and the second heating layer 132 is better, so that the first heating layer 112 and the second heating layer 132 can quickly heat the liquid crystal layer 120 in the liquid crystal display panel 10, and have a faster heating speed, so that the liquid crystal display panel 10 still has a good display effect when displaying in a low temperature environment.

[0081] For further information, see Figure 2 and Figure 3 , Figure 8 and Fig. 9, the receiving grooves 112d corresponding to the connecting members 141 of each connecting group of the first connecting group 140a, the second connecting group 140b, the third connecting group 140c and the fourth connecting group 140d are connected to form a strip groove 1121. In this way, on the one hand, the processing of the strip groove 1121 can be facilitated, and on the other hand, the connection between the connecting member 141 and the first heating layer 112 can be prevented from being poorly connected due to tolerances in the preparation of the connecting member 141.

[0082] For further information, see Fig.10 , Fig.10 For this application Fig. 9 A top view of a liquid crystal display panel is provided. When the connection assembly 140 includes a first connection group 140a and a second connection group 140b, for the connector 141 of the same connection group in the first connection group 140a and the second connection group 140b: the dimension L1 of the connector 141 at one end of the strip groove 1121 protruding from the outermost edge satisfies: 3mm≤L1≤5mm. For example, L1 may be but is not limited to 3mm, or 3.5mm, or 4.0mm, or 4.5mm, or 5.0mm. For the connector 141 of the same connection group: the dimension L1 of the connector 141 at one end of the strip groove 1121 protruding from the outermost edge satisfies: 3mm≤L1≤5mm, which can facilitate the processing of the strip groove 1121 on the one hand, and avoid the poor connection between the connector 141 and the first heating layer 112 due to the tolerance in the preparation of the connector 141 and other reasons.

[0083] Further, when the connection assembly 140 includes a first connection group 140a and a second connection group 140b, for the connection member 141 of the same connection group: the dimension L2 of the connection member 141 at the other end of the strip groove 1121 protruding from the outermost edge satisfies: 3mm≤L2≤5mm. For example, L2 may be, but is not limited to, 3mm, or 3.5mm, or 4.0mm, or 4.5mm, or 5.0mm. For the connection member 141 of the same connection group: the dimension L2 of the connection member 141 at the other end of the strip groove 1121 protruding from the outermost edge satisfies: 3mm≤L2≤5mm. On the one hand, it can be more convenient to process the strip groove 1121, and on the other hand, it can avoid the poor connection between the connection member 141 and the first heating layer 112 due to the tolerance in the preparation of the connection member 141.

[0084] Further, when the connection assembly 140 includes the third connection group 140c and the fourth connection group 140d, for the connector 141 of the same connection group in the third connection group 140c and the fourth connection group 140d: the dimension L2 of the connector 141 where one end of the strip groove 1121 protrudes from the edge satisfies: 3mm≤L2≤5mm. For example, L2 may be, but is not limited to, 3mm, or 3.5mm, or 4.0mm, or 4.5mm, or 5.0mm. For the connector 141 of the same connection group: the dimension L2 of the connector 141 where one end of the strip groove 1121 protrudes from the edge satisfies: 3mm≤L2≤5mm, which can facilitate the processing of the strip groove 1121 on the one hand, and avoid the poor connection between the connector 141 and the first heating layer 112 due to the tolerance of the preparation of the connector 141 and other reasons.

[0085] Further, when the connection assembly 140 includes the third connection group 140c and the fourth connection group 140d, for the connector 141 of the same connection group: the dimension L2 of the connector 141 at the other end of the strip groove 1121 protruding from the outermost edge satisfies: 3mm≤L2≤5mm. For example, L2 can be but is not limited to 3mm, or 3.5mm, or 4.0mm, or 4.5mm, or 5.0mm. For the connector 141 of the same connection group: the dimension L2 of the connector 141 at the other end of the strip groove 1121 protruding from the outermost edge satisfies: 3mm≤L2≤5mm. On the one hand, it can be more convenient to process the strip groove 1121, and on the other hand, it can avoid the poor connection between the connector 141 and the first heating layer 112 due to the tolerance in the preparation of the connector 141.

[0086] Please combine Figure 2 , Figure 3 and Fig.11 , Fig.11A top view of a liquid crystal display panel provided for another embodiment of the present application. In this embodiment, the liquid crystal display panel 10 includes a first side 10a and a second side 10b disposed opposite to each other, and a third side 10c and a fourth side 10d disposed opposite to each other. The third side 10c is connected to the first side 10a and the second side 10b by bending, respectively, and the fourth side 10d is connected to the first side 10a and the second side 10b by bending. The connecting assembly 140 includes a first connecting group 140a, a second connecting group 140b, a third connecting group 140c and a fourth connecting group 140d. The first connecting group 140a includes a plurality of connecting members 141, and the first connecting group 140a is arranged corresponding to the junction between the first side 10a and the third side 10c. The second connecting group 140b includes a plurality of connecting members 141, and the second connecting group 140b is arranged corresponding to the junction between the second side 10b and the third side 10c. The third connection group 140c includes a plurality of connection members 141, and the third connection group 140c is arranged corresponding to the junction between the second side 10b and the fourth side 10d. The fourth connection group 140d includes a plurality of connection members 141, and the fourth connection group 140d is arranged corresponding to the junction between the first side 10a and the fourth side 10d.

[0087] In this embodiment, the first side 10a is the left side of the liquid crystal display panel 10, the second side 10b is the right side of the liquid crystal display panel 10, the third side 10c is the top side of the liquid crystal display panel 10, and the fourth side 10d is the bottom side of the liquid crystal display panel 10. It can be understood that in other embodiments, as the placement posture of the liquid crystal display panel 10 is different, the positions of the first side 10a, the second side 10b, the third side 10c and the fourth side 10d also change.

[0088] In the schematic diagram of the present embodiment, the first connection group 140a is located at the upper left corner of the liquid crystal display panel 10, the second connection group 140b is located at the upper right corner of the liquid crystal display panel 10, the third connection group 140c is located at the lower right corner of the liquid crystal display panel 10, and the fourth connection group 140d is located at the lower left corner of the liquid crystal display panel 10. It can be understood that in other embodiments, as the placement posture of the liquid crystal display panel 10 is different, the positions of the first connection group 140a, the second connection group 140b, the third connection group 140c and the fourth connection group 140d also change.

[0089] In this embodiment, the first heating layer 112 and the second heating layer 132 are connected by the first connection group 140a, the second connection group 140b, the third connection group 140c and the fourth connection group 140d, so that the connection performance between the first heating layer 112 and the second heating layer 132 is better, so that the first heating layer 112 and the second heating layer 132 can quickly heat the liquid crystal layer 120 in the liquid crystal display panel 10, and have a faster heating speed, so that the liquid crystal display panel 10 still has a good display effect when displaying in a low temperature environment.

[0090] Further, in this embodiment, the intersection point of the first side 10a and the third side 10c is the first vertex P1. The first connection group 140a includes a plurality of (3 in the figure) first sub-connection groups 1411 arranged at intervals in a direction away from the first vertex P1; and the number of connectors 141 in the first sub-connection group 1411 gradually increases in a direction away from the first vertex P1. In this way, the electrical connection performance of the first heating layer 112 and the second heating layer 132 at the junction of the first side 10a and the third side 10c can be further improved.

[0091] Further, in this embodiment, the intersection point of the second side 10b and the third side 10c is the second vertex P2. The second connection group 140b includes a plurality of second sub-connection groups 1412 arranged at intervals in a direction away from the second vertex P2; and the number of connectors 141 in the second sub-connection group 1412 gradually increases in the direction away from the second vertex P2. In this way, the electrical connection performance of the first heating layer 112 and the second heating layer 132 at the intersection of the second side 10b and the third side 10c can be further improved.

[0092] Further, in this embodiment, the intersection point of the second side 10b and the fourth side 10d is the third vertex P3. The third connection group 140c includes a plurality of third sub-connection groups 1413 arranged at intervals in a direction away from the third vertex P3; and the number of connectors 141 in the third sub-connection group 1413 gradually increases in the direction away from the third vertex P3. In this way, the electrical connection performance of the first heating layer 112 and the second heating layer 132 at the intersection of the second side 10b and the fourth side 10d can be further improved.

[0093] Further, in this embodiment, the intersection point of the first side 10a and the fourth side 10d is the fourth vertex P4. The fourth connection group 140d includes a plurality of fourth sub-connection groups 1414 arranged at intervals in a direction away from the fourth vertex P4; and the number of connectors 141 in the fourth sub-connection group 1414 gradually increases in the direction away from the fourth vertex P4. In this way, the electrical connection performance of the first heating layer 112 and the second heating layer 132 at the intersection of the first side 10a and the fourth side 10d can be further improved.

[0094] It can be understood that in other embodiments, the connection component 140 may satisfy one or more of the first sub-connection group 1411, the second sub-connection group 1412, the third sub-connection group 1413 and the fourth sub-connection group 1414, and does not necessarily have to include all of the first sub-connection group 1411, the second sub-connection group 1412, the third sub-connection group 1413 and the fourth sub-connection group 1414.

[0095] See also Fig.12 , Fig.12 for Fig.11 A detailed schematic diagram of a partial structure of a liquid crystal display panel is provided. Furthermore, when the connection assembly 140 includes a first connection group 140a and a second connection group 140b, for the connector 141 of the same connection group: the dimension L1 of the connector 141 at the other end of the strip groove 1121 protruding from the edge satisfies: 3mm≤L1≤5mm. For example, L1 may be, but is not limited to, 3mm, or 3.5mm, or 4.0mm, or 4.5mm, or 5.0mm. For the connector 141 of the same connection group: the dimension L1 of the connector 141 at the other end of the strip groove 1121 protruding from the edge satisfies: 3mm≤L1≤5mm, which can facilitate the processing of the strip groove 1121 on the one hand, and avoid poor connection between the connector 141 and the first heating layer 112 due to tolerance in the preparation of the connector 141 and other reasons.

[0096] Further, when the connection assembly 140 includes the third connection group 140c and the fourth connection group 140d, for the connector 141 of the same connection group in the third connection group 140c and the fourth connection group 140d: the dimension L2 of the connector 141 where one end of the strip groove 1121 protrudes from the edge satisfies: 3mm≤L2≤5mm. For example, L2 may be, but is not limited to, 3mm, or 3.5mm, or 4.0mm, or 4.5mm, or 5.0mm. For the connector 141 of the same connection group: the dimension L2 of the connector 141 where one end of the strip groove 1121 protrudes from the edge satisfies: 3mm≤L2≤5mm, which can facilitate the processing of the strip groove 1121 on the one hand, and avoid the poor connection between the connector 141 and the first heating layer 112 due to the tolerance of the preparation of the connector 141 and other reasons.

[0097] Further, when the connection assembly 140 includes the third connection group 140c and the fourth connection group 140d, for the connector 141 of the same connection group: the dimension L2 of the connector 141 at the other end of the strip groove 1121 protruding from the outermost edge satisfies: 3mm≤L2≤5mm. For example, L2 can be but is not limited to 3mm, or 3.5mm, or 4.0mm, or 4.5mm, or 5.0mm. For the connector 141 of the same connection group: the dimension L2 of the connector 141 at the other end of the strip groove 1121 protruding from the outermost edge satisfies: 3mm≤L2≤5mm. On the one hand, it can be more convenient to process the strip groove 1121, and on the other hand, it can avoid the poor connection between the connector 141 and the first heating layer 112 due to the tolerance in the preparation of the connector 141.

[0098] The following is an introduction to a method for preparing a liquid crystal display panel 10 provided in one embodiment of the present application. Fig.13 , Fig.13 The flowchart of the method for preparing a liquid crystal display panel provided in one embodiment of the present application. The method for preparing the liquid crystal display panel 10 includes S100, S200 and S300. S100, S200 and S300 are described in detail as follows.

[0099] S100, preparing an array substrate.

[0100] S200, preparing a color film substrate.

[0101] S300 , assembling the array substrate and the color filter substrate into a cell pair, and injecting liquid crystal to form a liquid crystal layer 120 .

[0102] It is understandable that there is no necessary order requirement for S100 and S200. In one embodiment, S100 precedes S200; in another embodiment, S200 precedes S100; in yet another embodiment, S100 and S200 are performed simultaneously. The present application does not limit the order of S100 and S200.

[0103] In the box-forming process in S300 , a glue frame and polyimide (PI) may be coated on the periphery of the array substrate and the color filter substrate, and liquid crystal may be poured into the periphery to form a liquid crystal layer 120 .

[0104] In this embodiment, the first substrate assembly 110 is an array substrate, and the second substrate assembly 130 is a color filter substrate.

[0105] Please also read Fig.14 and Fig.15 , Fig.14 is a flow chart of a method for preparing an array substrate in one embodiment; Fig.15 for Fig.14 The structural schematic diagram corresponding to each step in the array substrate (Array) preparation method includes S110 and S120, and S110 and S120 are described in detail as follows.

[0106] S110 , preparing a thin film transistor array layer 113 on the second surface 111 b of the first carrier substrate 111 .

[0107] S120 , turning over the first carrier substrate 111 , preparing a first heating layer 112 on the first surface 111 a of the first carrier substrate 111 , wherein the first carrier substrate 111 has a through hole 111 c corresponding to the first heating layer 112 .

[0108] Please refer to the structure after S110 Fig.15 (a); in S120, the structure of preparing the first heating layer 112 on the first surface 111a of the first carrier substrate 111 is shown in Fig.15 (b) in S120, further, the structure of forming the through hole 111c is shown in Fig.15 (c) in. Fig.15 In (c), a receiving groove 112d is formed on the first heating layer 112 as an example for illustration, wherein the receiving groove 112d is connected to the through hole 111c. The first heating layer 112 may be, but is not limited to, indium tin oxide (ITO). The method for preparing the first heating layer 112 on the first surface 111a of the first carrier substrate 111 may be, but is not limited to, sputtering the first heating layer 112 on the first surface 111a of the first carrier substrate 111.

[0109] In one embodiment, the through hole 111c of the first carrier substrate 111 is realized by laser drilling. In order to ensure that the first carrier substrate 111 is punched through and contacts the first heating layer 112 during drilling, a small portion of the film thickness of the first heating layer 112 is consumed, and therefore, the thickness of the first heating layer 112 is slightly thicker. In one embodiment, the thickness of the first heating layer 112 is greater than the thickness of the second heating layer 132. In this embodiment, the thickness of the first heating layer 112 is D2, which satisfies: 1500 angstroms ≤ D2 ≤ 3000 angstroms. The above range of the thickness D2 of the first heating layer 112 can ensure that the first heating layer 112 is not punched through.

[0110] Next, the preparation process of the color film substrate is introduced in detail.

[0111] Please also read Fig.16 and Fig.17 , Fig.16 is a flow chart of a method for preparing a color film substrate in one embodiment; Fig.17 for Fig.16 The preparation process of the color film substrate includes S210, S220, and S230, and S210, S220, and S230 are described in detail as follows.

[0112] S210 , preparing a second heating layer 132 on the third surface 131 a of the second supporting substrate 131 .

[0113] S220 , preparing a color resist layer 133 on a side of the second heating layer 132 facing away from the second supporting substrate 131 .

[0114] The method for preparing the color resist layer 133 may be, but is not limited to, preparing by a yellow light process.

[0115] S230 , forming a common electrode layer 134 on a side of the color resist layer 133 away from the second carrier substrate 131 .

[0116] Please refer to the structure after S210 Fig.17 (a) in the figure; for the structure after S220, please refer to Fig.17 (b) in the figure; for the structure after S230, please refer to Fig.17 (c) in the embodiment. In this embodiment, the common electrode layer 134 may be but not limited to indium tin oxide (ITO). The common electrode layer 134 may be but not limited to being obtained by sputtering, exposure and development. In one embodiment, the area of ​​the common electrode layer 134 is smaller than the area of ​​the second heating layer 132, and the second heating layer 132 is partially exposed and contacts the connector 141 of the connecting component 140 with its edge.

[0117] See also Fig.18 , Fig.18 Schematic diagram of an electronic device provided in one embodiment of the present application. The present application also provides an electronic device 1. The electronic device 1 may be, but is not limited to, a television, a mobile phone, a desktop computer, a laptop computer, etc. The present application does not limit the type of the electronic device 1. The electronic device 1 includes a liquid crystal display panel 10, and the liquid crystal display panel 10 can refer to the previous description and will not be repeated here.

[0118] The first substrate assembly 110 of the liquid crystal display panel 10 of the electronic device 1 provided in the embodiment of the present application includes a first carrier substrate 111 and a first heating layer 112, and the first heating layer 112 is arranged on the first carrier substrate 111. In addition, the second substrate assembly 130 of the liquid crystal display panel 10 provided in the embodiment of the present application includes a second carrier substrate 131 and a second heating layer 132, and the second heating layer 132 is arranged on the second carrier substrate 131. The first heating layer 112 can generate heat when powered on, and the second heating layer 132 can generate heat when powered on. Therefore, the first heating layer 112 cooperates with the second heating layer 132 to heat other components in the liquid crystal display panel 10 (such as the liquid crystal layer 120, the thin film transistor array layer 113 located on the array substrate, etc.), so that the liquid crystal display panel 10 can still work in a low temperature environment. In addition, the liquid crystal display panel 10 provided in the embodiment of the present application also includes a connecting component 140, and the connecting component 140 includes one or a plurality of connecting parts 141 arranged at intervals, and the connecting parts 141 electrically connect the first heating layer 112 and the second heating layer 132. Therefore, the current flowing through the first heating layer 112 can be transmitted to the second heating layer 132 via the connecting part 141, and correspondingly, the current flowing through the second heating layer 132 can be transmitted to the first heating layer 112 via the connecting part 141, so that the first heating layer 112 and the second heating layer 132 can quickly heat the liquid crystal layer 120 and the like in the liquid crystal display panel 10, thereby improving the heating speed.

[0119] In one embodiment, the electronic device 1 further includes a housing 30, and the housing 30 is used to carry the liquid crystal display panel 10. It is understandable that in other embodiments, the electronic device 1 may not include the housing 30. The embodiments of the present application do not limit whether the electronic device 1 includes the housing 30.

[0120] See also Fig.19 , Fig.19 for Fig.18The electronic device 1 further includes a temperature sensor 40, a controller 50 and a heating circuit 70. The temperature sensor 40 is used to detect the ambient temperature of the liquid crystal display panel 10. The controller 50 is electrically connected to the temperature sensor 40, and is used to control the heating circuit 70 to energize at least one of the first heating layer 112 and the second heating layer 132 when the ambient temperature of the liquid crystal display panel 10 is less than or equal to the preset temperature. When the ambient temperature of the liquid crystal display panel 10 is less than or equal to the preset temperature, it indicates that the liquid crystal display panel 10 is at a relatively low temperature. For example, the preset temperature may be, but is not limited to, -20°C, or -10°C, etc. When the ambient temperature of the liquid crystal display panel 10 is less than or equal to the preset temperature, if the heating circuit 70 does not heat at least one of the first heating layer 112 and the second heating layer 132, the liquid crystal display panel 10 displays poorly. In the electronic device 1 provided in the embodiment of the present application, the controller 50 is used to control the heating circuit 70 to energize at least one of the first heating layer 112 and the second heating layer 132 when the ambient temperature of the liquid crystal display panel 10 is less than or equal to the preset temperature, so that when the ambient temperature of the liquid crystal display panel 10 is less than or equal to the preset temperature, it can still have a good display effect. Correspondingly, when the controller 50 is also used to disconnect the conductive path of the heating circuit 70 to at least one of the first heating layer 112 and the second heating layer 132 when the ambient temperature of the liquid crystal display panel 10 is greater than the preset temperature.

[0121] It should be noted that the examples and descriptions of the types of electronic devices 1 described above are merely introductions to one application scenario of the liquid crystal display panel 10 and should not be construed as limitations on the liquid crystal display panel 10 provided in the embodiments of the present application.

[0122] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present application, and these improvements and modifications are also regarded as the scope of protection of the present application.

Claims

1. A liquid crystal display panel, characterized in that: The liquid crystal display panel comprises: A first substrate assembly, the first substrate assembly comprising a first carrier substrate, a thin film transistor array layer and a first heating layer, the first carrier substrate comprising a first surface and a second surface disposed opposite to each other, the thin film transistor array layer being disposed on the second surface, the first carrier substrate having a through hole penetrating the first surface and the second surface, the first heating layer being disposed on the first surface and corresponding to the through hole; A liquid crystal layer is disposed on one side of the first substrate assembly, and the second surface is closer to the liquid crystal layer than the first surface; a second substrate assembly, the second substrate assembly is arranged on a side of the liquid crystal layer away from the first substrate assembly, the second substrate assembly comprises a second carrier substrate, a second heating layer, a color resist layer and a common electrode layer, the second carrier substrate comprises a third surface and a fourth surface arranged opposite to each other, the fourth surface is away from the liquid crystal layer compared to the third surface, the second heating layer is arranged on the third surface of the second carrier substrate, the color resist layer is arranged on a side of the second heating layer away from the second carrier substrate, and the second heating layer cooperates with the first heating layer to heat the liquid crystal layer; and A connecting component, wherein the thin film transistor array layer and the connecting component are spaced apart, the common electrode layer and the connecting component are spaced apart, the connecting component comprises one or a plurality of connecting members spaced apart, the connecting member is passed through the through hole and electrically connects the first heating layer and the second heating layer; Wherein, a surface of the first heating layer facing the first supporting substrate has a receiving groove, the receiving groove is connected to the through hole, and the connecting member is also received in the receiving groove.

2. The liquid crystal display panel according to claim 1, wherein: The thickness D1 of the first carrier substrate satisfies: 0.48 mm ≤ D1 ≤ 0.52 mm; The height H1 of the connecting member satisfies: 503 mm ≤ H1 ≤ 505 mm, and the width W1 of the connecting member satisfies: 3 mm ≤ W1 ≤ 5 mm.

3. The liquid crystal display panel according to claim 1, wherein: The thickness D2 of the first heating layer satisfies: 1500 angstroms ≤ D2 ≤ 3000 angstroms; The depth H2 of the receiving groove satisfies: 200 angstroms ≤ H2 ≤ 300 angstroms.

4. The liquid crystal display panel according to any one of claims 1 to 3, characterized in that: The liquid crystal display panel includes a first side and a second side that are arranged opposite to each other, and the connecting component includes: A first connection group, the first connection group includes a plurality of connection members, and the first connection group is arranged corresponding to the first side; and The second connection group includes a plurality of connection members, and the second connection group is arranged corresponding to the second side.

5. The liquid crystal display panel according to claim 4, wherein: The liquid crystal display panel further includes a third side and a fourth side disposed opposite to each other, the third side is connected to the first side and the second side by bending, respectively, and the fourth side is connected to the first side and the second side by bending, respectively, and the connecting component further includes: A third connection group, the third connection group includes a plurality of connection members, and the third connection group is arranged corresponding to the third side; and A fourth connection group, the fourth connection group includes a plurality of connection members, and the fourth connection group is arranged corresponding to the fourth side.

6. The liquid crystal display panel according to any one of claims 1 to 3, characterized in that: The liquid crystal display panel includes a first side and a second side disposed opposite to each other, and a third side and a fourth side disposed opposite to each other, the third side is connected to the first side and the second side by bending, respectively, and the fourth side is connected to the first side and the second side by bending, respectively, and the connecting component includes: A first connection group, wherein the first connection component includes a plurality of connection members, and the first connection component is arranged corresponding to the junction between the first side and the third side; a second connection group, wherein the first connection assembly includes a plurality of connection members, and the second connection assembly is arranged corresponding to the junction between the second side and the third side; A third connection group, wherein the first connection component includes a plurality of connection members, and the third connection component is arranged corresponding to the junction between the second side and the fourth side; and The fourth connection group, the first connection component includes a plurality of connection members, and the fourth connection component is arranged corresponding to the junction between the first side and the fourth side.

7. An electronic device, characterized in that: Comprising a liquid crystal display panel as described in any one of claims 1-6.

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